using an autocatalytic reaction

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CPC
H01L2224/81232

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81232using an autocatalytic reaction

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 11,798,907
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,430,761
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with self-heating interconnect
- Patent number 8,901,753
- Issue date Dec 2, 2014
- Intel Corporation
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with self-heating interconnect
- Patent number 8,378,504
- Issue date Feb 19, 2013
- Intel Corporation
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die backside metallization and surface activated bonding for stacke...
- Patent number 8,110,930
- Issue date Feb 7, 2012
- Intel Corporation
- Shanggar Periaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching a solder ball and method of repairing a memory...
- Patent number 8,070,048
- Issue date Dec 6, 2011
- Samsung Electronics Co., Ltd.
- Nam-Yong Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for flip-chip mounting utilizing a delay curing-type adhesiv...
- Patent number 7,416,921
- Issue date Aug 26, 2008
- Fujitsu Limited
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of device packaging
- Patent number 7,239,027
- Issue date Jul 3, 2007
- Industrial Technology Research Institute
- Su-Tsai Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220148989
- Publication date May 12, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210257331
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20170294402
- Publication date Oct 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SELF-HEATING INTERCONNECT
- Publication number 20130134587
- Publication date May 30, 2013
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING A SOLDER BALL AND METHOD OF REPAIRING A MEMORY...
- Publication number 20110068151
- Publication date Mar 24, 2011
- Samsung Electronics Co., Ltd.
- Nam-Yong OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC PACKAGE WITH SELF-HEATING INTERCONNECT
- Publication number 20090321962
- Publication date Dec 31, 2009
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL CONTROLLED SIDE CHIP CONNECTION FOR 3D PROCESSOR PACKAGE
- Publication number 20080315388
- Publication date Dec 25, 2008
- Shanggar Periaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die backside metallization and surface activated bonding for stacke...
- Publication number 20080315421
- Publication date Dec 25, 2008
- Shanggar Periaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of flip-chip mounting a semiconductor chip and mounting appa...
- Publication number 20060099809
- Publication date May 11, 2006
- FUJITSU LIMITED
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding structure of device packaging
- Publication number 20060078715
- Publication date Apr 13, 2006
- Su-Tsai Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using an autocatalytic reaction

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages

Semiconductor package and method for manufacturing the same

Bonding package components through plating

Bonding package components through plating

Microelectronic package with self-heating interconnect

Microelectronic package with self-heating interconnect

Die backside metallization and surface activated bonding for stacke...

Method of attaching a solder ball and method of repairing a memory...

Method for flip-chip mounting utilizing a delay curing-type adhesiv...

Bonding structure of device packaging

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Bonding Package Components Through Plating

Bonding Package Components Through Plating

MICROELECTRONIC PACKAGE WITH SELF-HEATING INTERCONNECT

METHOD OF ATTACHING A SOLDER BALL AND METHOD OF REPAIRING A MEMORY...

MICROELECTRONIC PACKAGE WITH SELF-HEATING INTERCONNECT

VERTICAL CONTROLLED SIDE CHIP CONNECTION FOR 3D PROCESSOR PACKAGE

Die backside metallization and surface activated bonding for stacke...

Method of flip-chip mounting a semiconductor chip and mounting appa...

Bonding structure of device packaging