Using an artwork

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CPC
H05K2203/056

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/056Using an artwork

Industries

Patents Grantslast 30 patents

Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,728,258
- Issue date Aug 15, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing flexible circuit board
- Patent number 11,516,926
- Issue date Nov 29, 2022
- Innolux Corporation
- Pai-Chi Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board assembly sheet and producing method thereof
- Patent number 11,503,716
- Issue date Nov 15, 2022
- Nitto Denko Corporation
- Takuya Taniuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,257,745
- Issue date Feb 22, 2022
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 11,026,334
- Issue date Jun 1, 2021
- Nitto Denko Corporation
- Yuu Sugimoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,999,935
- Issue date May 4, 2021
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Apparatus for fabricating electrode structure
- Patent number 10,927,470
- Issue date Feb 23, 2021
- Electronics and Telecommunications Research Institute
- Woo-Seok Cheong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board production method, adhesive layer-e...
- Patent number 10,893,616
- Issue date Jan 12, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Hitoshi Onozeki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing flexible printed circuit board (FPCB) and...
- Patent number 10,887,997
- Issue date Jan 5, 2021
- Inktec Co., Ltd.
- Kwang-Choon Chung
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Piezochromic stamp
- Patent number 10,813,223
- Issue date Oct 20, 2020
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,820
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming conductive vias using a light guide
- Patent number 10,712,664
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Gerald Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board including a conductive pattern having a wire an...
- Patent number 10,687,427
- Issue date Jun 16, 2020
- Nitto Denko Corporation
- Yuu Sugimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing wired circuit board
- Patent number 10,524,363
- Issue date Dec 31, 2019
- Nitto Denko Corporation
- Yuu Sugimoto
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Manufacturing method of circuit board and stamp
- Patent number 10,512,166
- Issue date Dec 17, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Forming conductive vias using a light guide
- Patent number 10,481,496
- Issue date Nov 19, 2019
- International Business Machines Corporation
- Gerald Bartley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Conductive patterns and methods of using them
- Patent number 10,462,908
- Issue date Oct 29, 2019
- Alpha Assembly Solutions Inc.
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,426,038
- Issue date Sep 24, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,362,682
- Issue date Jul 23, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, and film and printed circuit boar...
- Patent number 10,329,368
- Issue date Jun 25, 2019
- Zhen Ding Technology Co., Ltd.
- Mao-Feng Hsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Filling method of conductive paste and manufacturing method of mult...
- Patent number 10,321,578
- Issue date Jun 11, 2019
- Nippon Mektron, Ltd.
- Shoji Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 10,257,926
- Issue date Apr 9, 2019
- Nitto Denko Corporation
- Yuu Sugimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 10,251,263
- Issue date Apr 2, 2019
- Nitto Denko Corporation
- Yuu Sugimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid solder resist composition and covered-printed wiring board
- Patent number 10,234,758
- Issue date Mar 19, 2019
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for producing wired circuit board
- Patent number 10,143,088
- Issue date Nov 27, 2018
- Nitto Denko Corporation
- Yuu Sugimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,098,234
- Issue date Oct 9, 2018
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning of electroless metals by selective deactivation of catal...
- Patent number 10,034,386
- Issue date Jul 24, 2018
- AVERATEK CORPORATION
- Mihir Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...
- Publication number 20220084927
- Publication date Mar 17, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD ASSEMBLY SHEET AND PRODUCING METHOD THEREOF
- Publication number 20210185826
- Publication date Jun 17, 2021
- Nitto Denko Corporation
- Takuya TANIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...
- Publication number 20200258827
- Publication date Aug 13, 2020
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
- Publication number 20200178402
- Publication date Jun 4, 2020
- InnoLux Corporation
- Pai-Chi TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING CONDUCTIVE VIAS USING A LIGHT GUIDE
- Publication number 20200004154
- Publication date Jan 2, 2020
- International Business Machines Corporation
- Gerald Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20190281703
- Publication date Sep 12, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF FABRICATING STRAIN-PRESSURE COMPLEX SENSOR AND SENSOR FAB...
- Publication number 20190159336
- Publication date May 23, 2019
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Seong Jun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR FABRICATING ELECTRODE STRUCTURE
- Publication number 20190055662
- Publication date Feb 21, 2019
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Woo-Seok CHEONG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMING CONDUCTIVE VIAS USING A LIGHT GUIDE
- Publication number 20190004428
- Publication date Jan 3, 2019
- International Business Machines Corporation
- Gerald Bartley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PIEZOCHROMIC STAMP
- Publication number 20180376599
- Publication date Dec 27, 2018
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATAL...
- Publication number 20180332713
- Publication date Nov 15, 2018
- Averatek Corporation
- Mihir Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD
- Publication number 20180210336
- Publication date Jul 26, 2018
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY
- Publication number 20180182697
- Publication date Jun 28, 2018
- Intel Corporation
- Daewoong SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20180014401
- Publication date Jan 11, 2018
- Nitto Denko Corporation
- Yuu SUGIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRED CIRCUIT BOARD
- Publication number 20180007795
- Publication date Jan 4, 2018
- Nitto Denko Corporation
- Yuu SUGIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATAL...
- Publication number 20170354040
- Publication date Dec 7, 2017
- Averatek Corporation
- Mihir Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20170295650
- Publication date Oct 12, 2017
- Nitto Denko Corporation
- Yuu SUGIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20170290146
- Publication date Oct 5, 2017
- Nitto Denko Corporation
- Yuu SUGIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA ETCHING OF SOLDER RESIST OPENINGS
- Publication number 20170273187
- Publication date Sep 21, 2017
- Intel Corporation
- Kristof Darmawikarta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20170273186
- Publication date Sep 21, 2017
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRED CIRCUIT BOARD
- Publication number 20170188465
- Publication date Jun 29, 2017
- Nitto Denko Corporation
- Yuu SUGIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING OF MULTIPLE INKS TO ACHIEVE PRECISION REGISTRATION DURING...
- Publication number 20170115761
- Publication date Apr 27, 2017
- 3M Innovative Properties Company
- Ann M. Gilman
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20170042026
- Publication date Feb 9, 2017
- Unimicron Technology Corp.
- Kuan-Hsi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL CIRCUIT BOARD AND SOLDER RESIST COMPOSITION USED...
- Publication number 20160360621
- Publication date Dec 8, 2016
- TAIYO INK MFG. CO., LTD.
- Ayumu SHIMAMIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING FINE ELECTRODE FOR FLAT PANEL DISPLAY
- Publication number 20160323999
- Publication date Nov 3, 2016
- SAMSUNG DISPLAY CO., LTD.
- Hyun Sup LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS HAVING SUPPORTING PATTERNS AND METHOD OF FAB...
- Publication number 20160316561
- Publication date Oct 27, 2016
- SK HYNIX INC.
- Jong Hyun NAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE LOAD BOARD AND MANUFACTURING PROCESS THEREOF
- Publication number 20160309587
- Publication date Oct 20, 2016
- TM TECHNOLOGY, INC
- Ben WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME
- Publication number 20160234930
- Publication date Aug 11, 2016
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Chan Woo PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCHING METHOD
- Publication number 20150305165
- Publication date Oct 22, 2015
- MIMAKI ENGINEERING CO., LTD.
- NORIKAZU NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...
- Publication number 20150092357
- Publication date Apr 2, 2015
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Using an artwork

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Single-layer circuit board, multi-layer circuit board, and manufact...

Electroless metal-defined thin pad first level interconnects for li...

Method for manufacturing flexible circuit board

Wiring circuit board assembly sheet and producing method thereof

Single-layer circuit board, multi-layer circuit board, and manufact...

Electroless metal-defined thin pad first level interconnects for li...

Single-layer circuit board, multi-layer circuit board, and manufact...

Wired circuit board and producing method thereof

Manufacturing method of circuit board

Apparatus for fabricating electrode structure

Multilayer printed wiring board production method, adhesive layer-e...

Method for manufacturing flexible printed circuit board (FPCB) and...

Piezochromic stamp

Single-layer circuit board, multi-layer circuit board, and manufact...

Forming conductive vias using a light guide

Wired circuit board including a conductive pattern having a wire an...

Method for producing wired circuit board

Manufacturing method of circuit board and stamp

Forming conductive vias using a light guide

Conductive patterns and methods of using them

Manufacturing method of circuit board

Manufacturing method of circuit board

Photosensitive resin composition, and film and printed circuit boar...

Filling method of conductive paste and manufacturing method of mult...

Wired circuit board and producing method thereof

Wired circuit board and producing method thereof

Liquid solder resist composition and covered-printed wiring board

Method for producing wired circuit board

Manufacturing method of circuit board

Patterning of electroless metals by selective deactivation of catal...

Patents Applicationslast 30 patents

ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...

WIRING CIRCUIT BOARD ASSEMBLY SHEET AND PRODUCING METHOD THEREOF

ELECTROLESS METAL-DEFINED THIN PAD FIRST LEVEL INTERCONNECTS FOR LI...

METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD

FORMING CONDUCTIVE VIAS USING A LIGHT GUIDE

MANUFACTURING METHOD OF CIRCUIT BOARD

METHOD OF FABRICATING STRAIN-PRESSURE COMPLEX SENSOR AND SENSOR FAB...

APPARATUS FOR FABRICATING ELECTRODE STRUCTURE

FORMING CONDUCTIVE VIAS USING A LIGHT GUIDE

PIEZOCHROMIC STAMP

PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATAL...

LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD

FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

METHOD FOR PRODUCING WIRED CIRCUIT BOARD

PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATAL...

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

PLASMA ETCHING OF SOLDER RESIST OPENINGS

MANUFACTURING METHOD OF CIRCUIT BOARD

METHOD FOR PRODUCING WIRED CIRCUIT BOARD

PRINTING OF MULTIPLE INKS TO ACHIEVE PRECISION REGISTRATION DURING...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL CIRCUIT BOARD AND SOLDER RESIST COMPOSITION USED...

METHOD OF FORMING FINE ELECTRODE FOR FLAT PANEL DISPLAY

PRINTED CIRCUIT BOARDS HAVING SUPPORTING PATTERNS AND METHOD OF FAB...

LIGHT EMITTING DIODE LOAD BOARD AND MANUFACTURING PROCESS THEREOF

STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME

ETCHING METHOD

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...