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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/2885
using an external electrical current
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Patents Grants
last 30 patents
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Patent Grant
Nanotwin copper materials in semiconductor devices
Patent number
11,973,034
Issue date
Apr 30, 2024
Applied Materials, Inc.
Eric J. Bergman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
Patent number
11,955,292
Issue date
Apr 9, 2024
United Microelectronics Corp.
Purakh Raj Verma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,942,435
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composition for metal plating comprising suppressing agent for void...
Patent number
11,926,918
Issue date
Mar 12, 2024
BASF SE
Marcel Patrik Kienle
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating apparatus and electroplating method
Patent number
11,926,920
Issue date
Mar 12, 2024
ACM RESEARCH (SHANGHAI), INC.
Zhaowei Jia
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
Patent number
11,929,213
Issue date
Mar 12, 2024
United Microelectronics Corp.
Purakh Raj Verma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Detection of contact formation between a substrate and contact pins...
Patent number
11,920,254
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yung Chang Huang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method and device for plating a recess in a substrate
Patent number
11,908,698
Issue date
Feb 20, 2024
SEMSYSCO GMBH
Franz Markut
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Diffusion layers in metal interconnects
Patent number
11,901,225
Issue date
Feb 13, 2024
Applied Materials, Inc.
Eric J. Bergman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for electrochemical deposition of isolated seed layer areas
Patent number
11,875,996
Issue date
Jan 16, 2024
Applied Materials, Inc.
Marvin Louis Bernt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plated metallization structures
Patent number
11,862,518
Issue date
Jan 2, 2024
Analog Devices International Unlimited Company
Jan Kubik
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
Patent number
11,859,300
Issue date
Jan 2, 2024
Lam Research Corporation
Zhian He
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Via structure and methods thereof
Patent number
11,854,962
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Che-Cheng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for structuring a substrate
Patent number
11,854,829
Issue date
Dec 26, 2023
LSR Engineering & Consulting Limited
Marcus Elmar Lang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure and method for manufacturing the same
Patent number
11,837,595
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate cleaning components and methods in a plating system
Patent number
11,814,744
Issue date
Nov 14, 2023
Applied Materials, Inc.
Nolan Zimmerman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Paddle chamber with anti-splashing baffles
Patent number
11,795,566
Issue date
Oct 24, 2023
Applied Materials, Inc.
Nolan L. Zimmerman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Through silicon via and redistribution layer
Patent number
11,795,051
Issue date
Oct 24, 2023
X-FAB SEMICONDUCTOR FOUNDRIES GMBH
Thomas Weidner
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated passive device and fabrication method using a last throu...
Patent number
11,735,497
Issue date
Aug 22, 2023
Semiconductor Components Industries, LLC
Takashi Noma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die orifices containing metallic nanowires
Patent number
11,728,242
Issue date
Aug 15, 2023
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper electrodeposition sequence for the filling of cobalt lined f...
Patent number
11,699,590
Issue date
Jul 11, 2023
Lam Research Corporation
Jeyavel Velmurugan
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Regulation plate, anode holder, and substrate holder
Patent number
11,686,009
Issue date
Jun 27, 2023
Ebara Corporation
Naoki Shimomura
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method of controlling chemical concentration in electrolyte
Patent number
11,668,019
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yung-Chang Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,664,323
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
11,664,231
Issue date
May 30, 2023
Kabushiki Kaisha Toshiba
Kazuhito Higuchi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Flow assisted dynamic seal for high-convection, continuous-rotation...
Patent number
11,655,556
Issue date
May 23, 2023
Lam Research Corporation
Aaron Berke
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Apparatus for electrochemically processing semiconductor substrates
Patent number
11,643,744
Issue date
May 9, 2023
SPTS Technologies Limited
John Macneil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrochemical depositions of nanotwin copper materials
Patent number
11,634,830
Issue date
Apr 25, 2023
Applied Materials, Inc.
Jing Xu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Electrochemical depositions of ruthenium-containing materials
Patent number
11,629,423
Issue date
Apr 18, 2023
Applied Materials, Inc.
Eric J. Bergman
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor dies having ultra-thin wafer backmetal systems, micro...
Patent number
11,616,040
Issue date
Mar 28, 2023
NXP USA, INC.
Tianwei Sun
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
Publication number
20240141540
Publication date
May 2, 2024
LAM RESEARCH CORPORATION
Zhian He
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
Publication number
20240145251
Publication date
May 2, 2024
Applied Materials, Inc.
Kyle M. Hanson
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...
Publication number
20240141541
Publication date
May 2, 2024
LAM RESEARCH CORPORATION
Lee Peng Chua
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PLATING APPARATUS AND PLATING METHOD
Publication number
20240026561
Publication date
Jan 25, 2024
ACM RESEARCH (SHANGHAI), INC.
Zhaowei Jia
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Copper Electrodeposition in Microelectronics
Publication number
20240018678
Publication date
Jan 18, 2024
MacDermid Enthone Inc.
Vincent Paneccasio
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
APPARATUS FOR ELECTRO-CHEMICAL PLATING
Publication number
20230386824
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuo-Lung HOU
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
Publication number
20230340686
Publication date
Oct 26, 2023
LAM RESEARCH CORPORATION
Steven T. Mayer
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
COMPUTATIONAL REPRESENTATION OF DEPOSITION PROCESSES
Publication number
20230335405
Publication date
Oct 19, 2023
LAM RESEARCH CORPORATION
Qing Peng Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHODS AND APPARATUS FOR ALTERING LITHOGRAPHIC PATTERNS TO ADJUST...
Publication number
20230304183
Publication date
Sep 28, 2023
Marvin Louis BERNT
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
Publication number
20230298894
Publication date
Sep 21, 2023
LAM RESEARCH CORPORATION
Jeyavel Velmurugan
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD FOR MANUFACTURING SOLAR CELL, SOLAR MODULE, AND POWER GENERA...
Publication number
20230290901
Publication date
Sep 14, 2023
Solarlab Aiko Europe GmbH
Yongqian WANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...
Publication number
20230282485
Publication date
Sep 7, 2023
Aveni
Louis Caillard
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS
Publication number
20230272547
Publication date
Aug 31, 2023
Applied Materials, Inc.
Jing Xu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
Publication number
20230265578
Publication date
Aug 24, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yung-Chang HUANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20230253338
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...
Publication number
20230230847
Publication date
Jul 20, 2023
LAM RESEARCH CORPORATION
Kari Thorkelsson
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CHEMICAL DIRECT PATTERN PLATING METHOD
Publication number
20230215807
Publication date
Jul 6, 2023
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Wen-Jiun LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER
Publication number
20230212773
Publication date
Jul 6, 2023
LAM RESEARCH CORPORATION
Justin OBERST
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE FOR DIRECT BONDING AND METHOD OF...
Publication number
20230197453
Publication date
Jun 22, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
Publication number
20230095239
Publication date
Mar 30, 2023
InnoLux Corporation
Cheng-Chi WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROPLATING CO-PLANARITY IMPROVEMENT BY DIE SHIELDING
Publication number
20230092346
Publication date
Mar 23, 2023
Applied Materials, Inc.
Charles Sharbono
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHODS FOR ELECTROCHEMICAL DEPOSITION OF ISOLATED SEED LAYER AREAS
Publication number
20230086742
Publication date
Mar 23, 2023
Marvin Louis BERNT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFUSION LAYERS IN METAL INTERCONNECTS
Publication number
20230077737
Publication date
Mar 16, 2023
Applied Materials, Inc.
Eric J. Bergman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230084019
Publication date
Mar 16, 2023
Kabushiki Kaisha Toshiba
Kazuhito HIGUCHI
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PARALLEL-CONNECTED CAPACITOR STRUCTURE AND METHOD OF FABRICATING TH...
Publication number
20230071686
Publication date
Mar 9, 2023
UNITED MICROELECTRONICS CORP.
Purakh Raj Verma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROCHEMICAL DEPOSITIONS OF NANOTWIN COPPER MATERIALS
Publication number
20230068074
Publication date
Mar 2, 2023
Applied Materials, Inc.
Jing Xu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Detection of Contact Formation Between a Substrate and Contact Pins...
Publication number
20230065723
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yung Chang HUANG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROCHEMICAL DEPOSITIONS OF RUTHENIUM-CONTAINING MATERIALS
Publication number
20230066404
Publication date
Mar 2, 2023
Applied Materials, Inc.
Eric J. Bergman
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
NANOTWIN COPPER MATERIALS IN SEMICONDUCTOR DEVICES
Publication number
20230065426
Publication date
Mar 2, 2023
Applied Materials, Inc.
Eric J. Bergman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
HIGH-SPEED 3D METAL PRINTING OF SEMICONDUCTOR METAL INTERCONNECTS
Publication number
20230035849
Publication date
Feb 2, 2023
LAM RESEARCH CORPORATION
Steven T. MAYER
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR