using an autocatalytic reaction

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H01L2224/80232

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80232using an autocatalytic reaction

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Patents Applicationslast 30 patents

Information Patent Application
BONDING LAYER AND PROCESS OF MAKING
- Publication number 20230062465
- Publication date Mar 2, 2023
- TOKYO ELECTRON LIMITED
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS