using an autocatalytic reaction

Industry

CPC
H01L2224/83232

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83232using an autocatalytic reaction

Industries

Patents Grantslast 30 patents

Information Patent Grant
High-conductivity bonding of metal nanowire arrays
- Patent number 10,180,288
- Issue date Jan 15, 2019
- Northrop Grumman Systems Corporation
- John A. Starkovich
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Heat dissipation structure of semiconductor device
- Patent number 9,997,430
- Issue date Jun 12, 2018
- Omron Corporation
- Eiichi Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-conductivity bonding of metal nanowire arrays
- Patent number 9,601,452
- Issue date Mar 21, 2017
- Northrup Grumman Systems Corporation
- John A. Starkovich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of bonding components for fabricating electronic assemblies...
- Patent number 8,967,453
- Issue date Mar 3, 2015
- GM Global Technology Operations LLC
- Khiet Le
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a hermetically sealed, electrical feedthrough...
- Patent number 8,227,297
- Issue date Jul 24, 2012
- Siemens Aktiengesellschaft
- Jörg Naundorf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating a semiconductor package
- Patent number 7,923,289
- Issue date Apr 12, 2011
- International Rectifier Corporation
- Mark Pavier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20230066395
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20170301602
- Publication date Oct 19, 2017
- Omron Corporation
- Eiichi Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS
- Publication number 20160372438
- Publication date Dec 22, 2016
- Northrop Grumman Systems Corporation
- John A. Starkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
- Publication number 20150060898
- Publication date Mar 5, 2015
- Reactive NanoTechnologies, Inc
- David Van Heerden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING COMPONENTS FOR FABRICATING ELECTRONIC ASSEMBLIES...
- Publication number 20130250538
- Publication date Sep 26, 2013
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- KHIET LE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
- Publication number 20110089462
- Publication date Apr 21, 2011
- David Van Heerden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR PRODUCING A HERMETICALLY SEALED, ELECTRICAL FEEDTHROUGH...
- Publication number 20110049729
- Publication date Mar 3, 2011
- Siemens Aktiengesellschaft
- Jörg Naundorf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for fabricating a semiconductor package
- Publication number 20070231960
- Publication date Oct 4, 2007
- International Rectifier Corporation
- Mark Pavier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

using an autocatalytic reaction

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High-conductivity bonding of metal nanowire arrays

Heat dissipation structure of semiconductor device

High-conductivity bonding of metal nanowire arrays

Methods of bonding components for fabricating electronic assemblies...

Method for producing a hermetically sealed, electrical feedthrough...

Process for fabricating a semiconductor package

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

HEAT DISSIPATION STRUCTURE OF SEMICONDUCTOR DEVICE

HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS

METHODS OF BONDING COMPONENTS FOR FABRICATING ELECTRONIC ASSEMBLIES...

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS

METHOD FOR PRODUCING A HERMETICALLY SEALED, ELECTRICAL FEEDTHROUGH...

Process for fabricating a semiconductor package