using an inorganic non metallic glass type adhesive

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H01L2224/8089

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8089using an inorganic non metallic glass type adhesive

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Daisy-chain seal ring structure
- Patent number 12,170,234
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,170,257
- Issue date Dec 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,170,258
- Issue date Dec 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Simon Shi-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Copper-bonded memory stacks with copper-bonded interconnection memo...
- Patent number 12,166,027
- Issue date Dec 10, 2024
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices including backside power rails and m...
- Patent number 12,166,016
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM memory device with Xtacking architecture
- Patent number 12,159,849
- Issue date Dec 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Lei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide composite wafer and manufacturing method thereof
- Patent number 12,159,855
- Issue date Dec 3, 2024
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor element
- Patent number 12,154,929
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Daisuke Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting multiple chips using an interconnect device
- Patent number 12,154,858
- Issue date Nov 26, 2024
- Invensas LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for low temperature device bonding
- Patent number 12,154,880
- Issue date Nov 26, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,716
- Issue date Nov 19, 2024
- Kioxia Corporation
- Takuya Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of semiconduct...
- Patent number 12,144,179
- Issue date Nov 12, 2024
- SK hynix Inc.
- Eun Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 12,142,629
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,596
- Issue date Nov 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 12,137,568
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,136,599
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with backside source contact
- Patent number 12,136,618
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 12,132,019
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,132,020
- Issue date Oct 29, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating passive devices in package structures
- Patent number 12,132,029
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,127,393
- Issue date Oct 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack structure and manufacturing method thereof
- Patent number 12,125,824
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for plasma oxidation protection during hybrid bonding...
- Patent number 12,125,818
- Issue date Oct 22, 2024
- Tokyo Electron Limited
- Jack Rogers
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421140
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421020
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KWAN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH LATERALLY SEPARATED SOURCE SEL...
- Publication number 20240422973
- Publication date Dec 19, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Shinsuke YADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421095
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FOR...
- Publication number 20240421111
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Singulation Assisted Structures and Methods for Improving Bond...
- Publication number 20240421126
- Publication date Dec 19, 2024
- Apple Inc.
- Chi Nung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240421016
- Publication date Dec 19, 2024
- Samsung Electronics Co.,Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES
- Publication number 20240421077
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421130
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR ELEMENT CHIP AND MANUFACTURING METHOD FOR...
- Publication number 20240413013
- Publication date Dec 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shogo OKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS
- Publication number 20240413110
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20240413185
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- TETSUO GOCHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240413108
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413097
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240413126
- Publication date Dec 12, 2024
- LAPIS Semiconductor Co., Ltd.
- Kentarou ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240413028
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413101
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING CONTROL LOGIC REGIONS
- Publication number 20240413145
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Aaron S. Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...
- Publication number 20240405044
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BODY AND PREPARATION METHOD THEREFOR
- Publication number 20240404938
- Publication date Dec 5, 2024
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR A THREE-DIMENSIONAL PACKAGE
- Publication number 20240404991
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...
- Publication number 20240404993
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME
- Publication number 20240404867
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES INCLUDING SELF-ALIGNED CHANNEL CAP...
- Publication number 20240407164
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Naoto NORIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES, FABRICATING METHODS THEREOF, AND MEMORY SYSTEMS
- Publication number 20240404901
- Publication date Dec 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPLEX WITH EMBEDDED INTERPOSER
- Publication number 20240404897
- Publication date Dec 5, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...
- Publication number 20240395745
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jun Kyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS

using an inorganic non metallic glass type adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Daisy-chain seal ring structure

Semiconductor package and method of fabricating the same

Integrated circuit packages and methods of forming the same

Three-dimensional memory devices and methods for forming the same

Memory devices having vertical transistors and methods for forming...

Signal routing between memory die and logic die

Copper-bonded memory stacks with copper-bonded interconnection memo...

Manufacturing method of package

Packaged semiconductor devices including backside power rails and m...

DRAM memory device with Xtacking architecture

Silicon carbide composite wafer and manufacturing method thereof

Semiconductor element

Connecting multiple chips using an interconnect device

Method and structures for low temperature device bonding

Semiconductor device

Iterative formation of damascene interconnects

Semiconductor memory device and manufacturing method of semiconduct...

Member for solid-state image pickup device and method for manufactu...

Semiconductor structure and manufacturing method thereof

Hybrid bonding contact structure of three-dimensional memory device

Three-dimensional memory devices and fabricating methods thereof

Three-dimensional memory device with backside source contact

Packaged multi-chip semiconductor devices and methods of fabricatin...

Low temperature bonded structures

Integrating passive devices in package structures

Memory devices having vertical transistors and methods for forming...

Die on die bonding structure

Method for forming semiconductor package and semiconductor package

Semiconductor stack structure and manufacturing method thereof

Technologies for plasma oxidation protection during hybrid bonding...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL MEMORY DEVICE WITH LATERALLY SEPARATED SOURCE SEL...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FOR...

Chip Singulation Assisted Structures and Methods for Improving Bond...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

MANUFACTURING METHOD FOR ELEMENT CHIP AND MANUFACTURING METHOD FOR...

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

DIE STRUCTURES AND METHODS OF FORMING THE SAME

SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD

MEMORY DEVICES INCLUDING CONTROL LOGIC REGIONS

Semiconductor Device and Method

SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...

PACKAGE BODY AND PREPARATION METHOD THEREFOR

METHOD AND STRUCTURE FOR A THREE-DIMENSIONAL PACKAGE

SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...

APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES INCLUDING SELF-ALIGNED CHANNEL CAP...

PACKAGE STRUCTURES, FABRICATING METHODS THEREOF, AND MEMORY SYSTEMS

CHIP COMPLEX WITH EMBEDDED INTERPOSER

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...