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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/85
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Patents Grants
last 30 patents
Information
Patent Grant
Temperature-stable composite of a stranded wire having a contact pad
Patent number
12,308,588
Issue date
May 20, 2025
Yageo Nexensos GmbH
Matthias Muziol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond capillary design
Patent number
12,308,341
Issue date
May 20, 2025
Skyworks Solutions, Inc.
Miguel Camargo Soto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming wire interconnect structures and related wire bo...
Patent number
12,300,663
Issue date
May 13, 2025
Kulicke and Soffa Industries, Inc.
Basil Milton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,300,682
Issue date
May 13, 2025
Kabushiki Kaisha Toshiba
Jia Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method for package structure
Patent number
12,300,511
Issue date
May 13, 2025
University of Electronic Science and Technology of China
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,300,668
Issue date
May 13, 2025
Samsung Electronics Co., Ltd.
Raehyung Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,288,739
Issue date
Apr 29, 2025
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including recognition marks
Patent number
12,278,193
Issue date
Apr 15, 2025
SK hynix Inc.
Hyun Chul Seo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
Patent number
12,278,227
Issue date
Apr 15, 2025
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device packaging with galvanic isolation
Patent number
12,278,169
Issue date
Apr 15, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Maria Cristina Estacio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacking structure, package structure and method of fabricating the...
Patent number
12,272,674
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball bond impedance matching
Patent number
12,266,629
Issue date
Apr 1, 2025
Raytheon Company
Patrick E. Boyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and a method of manufacturing the same
Patent number
12,261,089
Issue date
Mar 25, 2025
Advanced Semiconductor Engineering, Inc.
Tsung-Yu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with an intermetallic layer
Patent number
12,255,167
Issue date
Mar 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package, electronic apparatus, and method for manufac...
Patent number
12,255,170
Issue date
Mar 18, 2025
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Yasushi Otsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
Patent number
12,255,109
Issue date
Mar 18, 2025
Kulicke and Soffa Industries, Inc.
Gary S. Gillotti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond wires for interference shielding
Patent number
12,255,153
Issue date
Mar 18, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display substrate, tiled display panel and display device
Patent number
12,237,316
Issue date
Feb 25, 2025
BOE Technology Group Co., Ltd.
Wei Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of detecting connection issues between a wire bonding tool...
Patent number
12,235,302
Issue date
Feb 25, 2025
Kulicke and Soffa Industries, Inc.
Dominick Albert DeAngelis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
Patent number
12,237,293
Issue date
Feb 25, 2025
Tanaka Denshi Kogyo K.K.
Hiroyuki Amano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package having wirebonded multi-die stack
Patent number
12,237,305
Issue date
Feb 25, 2025
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processing method of wafer, protective sheet, and protective sheet...
Patent number
12,217,966
Issue date
Feb 4, 2025
Disco Corporation
Kazuma Sekiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package assembly with wire bond vias
Patent number
12,211,821
Issue date
Jan 28, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method for fabricating the same
Patent number
12,191,262
Issue date
Jan 7, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of determining a sequence for creating a plurality of wire...
Patent number
12,183,711
Issue date
Dec 31, 2024
Kulicke and Soffa Industries, Inc.
Basil Milton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Floating die package
Patent number
12,176,298
Issue date
Dec 24, 2024
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for processing memory device
Patent number
12,174,737
Issue date
Dec 24, 2024
ESSENCORE LIMITED
Chan Ho Sohn
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method for forming an electrical connection between an electronic c...
Patent number
12,170,262
Issue date
Dec 17, 2024
STMicroelectronics (Grenoble 2) SAS
David Auchere
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,165,960
Issue date
Dec 10, 2024
Rohm Co., Ltd.
Hiroaki Matsubara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
Patent number
12,154,845
Issue date
Nov 26, 2024
Texas Instruments Incorporated
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
Publication number
20250167180
Publication date
May 22, 2025
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL SENSOR PACKAGE
Publication number
20250160011
Publication date
May 15, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Brian Patrick McGARVEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE
Publication number
20250149522
Publication date
May 8, 2025
BOE TECHNOLOGY GROUP CO., LTD.
Wei Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...
Publication number
20250149395
Publication date
May 8, 2025
Utkarsh Mehrotra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
Publication number
20250151421
Publication date
May 8, 2025
UTAC Headquarters Pte. Ltd.
Jeffrey Punzalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES
Publication number
20250140739
Publication date
May 1, 2025
TEXAS INSTRUMENTS INCORPORATED
Kashyap Mohan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT COPPER WIRE BONDING ON NANOTWIN COPPER STRUCTURES
Publication number
20250140735
Publication date
May 1, 2025
TEXAS INSTRUMENTS INCORPORATED
Jomari AUSTRIA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250140740
Publication date
May 1, 2025
RENESAS ELECTRONICS CORPORATION
Ryusei TAKAISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WEDGE BONDING TOOLS AND METHODS OF FORMING WIRE BONDS
Publication number
20250125303
Publication date
Apr 17, 2025
KULICKE AND SOFFA INDUSTRIES, INC.
Tyler Ownby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...
Publication number
20250125305
Publication date
Apr 17, 2025
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250118700
Publication date
Apr 10, 2025
QUANZHOU SANAN INTEGRATED CIRCUIT CO.,LTD.
Xiaopeng GUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
Publication number
20250118704
Publication date
Apr 10, 2025
Skyworks Solutions, Inc.
Aldrin Quinones GARING
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
Publication number
20250118705
Publication date
Apr 10, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER
Publication number
20250112182
Publication date
Apr 3, 2025
TEXAS INSTRUMENTS INCORPORATED
Masamitsu Matsuura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
Publication number
20250105210
Publication date
Mar 27, 2025
NANYA TECHNOLOGY CORPORATION
Shing-Yih SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT AND METHOD FOR CLEANING BONDING TOOL
Publication number
20250100025
Publication date
Mar 27, 2025
Murata Manufacturing Co., Ltd.
Sami NURMI
B08 - CLEANING
Information
Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
Publication number
20250105214
Publication date
Mar 27, 2025
NANYA TECHNOLOGY CORPORATION
Shing-Yih SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250105177
Publication date
Mar 27, 2025
Kabushiki Kaisha Toshiba
Shogo MINAMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wire Bonding Method and Apparatus
Publication number
20250096195
Publication date
Mar 20, 2025
INFINEON TECHNOLOGIES AG
Stefan Tophinke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED SOLDERABILITY AND METHOD THEREFOR
Publication number
20250096077
Publication date
Mar 20, 2025
NXP B.V.
Yen-Chih Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
Publication number
20250087563
Publication date
Mar 13, 2025
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIBRATION ISOLATION ASSEMBLIES FOR ELECTRONIC DEVICES
Publication number
20250079335
Publication date
Mar 6, 2025
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20250079390
Publication date
Mar 6, 2025
Samsung Electronics Co., Ltd.
Hyunsu KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...
Publication number
20250079396
Publication date
Mar 6, 2025
KULICKE AND SOFFA INDUSTRIES, INC.
Basil Milton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250079389
Publication date
Mar 6, 2025
RENESAS ELECTRONICS CORPORATION
Yoshiharu SHIMIZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250070076
Publication date
Feb 27, 2025
ROHM CO., LTD.
Hiroaki MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
Publication number
20250070081
Publication date
Feb 27, 2025
STMicroelectronics (Grenoble 2) SAS
David Auchere
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250062199
Publication date
Feb 20, 2025
ROHM CO., LTD.
Hiroaki MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method Using Lead Frame Interposer in Bump...
Publication number
20250054902
Publication date
Feb 13, 2025
STATS ChipPAC Pte Ltd.
Peik Eng Ooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE AND METHOD FOR PRODUCING SAME
Publication number
20250054907
Publication date
Feb 13, 2025
ROBERT BOSCH GmbH
Irfan AYDOGMUS
H01 - BASIC ELECTRIC ELEMENTS