Using an inert gas

Industry

CPC
H05K2203/086

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/086Using an inert gas

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer coatings and methods for depositing polymer coatings
- Patent number 11,419,220
- Issue date Aug 16, 2022
- Europlasma NV
- Samir Loulidi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing ceramic circuit board
- Patent number 11,160,172
- Issue date Oct 26, 2021
- DENKA COMPANY LIMITED
- Atsushi Sakai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Repairing defective through-holes
- Patent number 10,952,330
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Prabjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive paste, electronic substrate, and method for manuf...
- Patent number 10,575,412
- Issue date Feb 25, 2020
- Mitsuboshi Belting Ltd.
- Hiroji Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 10,008,471
- Issue date Jun 26, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming vias on printed circuit boards
- Patent number 9,999,137
- Issue date Jun 12, 2018
- Intrinsiq Materials, Inc.
- David Ciufo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Synthetic method of suppressing metal nano-particle from having oxi...
- Patent number 9,986,638
- Issue date May 29, 2018
- Korea Research Institute of Chemical Technology
- Sun Ho Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photocurable composition and method of manufacturing film using the...
- Patent number 9,982,102
- Issue date May 29, 2018
- Canon Kabushiki Kaisha
- Toshiki Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board made of AIN with copper structures
- Patent number 9,717,149
- Issue date Jul 25, 2017
- CeramTec GmbH
- Alexander Dohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable equipment for monitoring and controlling the level of oxyg...
- Patent number 9,539,672
- Issue date Jan 10, 2017
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Luiz Rodrigues
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 9,240,256
- Issue date Jan 19, 2016
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and apparatus for applying a material on a substrate
- Patent number 9,211,567
- Issue date Dec 15, 2015
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- René Jos Houben
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for packing tab tape, and packing structure for tab tape
- Patent number 8,662,309
- Issue date Mar 4, 2014
- Sharp Kabushiki Kaisha
- Satoru Kudose
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Methods of wet etching a self-assembled monolayer patterned substra...
- Patent number 8,647,522
- Issue date Feb 11, 2014
- 3M Innovative Properties Company
- Lijun Zu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrode bonding method and part mounting apparatus
- Patent number 8,449,712
- Issue date May 28, 2013
- Panasonic Corporation
- Yoshimasa Inamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming metal wiring and metal wiring formed using the same
- Patent number 8,216,635
- Issue date Jul 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Young Ah Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing for heat-sensitive mesoscale deposition of oxygen-...
- Patent number 8,110,247
- Issue date Feb 7, 2012
- Optomec Design Company
- Michael J. Renn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding semiconductor devices utilizing solder balls
- Patent number 8,012,866
- Issue date Sep 6, 2011
- ASM Assembly Automation LTD
- Ping Liang Tu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Approaches for manufacturing a head gimbal assembly
- Patent number 7,984,545
- Issue date Jul 26, 2011
- Hitachi Global Storage Technologies Netherlands B.V.
- Yuhsuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting an electronic component and mounting apparatus
- Patent number 7,828,193
- Issue date Nov 9, 2010
- Fujitsu Limited
- Kuniko Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming solder balls with a stable oxide layer by contro...
- Patent number 7,829,453
- Issue date Nov 9, 2010
- GLOBALFOUNDRIES Inc.
- Gotthard Jungnickel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for supplying electrically conductive material
- Patent number 7,810,705
- Issue date Oct 12, 2010
- TDK Corporation
- Toru Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding metal ball for magnetic head assembly
- Patent number 7,765,678
- Issue date Aug 3, 2010
- TDK Corporation
- Ooki Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for applying a solder to a substrate
- Patent number 7,717,316
- Issue date May 18, 2010
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular board device, high frequency module, and method of manufact...
- Patent number 7,470,977
- Issue date Dec 30, 2008
- Sony Corporation
- Akihiko Okubora
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of mounting an electronic part
- Patent number 7,100,279
- Issue date Sep 5, 2006
- Shinko Electric Industries Co., Ltd.
- Tadatomo Suga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste printing method and apparatus for printing solder past...
- Patent number 6,854,638
- Issue date Feb 15, 2005
- NEC Corporation
- Hiroshi Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flatwire repair tool systems and methods
- Patent number 6,814,273
- Issue date Nov 9, 2004
- Visteon Global Technologies, Inc.
- Anne Marie Sullivan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR...
- Publication number 20230269881
- Publication date Aug 24, 2023
- DEVICEENG CO., LTD
- Taek Youb LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20220369473
- Publication date Nov 17, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIRING DEFECTIVE THROUGH-HOLES
- Publication number 20200245469
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Prabjit SINGH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD
- Publication number 20200128677
- Publication date Apr 23, 2020
- DENKA COMPANY LIMITED
- Atsushi SAKAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
- Publication number 20190364667
- Publication date Nov 28, 2019
- SHINSHU UNIVERSITY
- Kazuhiko SAKAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COATING BY ALD FOR SUPPRESSING METALLIC WHISKERS
- Publication number 20190127853
- Publication date May 2, 2019
- Marko PUDAS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroconductive Paste, Electronic Substrate, and Method for Manuf...
- Publication number 20190132961
- Publication date May 2, 2019
- MITSUBOSHI BELTING LTD.
- Hiroji Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20190037705
- Publication date Jan 31, 2019
- Semblant Limited
- Shailendra Vikram SINGH
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
POLYMER COATINGS AND METHODS FOR DEPOSITING POLYMER COATINGS
- Publication number 20180279483
- Publication date Sep 27, 2018
- EUROPLASMA NV
- Samir Loulidi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR SYSTEM AND DEVICE PACKAGE INCLUDING INTERCONNECT STRU...
- Publication number 20180138113
- Publication date May 17, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PORTABLE EQUIPMENT FOR MONITORING AND CONTROLLING THE LEVEL OF OXYG...
- Publication number 20150314401
- Publication date Nov 5, 2015
- L'air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation Des Procedes Ge...
- Luiz Felipe RODRIGUES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MADE OF AIN WITH COPPER STRUCTURES
- Publication number 20140284087
- Publication date Sep 25, 2014
- CERAMTEC GMBH
- Alexander Dohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus And Method For Providing An Inerting Gas During Soldering
- Publication number 20140027495
- Publication date Jan 30, 2014
- Air Products and Chemicals Inc
- Gregory Khosrov Arslanian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR THE WET-CHEMICAL TREATMENT OF MATERIAL TO BE...
- Publication number 20120298515
- Publication date Nov 29, 2012
- Atotech Deutschland GmbH
- Andreas Skupin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20120298009
- Publication date Nov 29, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD
- Publication number 20120115313
- Publication date May 10, 2012
- TOKYO ELECTRON LIMITED
- Hiroshi SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF WET ETCHING A SELF-ASSEMBLED MONOLAYER PATTERNED SUBSTRA...
- Publication number 20120082825
- Publication date Apr 5, 2012
- Lijun Zu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PACKING TAB TAPE, AND PACKING STRUCTURE FOR TAB TAPE
- Publication number 20110147262
- Publication date Jun 23, 2011
- SHARP KABUSHKIK KAISHA
- Satoru Kudose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR APPLYING A MATERIAL ON A SUBSTRATE
- Publication number 20100313947
- Publication date Dec 16, 2010
- René Jos Houben
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING METAL WIRING AND METAL WIRING FORMED USING THE SAME
- Publication number 20100196681
- Publication date Aug 5, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Young Ah SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR DEVICES UTILIZING SOLDER BALLS
- Publication number 20090298278
- Publication date Dec 3, 2009
- Ping Liang TU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Applying Catalytic Solution for Use in Electroless Deposi...
- Publication number 20090238979
- Publication date Sep 24, 2009
- William Decesare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD
- Publication number 20090239360
- Publication date Sep 24, 2009
- TOKYO ELECTON LIMITED
- HIROSHI SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODE BONDING METHOD AND PART MOUNTING APPARATUS
- Publication number 20090145546
- Publication date Jun 11, 2009
- PANASONIC CORPORATION
- Yoshimasa Inamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for manufacturing a head gimbal assembly
- Publication number 20090025205
- Publication date Jan 29, 2009
- Yuhsuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF REFLOW SOLDERING A PRINTED CIRCUIT BOARD WHEREIN AN ELECT...
- Publication number 20080302859
- Publication date Dec 11, 2008
- SMK Corporation
- Nobuo Kasagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of mounting an electronic component and mounting apparatus
- Publication number 20080203138
- Publication date Aug 28, 2008
- Fujitsu Limited
- Kuniko Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular board device, high frequency module, and method of manufact...
- Publication number 20080178463
- Publication date Jul 31, 2008
- Sony Corporation
- Akihiko Okubora
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20080102561
- Publication date May 1, 2008
- SCHLUMBERGER TECHNOLOGY CORPORATION
- YASUNORI GOTO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Using an inert gas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for soldering an electronic component to a circuit board by...

Polymer coatings and methods for depositing polymer coatings

Method for producing ceramic circuit board

Repairing defective through-holes

Electroconductive paste, electronic substrate, and method for manuf...

Bonding method using bonding material

Bonding material and bonding method using the same

Method for forming vias on printed circuit boards

Synthetic method of suppressing metal nano-particle from having oxi...

Photocurable composition and method of manufacturing film using the...

Circuit board made of AIN with copper structures

Portable equipment for monitoring and controlling the level of oxyg...

Bonding material and bonding method using the same

Method and apparatus for applying a material on a substrate

Method for packing tab tape, and packing structure for tab tape

Methods of wet etching a self-assembled monolayer patterned substra...

Electrode bonding method and part mounting apparatus

Method of forming metal wiring and metal wiring formed using the same

Laser processing for heat-sensitive mesoscale deposition of oxygen-...

Method of bonding semiconductor devices utilizing solder balls

Approaches for manufacturing a head gimbal assembly

Method of mounting an electronic component and mounting apparatus

Method for forming solder balls with a stable oxide layer by contro...

Apparatus and method for supplying electrically conductive material

Method of bonding metal ball for magnetic head assembly

Method and device for applying a solder to a substrate

Modular board device, high frequency module, and method of manufact...

Method of mounting an electronic part

Solder paste printing method and apparatus for printing solder past...

Flatwire repair tool systems and methods

Patents Applicationslast 30 patents

Method for Soldering an Electronic Component to a Circuit Board by...

DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR...

Method for Soldering an Electronic Component to a Circuit Board by...

REPAIRING DEFECTIVE THROUGH-HOLES

METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD

METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD

COATING BY ALD FOR SUPPRESSING METALLIC WHISKERS

Electroconductive Paste, Electronic Substrate, and Method for Manuf...

COATED ELECTRICAL ASSEMBLY

POLYMER COATINGS AND METHODS FOR DEPOSITING POLYMER COATINGS

SEMICONDUCTOR SYSTEM AND DEVICE PACKAGE INCLUDING INTERCONNECT STRU...

PORTABLE EQUIPMENT FOR MONITORING AND CONTROLLING THE LEVEL OF OXYG...

CIRCUIT BOARD MADE OF AIN WITH COPPER STRUCTURES

Apparatus And Method For Providing An Inerting Gas During Soldering

METHOD AND DEVICE FOR THE WET-CHEMICAL TREATMENT OF MATERIAL TO BE...

BONDING MATERIAL AND BONDING METHOD USING THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD

METHODS OF WET ETCHING A SELF-ASSEMBLED MONOLAYER PATTERNED SUBSTRA...

METHOD FOR PACKING TAB TAPE, AND PACKING STRUCTURE FOR TAB TAPE

METHOD AND APPARATUS FOR APPLYING A MATERIAL ON A SUBSTRATE

METHOD OF FORMING METAL WIRING AND METAL WIRING FORMED USING THE SAME

METHOD OF BONDING SEMICONDUCTOR DEVICES UTILIZING SOLDER BALLS

Method of Applying Catalytic Solution for Use in Electroless Deposi...

SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD

ELECTRODE BONDING METHOD AND PART MOUNTING APPARATUS

Method and apparatus for manufacturing a head gimbal assembly

METHOD OF REFLOW SOLDERING A PRINTED CIRCUIT BOARD WHEREIN AN ELECT...

Method of mounting an electronic component and mounting apparatus

Modular board device, high frequency module, and method of manufact...

METHODS OF MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLY