using a wire connector

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H01L2224/85

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85using a wire connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Temperature-stable composite of a stranded wire having a contact pad
- Patent number 12,308,588
- Issue date May 20, 2025
- Yageo Nexensos GmbH
- Matthias Muziol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond capillary design
- Patent number 12,308,341
- Issue date May 20, 2025
- Skyworks Solutions, Inc.
- Miguel Camargo Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,300,663
- Issue date May 13, 2025
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,682
- Issue date May 13, 2025
- Kabushiki Kaisha Toshiba
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for package structure
- Patent number 12,300,511
- Issue date May 13, 2025
- University of Electronic Science and Technology of China
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,668
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Raehyung Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including recognition marks
- Patent number 12,278,193
- Issue date Apr 15, 2025
- SK hynix Inc.
- Hyun Chul Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
- Patent number 12,278,227
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packaging with galvanic isolation
- Patent number 12,278,169
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball bond impedance matching
- Patent number 12,266,629
- Issue date Apr 1, 2025
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, electronic apparatus, and method for manufac...
- Patent number 12,255,170
- Issue date Mar 18, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yasushi Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,109
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, tiled display panel and display device
- Patent number 12,237,316
- Issue date Feb 25, 2025
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting connection issues between a wire bonding tool...
- Patent number 12,235,302
- Issue date Feb 25, 2025
- Kulicke and Soffa Industries, Inc.
- Dominick Albert DeAngelis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 12,237,293
- Issue date Feb 25, 2025
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer, protective sheet, and protective sheet...
- Patent number 12,217,966
- Issue date Feb 4, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 12,191,262
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of determining a sequence for creating a plurality of wire...
- Patent number 12,183,711
- Issue date Dec 31, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing memory device
- Patent number 12,174,737
- Issue date Dec 24, 2024
- ESSENCORE LIMITED
- Chan Ho Sohn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20250160011
- Publication date May 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Brian Patrick McGARVEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20250149522
- Publication date May 8, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...
- Publication number 20250149395
- Publication date May 8, 2025
- Utkarsh Mehrotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20250151421
- Publication date May 8, 2025
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20250140739
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kashyap Mohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT COPPER WIRE BONDING ON NANOTWIN COPPER STRUCTURES
- Publication number 20250140735
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jomari AUSTRIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250140740
- Publication date May 1, 2025
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE BONDING TOOLS AND METHODS OF FORMING WIRE BONDS
- Publication number 20250125303
- Publication date Apr 17, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Tyler Ownby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...
- Publication number 20250125305
- Publication date Apr 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118700
- Publication date Apr 10, 2025
- QUANZHOU SANAN INTEGRATED CIRCUIT CO.,LTD.
- Xiaopeng GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
- Publication number 20250118704
- Publication date Apr 10, 2025
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER
- Publication number 20250112182
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105210
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR CLEANING BONDING TOOL
- Publication number 20250100025
- Publication date Mar 27, 2025
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- B08 - CLEANING
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105214
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105177
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Method and Apparatus
- Publication number 20250096195
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Stefan Tophinke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED SOLDERABILITY AND METHOD THEREFOR
- Publication number 20250096077
- Publication date Mar 20, 2025
- NXP B.V.
- Yen-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20250087563
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIBRATION ISOLATION ASSEMBLIES FOR ELECTRONIC DEVICES
- Publication number 20250079335
- Publication date Mar 6, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250079390
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...
- Publication number 20250079396
- Publication date Mar 6, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079389
- Publication date Mar 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070076
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20250070081
- Publication date Feb 27, 2025
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Using Lead Frame Interposer in Bump...
- Publication number 20250054902
- Publication date Feb 13, 2025
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR PRODUCING SAME
- Publication number 20250054907
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS

using a wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Temperature-stable composite of a stranded wire having a contact pad

Wire bond capillary design

Methods of forming wire interconnect structures and related wire bo...

Semiconductor package

Fabrication method for package structure

Semiconductor package

Semiconductor device and method for manufacturing the same

Semiconductor devices including recognition marks

Hybrid embedded packaging structure and manufacturing method thereof

Electronic device packaging with galvanic isolation

Stacking structure, package structure and method of fabricating the...

Ball bond impedance matching

Semiconductor device package and a method of manufacturing the same

Semiconductor packages with an intermetallic layer

Semiconductor package, electronic apparatus, and method for manufac...

Methods of detecting bonding between a bonding wire and a bonding l...

Wire bond wires for interference shielding

Display substrate, tiled display panel and display device

Methods of detecting connection issues between a wire bonding tool...

Palladium-coated copper bonding wire, manufacturing method of palla...

Integrated circuit package having wirebonded multi-die stack

Processing method of wafer, protective sheet, and protective sheet...

Package-on-package assembly with wire bond vias

Package structure and method for fabricating the same

Methods of determining a sequence for creating a plurality of wire...

Floating die package

Method for processing memory device

Method for forming an electrical connection between an electronic c...

Semiconductor device

Semiconductor package with nickel-silver pre-plated leadframe

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

OPTICAL SENSOR PACKAGE

DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE

POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...

Semiconductor Device and Method of Making a Semiconductor Package w...

LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES

DIRECT COPPER WIRE BONDING ON NANOTWIN COPPER STRUCTURES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WEDGE BONDING TOOLS AND METHODS OF FORMING WIRE BONDS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

ELECTRONIC COMPONENT AND METHOD FOR CLEANING BONDING TOOL

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

SEMICONDUCTOR DEVICE

Wire Bonding Method and Apparatus

SEMICONDUCTOR DEVICE WITH ENHANCED SOLDERABILITY AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

VIBRATION ISOLATION ASSEMBLIES FOR ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHODS OF DETERMINING A SEQUENCE FOR CREATING A PLURALITY OF WIRE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

SEMICONDUCTOR DEVICE

Semiconductor Device and Method Using Lead Frame Interposer in Bump...

POWER MODULE AND METHOD FOR PRODUCING SAME