using an external electrical current

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CPC
H01L21/2885

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/2885using an external electrical current

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, insoluble anode for plating, and plating apparatus
- Patent number 12,157,951
- Issue date Dec 3, 2024
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 12,148,658
- Issue date Nov 19, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing data line, method for manufacturing array...
- Patent number 12,132,058
- Issue date Oct 29, 2024
- BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yuming Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device, semiconductor structure and method for forming same
- Patent number 12,100,654
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Juanjuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device and semiconductor device
- Patent number 12,051,617
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing source-drain electrode, method for manufac...
- Patent number 12,040,334
- Issue date Jul 16, 2024
- BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yuming Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and methods forming the same
- Patent number 12,033,883
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for electro-chemical plating
- Patent number 12,020,922
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Lung Hou
- B08 - CLEANING
Information Patent Grant
Systems and methods for improving within die co-planarity uniformity
- Patent number 11,984,358
- Issue date May 14, 2024
- Applied Materials, Inc.
- Paul McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nanotwin copper materials in semiconductor devices
- Patent number 11,973,034
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,955,292
- Issue date Apr 9, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for metal plating comprising suppressing agent for void...
- Patent number 11,926,918
- Issue date Mar 12, 2024
- BASF SE
- Marcel Patrik Kienle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,926,920
- Issue date Mar 12, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,929,213
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection of contact formation between a substrate and contact pins...
- Patent number 11,920,254
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and device for plating a recess in a substrate
- Patent number 11,908,698
- Issue date Feb 20, 2024
- SEMSYSCO GMBH
- Franz Markut
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Diffusion layers in metal interconnects
- Patent number 11,901,225
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for electrochemical deposition of isolated seed layer areas
- Patent number 11,875,996
- Issue date Jan 16, 2024
- Applied Materials, Inc.
- Marvin Louis Bernt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,859,300
- Issue date Jan 2, 2024
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Via structure and methods thereof
- Patent number 11,854,962
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for structuring a substrate
- Patent number 11,854,829
- Issue date Dec 26, 2023
- LSR Engineering & Consulting Limited
- Marcus Elmar Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for manufacturing the same
- Patent number 11,837,595
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning components and methods in a plating system
- Patent number 11,814,744
- Issue date Nov 14, 2023
- Applied Materials, Inc.
- Nolan Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Paddle chamber with anti-splashing baffles
- Patent number 11,795,566
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Nolan L. Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Through silicon via and redistribution layer
- Patent number 11,795,051
- Issue date Oct 24, 2023
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Thomas Weidner
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD
- Publication number 20240392463
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan Nian
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240355670
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Han HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME
- Publication number 20240321621
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PADDLE CHAMBER WITH ANTI-SPLASHING BAFFLES
- Publication number 20240271312
- Publication date Aug 15, 2024
- Applied Materials, Inc.
- Nolan L. Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT
- Publication number 20240254646
- Publication date Aug 1, 2024
- SUZHOU MAXWELL TECHNOLOGIES CO., LTD.
- Cao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR HYSTERETIC CURRENT-VOLTAGE MEDIATED VOID-FREE SUPERCONF...
- Publication number 20240229282
- Publication date Jul 11, 2024
- Government of the United States of America, as Represented by the Secretary o...
- Trevor Michael Braun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240194611
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240183051
- Publication date Jun 6, 2024
- ACM Research (Shanghai) Inc.
- Zhaowei JIA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DETECTION OF CONTACT FORMATION BETWEEN A SUBSTRATE AND CONTACT PINS...
- Publication number 20240167188
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE FOR A RECTIFIER CIRCUIT OF AN ELECTRODEPOSITION...
- Publication number 20240162811
- Publication date May 16, 2024
- Redwood Materials, Inc.
- Patrick Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20240141540
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
- Publication number 20240145251
- Publication date May 2, 2024
- Applied Materials, Inc.
- Kyle M. Hanson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...
- Publication number 20240141541
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240026561
- Publication date Jan 25, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20240018678
- Publication date Jan 18, 2024
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR ELECTRO-CHEMICAL PLATING
- Publication number 20230386824
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
- Publication number 20230340686
- Publication date Oct 26, 2023
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPUTATIONAL REPRESENTATION OF DEPOSITION PROCESSES
- Publication number 20230335405
- Publication date Oct 19, 2023
- LAM RESEARCH CORPORATION
- Qing Peng Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUS FOR ALTERING LITHOGRAPHIC PATTERNS TO ADJUST...
- Publication number 20230304183
- Publication date Sep 28, 2023
- Marvin Louis BERNT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20230298894
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING SOLAR CELL, SOLAR MODULE, AND POWER GENERA...
- Publication number 20230290901
- Publication date Sep 14, 2023
- Solarlab Aiko Europe GmbH
- Yongqian WANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...
- Publication number 20230282485
- Publication date Sep 7, 2023
- Aveni
- Louis Caillard
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS
- Publication number 20230272547
- Publication date Aug 31, 2023
- Applied Materials, Inc.
- Jing Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
- Publication number 20230265578
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chang HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20230253338
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...
- Publication number 20230230847
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHEMICAL DIRECT PATTERN PLATING METHOD
- Publication number 20230215807
- Publication date Jul 6, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Wen-Jiun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER
- Publication number 20230212773
- Publication date Jul 6, 2023
- LAM RESEARCH CORPORATION
- Justin OBERST
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE FOR DIRECT BONDING AND METHOD OF...
- Publication number 20230197453
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS

using an external electrical current

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of controlling chemical concentration in electrolyte

Chemical direct pattern plating method

Plating method, insoluble anode for plating, and plating apparatus

Method for manufacturing an electronic device

Method for manufacturing data line, method for manufacturing array...

Storage device, semiconductor structure and method for forming same

Methods for forming contact plugs with reduced corrosion

Method of making a semiconductor device and semiconductor device

Method for manufacturing source-drain electrode, method for manufac...

Fan-out interconnect structure and methods forming the same

Apparatus for electro-chemical plating

Systems and methods for improving within die co-planarity uniformity

Nanotwin copper materials in semiconductor devices

Parallel-connected trench capacitor structure with multiple electro...

Semiconductor package and method

Composition for metal plating comprising suppressing agent for void...

Electroplating apparatus and electroplating method

Parallel-connected trench capacitor structure with multiple electro...

Detection of contact formation between a substrate and contact pins...

Method and device for plating a recess in a substrate

Diffusion layers in metal interconnects

Methods for electrochemical deposition of isolated seed layer areas

Plated metallization structures

Controlling plating electrolyte concentration on an electrochemical...

Via structure and methods thereof

Method for structuring a substrate

Semiconductor device structure and method for manufacturing the same

Substrate cleaning components and methods in a plating system

Paddle chamber with anti-splashing baffles

Through silicon via and redistribution layer

Patents Applicationslast 30 patents

SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

SEMICONDUCTOR DEVICE

FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME

PADDLE CHAMBER WITH ANTI-SPLASHING BAFFLES

MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

PROCESS FOR HYSTERETIC CURRENT-VOLTAGE MEDIATED VOID-FREE SUPERCONF...

SEMICONDUCTOR PACKAGE AND METHOD

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

DETECTION OF CONTACT FORMATION BETWEEN A SUBSTRATE AND CONTACT PINS...

MOUNTING STRUCTURE FOR A RECTIFIER CIRCUIT OF AN ELECTRODEPOSITION...

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION

ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...

PLATING APPARATUS AND PLATING METHOD

Copper Electrodeposition in Microelectronics

APPARATUS FOR ELECTRO-CHEMICAL PLATING

ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...

COMPUTATIONAL REPRESENTATION OF DEPOSITION PROCESSES

METHODS AND APPARATUS FOR ALTERING LITHOGRAPHIC PATTERNS TO ADJUST...

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...

METHOD FOR MANUFACTURING SOLAR CELL, SOLAR MODULE, AND POWER GENERA...

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...

ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS

METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE

SEMICONDUCTOR PACKAGE AND METHOD

ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...

CHEMICAL DIRECT PATTERN PLATING METHOD

SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER

STRUCTURE WITH CONDUCTIVE FEATURE FOR DIRECT BONDING AND METHOD OF...