METHOD FOR MANUFACTURING WIRING SUBSTRATE

Abstract

A method for manufacturing a wiring substrate by an electroless plating method that precipitates metal without using a plating resist is provided. The method includes the steps of: (a) providing a catalyst layer having a predetermined pattern on a substrate; (b) dipping the substrate in an electroless plating solution to thereby precipitate metal on the catalyst layer to provide a first metal layer; (c) exposing a top surface of the substrate to steam; and (d) dipping the substrate in an electroless plating solution to thereby precipitate metal on the first metal layer to provide a second metal layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart showing an outline of a method for manufacturing a wiring substrate in accordance with a first embodiment of the invention.

FIG. 2 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 3 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 4 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 5 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 6 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 7 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 8 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 9 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 10 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 11 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 12 is a view showing a step of the method for manufacturing a wiring substrate in accordance with the first embodiment.

FIG. 13 is a view showing an example of an electronic device that uses a wiring substrate in accordance with the first embodiment.

FIG. 14 is a SEM image of a nickel metal layer in accordance with a first experimental example.

FIG. 15 is a flow chart showing an outline of a method for manufacturing a wiring substrate in accordance with a second embodiment of the invention.

FIG. 16 is a flow chart showing an outline of a method for manufacturing a wiring substrate in accordance with a third embodiment of the invention.

Claims

1. A method for manufacturing a wiring substrate by an electroless plating method that precipitates metal without using a plating resist, comprising the steps of: (a) providing a catalyst layer having a predetermined pattern on a substrate;(b) dipping the substrate in an electroless plating solution to thereby precipitate metal on the catalyst layer to provide a first metal layer;(c) exposing a top surface of the substrate to steam; and(d) dipping the substrate in an electroless plating solution to thereby precipitate metal on the first metal layer to provide a second metal layer.

2. A method for manufacturing a wiring substrate according to claim 1, wherein the step (c) and the step (d) are repeatedly conducted.

3. A method for manufacturing a wiring substrate according to claim 1, further comprising the step (e) of washing the top surface of the substrate with water between the step (b) and the step (c).

4. A method for manufacturing a wiring substrate according to claim 3, wherein the step (e), the step (c) and the step (d) are repeatedly conducted.

5. A method for manufacturing a wiring substrate according to claim 3, further comprising the step (1) of removing moisture on the substrate between the step (e) and the step (c).

6. A method for manufacturing a wiring substrate according to claim 5, wherein the step (e), the step (D, the step (c) and the step (d) are repeatedly conducted.

7. A method for manufacturing a wiring substrate according to claim 5, wherein the step (f) includes blowing air onto the substrate to thereby remove moisture.

8. A method for manufacturing a wiring substrate according to claim 1, wherein a dipping time in the step (d) is less than a dipping time in the step (b).

9. A method for manufacturing a wiring substrate according to claim 2, wherein a dipping time in the step (d) that is conducted at an n-th time is less than a dipping time in the step (d) that is conducted at an (n−1)th time.

10. A method for manufacturing a wiring substrate according to claim 1, wherein the step (a) includes the steps of: (a1) providing a resist layer in a region other than a desired wiring pattern on the substrate;(a2) providing a surface-active agent layer including a surface-active agent on the substrate;(a3) providing a catalyst layer on the surface-active agent layer; and(a4) removing the resist layer to thereby remove the surface-active agent layer and the catalyst layer in the region other than the desired wiring pattern.