Using a vapour or mist

Industry

CPC
H05K2203/088

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/088Using a vapour or mist

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil with carrier
- Patent number 11,765,840
- Issue date Sep 19, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mixing dimers for moisture resistant materials
- Patent number 10,743,421
- Issue date Aug 11, 2020
- Yang Yun
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for creating patterned coatings on a molded article, and dev...
- Patent number 10,645,814
- Issue date May 5, 2020
- PLASMA INNOVATIONS GMBH
- Michael Bisges
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a flexible circuit board incorporating sun...
- Patent number 10,531,578
- Issue date Jan 7, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip mounter, electronic circuit substrate, and power module
- Patent number 10,194,519
- Issue date Jan 29, 2019
- Mitsubishi Electric Corporation
- Tetsuya Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Recyclable circuit assembly
- Patent number 9,706,693
- Issue date Jul 11, 2017
- IN2TEC LIMITED
- Christopher Hunt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Process for cleaning articles
- Patent number 8,066,820
- Issue date Nov 29, 2011
- Dow Global Technologies LLC
- Konrad Geissler
- B08 - CLEANING
Information Patent Grant
Printing machine
- Patent number 8,016,399
- Issue date Sep 13, 2011
- Chimei Innolux Corporation
- Dirkjan Bernhard Van Dam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive film and method of producing thereof
- Patent number 7,985,527
- Issue date Jul 26, 2011
- FUJIFILM Corporation
- Tsukasa Tokunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive structure of LED and manufacturing method thereof
- Patent number 7,875,900
- Issue date Jan 25, 2011
- Celsia Technologies Taiwan, Inc.
- George Anthony Meyer, IV
- F21 - LIGHTING
Information Patent Grant
Rinsing processes and equipment
- Patent number 7,364,625
- Issue date Apr 29, 2008
- FSI International, Inc.
- Kurt K. Christenson
- B08 - CLEANING
Information Patent Grant
Rework and underfill nozzle for electronic components
- Patent number 6,499,644
- Issue date Dec 31, 2002
- International Business Machines Corporation
- Wilton L. Cox
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rework and underfill nozzle for electronic components
- Patent number 6,464,125
- Issue date Oct 15, 2002
- International Business Machines Corporation
- Wilton L. Cox
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rework and underfill nozzle for electronic components
- Patent number 6,457,631
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Wilton L. Cox
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rework and underfill nozzle for electronic components
- Patent number 6,264,094
- Issue date Jul 24, 2001
- International Business Machines Corporation
- Wilton L. Cox
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rework and underfill nozzle for electronic components
- Patent number 6,220,503
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Wilton L. Cox
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for cleaning electronic components
- Patent number 6,119,706
- Issue date Sep 19, 2000
- Lucent Technologies Inc.
- Frank X. Foederl
- B08 - CLEANING
Information Patent Grant
Process and device for the wave or vapor-phase soldering of electro...
- Patent number 6,116,497
- Issue date Sep 12, 2000
- Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
- Wolfgang Scheel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cleaning electronic components
- Patent number 5,928,432
- Issue date Jul 27, 1999
- Lucent Techologies Inc.
- Frank X. Foederl
- B08 - CLEANING
Information Patent Grant
Method of mitigating electrostatic charge during cleaning of electr...
- Patent number 5,928,434
- Issue date Jul 27, 1999
- Ford Motor Company
- Lakhi Nandlal Goenka
- B08 - CLEANING
Information Patent Grant
Method and apparatus for CO.sub.2 cleaning with mitigated ESD
- Patent number 5,651,834
- Issue date Jul 29, 1997
- Lucent Technologies Inc.
- Min-Chung Jon
- B08 - CLEANING
Information Patent Grant
Methyl chloroform-free desmear process in additive circuitization
- Patent number 5,311,660
- Issue date May 17, 1994
- International Business Machines Corporation
- Warren A. Alpaugh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor phase flash fusing of printed wiring boards
- Patent number 5,188,282
- Issue date Feb 23, 1993
- Hughes Aircraft Company
- Kirk E. Johnson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cleaning and drying of electronic assemblies
- Patent number 5,183,067
- Issue date Feb 2, 1993
- I.S.C. Chemicals Limited
- David S. L. Slinn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for vapor phase soldering and cleaning products
- Patent number 5,181,648
- Issue date Jan 26, 1993
- Helmut W. Leicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cleaning process
- Patent number 5,120,370
- Issue date Jun 9, 1992
- Shinichi Mori
- B08 - CLEANING
Information Patent Grant
Cleaning and drying of electronic assemblies
- Patent number 5,055,138
- Issue date Oct 8, 1991
- ISC Chemicals Limited
- David S. L. Slinn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Procedure for washing circuit boards and means for use in said proc...
- Patent number 5,051,136
- Issue date Sep 24, 1991
- Nokia Mobile Phones Ltd.
- Aulis Tuominen
- B08 - CLEANING
Information Patent Grant
Method for vapor phase soldering
- Patent number 4,840,305
- Issue date Jun 20, 1989
- Westinghouse Electric Corp.
- Michael J. Ankrom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...
- Publication number 20240268022
- Publication date Aug 8, 2024
- NOF Corporation
- Toshinobu FUJIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER FOIL WITH CARRIER
- Publication number 20210059057
- Publication date Feb 25, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Rintaro ISHII
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLEXIBLE CIRCUIT BOARD INCORPORATING SUNKEN RESISTOR AND METHOD FOR...
- Publication number 20190200464
- Publication date Jun 27, 2019
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- MEI YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP MOUNTER, ELECTRONIC CIRCUIT SUBSTRATE, AND POWER MODULE
- Publication number 20190037680
- Publication date Jan 31, 2019
- Mitsubishi Electric Corporation
- Tetsuya UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CREATING PATTERNED COATINGS ON A MOLDED ARTICLE, AND DEV...
- Publication number 20180332711
- Publication date Nov 15, 2018
- PLASMA INNOVATIONS GMBH
- Michael BISGES
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MIXING DIMERS FOR MOISTURE RESISTANT MATERIALS
- Publication number 20170362703
- Publication date Dec 21, 2017
- HZO, INC.
- Yang Yun
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ENHANCING SILVER CONDUCTIVITY
- Publication number 20140231723
- Publication date Aug 21, 2014
- Kurt Michael Sanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recyclable Circuit Assembly
- Publication number 20130188323
- Publication date Jul 25, 2013
- Christopher Hunt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CONDUCTIVE FILM
- Publication number 20120177817
- Publication date Jul 12, 2012
- FUJIFILM CORPORATION
- Tsukasa Tokunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROVIDING A SUBSTRATE WITH A PRINTED PATTERN
- Publication number 20110304669
- Publication date Dec 15, 2011
- CHIMEI INNOLUX CORPORATION
- Dirkjan Bernhard Van Dam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR CLEANING ARTICLES
- Publication number 20110030736
- Publication date Feb 10, 2011
- Konrad Geissler
- B08 - CLEANING
Information Patent Application
THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF
- Publication number 20100133553
- Publication date Jun 3, 2010
- George Anthony Meyer, IV
- F21 - LIGHTING
Information Patent Application
Method of forming wiring board and wiring board obtained
- Publication number 20100078209
- Publication date Apr 1, 2010
- FUJIFILM CORPORATION
- Seiichi Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE FILM AND METHOD OF PRODUCING THEREOF
- Publication number 20090272560
- Publication date Nov 5, 2009
- FUJIFILM CORPORATION
- Tsukasa Tokunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20070218191
- Publication date Sep 20, 2007
- SEIKO EPSON CORPORATION
- Hidemichi FURIHATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Providing a Substrate With a Printed Pattern
- Publication number 20070216914
- Publication date Sep 20, 2007
- Koninklijke Philips Electronics, N.V.
- Dirkjan Bernhard Van Dam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rinsing processes and equipment
- Publication number 20020170573
- Publication date Nov 21, 2002
- Kurt K. Christenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rework and underfill nozzle for electronic components
- Publication number 20020117535
- Publication date Aug 29, 2002
- Wilton L. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rework and underfill nozzle for electronic components
- Publication number 20010006185
- Publication date Jul 5, 2001
- Wilton L. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rework and underfill nozzle for electronic components
- Publication number 20010004990
- Publication date Jun 28, 2001
- Wilton L. Cox
- H01 - BASIC ELECTRIC ELEMENTS

Using a vapour or mist

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat-dissipating circuit board, heat-dissipating member, and produc...

Copper foil with carrier

Mixing dimers for moisture resistant materials

Method for creating patterned coatings on a molded article, and dev...

Method for manufacturing a flexible circuit board incorporating sun...

Chip mounter, electronic circuit substrate, and power module

Recyclable circuit assembly

Process for cleaning articles

Printing machine

Conductive film and method of producing thereof

Thermally conductive structure of LED and manufacturing method thereof

Rinsing processes and equipment

Rework and underfill nozzle for electronic components

Rework and underfill nozzle for electronic components

Rework and underfill nozzle for electronic components

Rework and underfill nozzle for electronic components

Rework and underfill nozzle for electronic components

Apparatus for cleaning electronic components

Process and device for the wave or vapor-phase soldering of electro...

Method for cleaning electronic components

Method of mitigating electrostatic charge during cleaning of electr...

Method and apparatus for CO.sub.2 cleaning with mitigated ESD

Methyl chloroform-free desmear process in additive circuitization

Vapor phase flash fusing of printed wiring boards

Cleaning and drying of electronic assemblies

Method and apparatus for vapor phase soldering and cleaning products

Cleaning process

Cleaning and drying of electronic assemblies

Procedure for washing circuit boards and means for use in said proc...

Method for vapor phase soldering

Patents Applicationslast 30 patents

HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...

COPPER FOIL WITH CARRIER

FLEXIBLE CIRCUIT BOARD INCORPORATING SUNKEN RESISTOR AND METHOD FOR...

CHIP MOUNTER, ELECTRONIC CIRCUIT SUBSTRATE, AND POWER MODULE

METHOD FOR CREATING PATTERNED COATINGS ON A MOLDED ARTICLE, AND DEV...

MIXING DIMERS FOR MOISTURE RESISTANT MATERIALS

ENHANCING SILVER CONDUCTIVITY

Recyclable Circuit Assembly

METHOD FOR PRODUCING A CONDUCTIVE FILM

METHOD FOR PROVIDING A SUBSTRATE WITH A PRINTED PATTERN

PROCESS FOR CLEANING ARTICLES

THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF

Method of forming wiring board and wiring board obtained

CONDUCTIVE FILM AND METHOD OF PRODUCING THEREOF

METHOD FOR MANUFACTURING WIRING SUBSTRATE

Method for Providing a Substrate With a Printed Pattern

Rinsing processes and equipment

Rework and underfill nozzle for electronic components

Rework and underfill nozzle for electronic components

Rework and underfill nozzle for electronic components