using an inorganic non metallic glass type adhesive

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H01L2224/8089

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8089using an inorganic non metallic glass type adhesive

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 12,327,777
- Issue date Jun 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming the same
- Patent number 12,327,815
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for face bonded semiconductor device
- Patent number 12,327,776
- Issue date Jun 10, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Rui Tze Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,328,867
- Issue date Jun 10, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 12,322,717
- Issue date Jun 3, 2025
- ams AG
- Jens Hofrichter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluid channel geometry optimizations to improve cooling efficiency
- Patent number 12,322,677
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Ron Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including a bit-line-bias vertical...
- Patent number 12,322,452
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Naoto Norizuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonding method for copper-copper metal with hydrazine hydrate
- Patent number 12,322,724
- Issue date Jun 3, 2025
- ANHUI UNIVERSITY
- Wenhua Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming integrated chip structure having slotted bond pad...
- Patent number 12,322,715
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, method for forming same, and wafer on wafe...
- Patent number 12,322,654
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yuanhao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shifted via-chain electrical-test measurements for hybrid bonding a...
- Patent number 12,322,661
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding device and wafer bonding method
- Patent number 12,315,839
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
- Patent number 12,315,833
- Issue date May 27, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device structure
- Patent number 12,317,579
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and semiconductor apparatus manufacturing m...
- Patent number 12,317,627
- Issue date May 27, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tadashi Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having a contact plug electrically conn...
- Patent number 12,317,500
- Issue date May 27, 2025
- Kioxia Corporation
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and methods of formation
- Patent number 12,317,517
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,308,343
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, related electronic systems, and methods of...
- Patent number 12,308,333
- Issue date May 20, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 12,308,323
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and methods for forming the same
- Patent number 12,300,317
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Mingkang Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Photoelectric conversion apparatus and system
- Patent number 12,302,662
- Issue date May 13, 2025
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,300,648
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable hybrid bonded apparatus
- Patent number 12,300,661
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding pads and methods of forming the same
- Patent number 12,300,644
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,300,575
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package including memory array
- Patent number 12,293,999
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Feng Young
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-ASSEMBLY METHOD AND EQUIPMENT
- Publication number 20250192096
- Publication date Jun 12, 2025
- Intel Corporation
- Yi SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250194110
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jihye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250194281
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192109
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTOCOL FOR THINNING THE REAR SUBSTRATE OF INDIVIDUAL CHIPS ATTACH...
- Publication number 20250194268
- Publication date Jun 12, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Renan BOUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...
- Publication number 20250192104
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS
- Publication number 20250192082
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Sangmin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20250194112
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192103
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CHANNEL STRUCTURES
- Publication number 20250194078
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Heonjun Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20250183208
- Publication date Jun 5, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES
- Publication number 20250183226
- Publication date Jun 5, 2025
- ADVANCED MICRO DEVICES, INC.
- Russell Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mirror image of geometrical patterns in stacked integrated circuit...
- Publication number 20250183231
- Publication date Jun 5, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Ido Bourstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20250183120
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183169
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Won Il Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183230
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACHING DEVICE, CHIP PROCESSING SYSTEM, AND CHIP PROCESSING...
- Publication number 20250183222
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Yasutaka Mizomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH CHIP STACK
- Publication number 20250183219
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20250174599
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jihoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING
- Publication number 20250174595
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Ta Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174609
- Publication date May 29, 2025
- Industrial Technology Research Institute
- Chao-Kai HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
- Publication number 20250174561
- Publication date May 29, 2025
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250176194
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- INHO CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250176171
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yaqin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBING BUMP PLACEMENT OVER MULTIPLE VIA OPENINGS
- Publication number 20250174501
- Publication date May 29, 2025
- Xilinx, Inc.
- Andy WIDJAJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250174517
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...
- Publication number 20250169070
- Publication date May 22, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Kota FUNAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE
- Publication number 20250167193
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...
- Publication number 20250164709
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stacking with Integrated Thermal Treatment
- Publication number 20250167167
- Publication date May 22, 2025
- Applied Materials, Inc.
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS

using an inorganic non metallic glass type adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package structure and manufacturing method thereof

Integrated circuit package and method of forming the same

Heat sink for face bonded semiconductor device

Memory devices having vertical transistors and methods for forming...

Semiconductor device and method for manufacturing a semiconductor d...

Fluid channel geometry optimizations to improve cooling efficiency

Three-dimensional memory device including a bit-line-bias vertical...

Bonding method for copper-copper metal with hydrazine hydrate

Method of forming integrated chip structure having slotted bond pad...

Method of manufacturing die stack structure

Semiconductor structure, method for forming same, and wafer on wafe...

Shifted via-chain electrical-test measurements for hybrid bonding a...

Wafer bonding device and wafer bonding method

Conductive buffer layers for semiconductor die assemblies and assoc...

Method for manufacturing semiconductor device structure

Semiconductor apparatus and semiconductor apparatus manufacturing m...

Semiconductor memory device having a contact plug electrically conn...

Semiconductor die package and methods of formation

Semiconductor device and method of forming the same

Microelectronic devices, related electronic systems, and methods of...

Package-on-package device

DBI to SI bonding for simplified handle wafer

Backside contact for thermal displacement in a multi-wafer stacked...

Three-dimensional memory device and methods for forming the same

Photoelectric conversion apparatus and system

Three-dimensional memory devices and methods for forming the same

Reliable hybrid bonded apparatus

Die bonding pads and methods of forming the same

Semiconductor package and method

3D semiconductor package including memory array

Patents Applicationslast 30 patents

SELF-ASSEMBLY METHOD AND EQUIPMENT

SEMICONDUCTOR DEVICE

MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE

PROTOCOL FOR THINNING THE REAR SUBSTRATE OF INDIVIDUAL CHIPS ATTACH...

SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...

SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES HAVING CHANNEL STRUCTURES

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES

Mirror image of geometrical patterns in stacked integrated circuit...

EMBEDDED LIQUID COOLING

SEMICONDUCTOR PACKAGE

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP ATTACHING DEVICE, CHIP PROCESSING SYSTEM, AND CHIP PROCESSING...

SEMICONDUCTOR PACKAGES WITH CHIP STACK

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

MEMORY DEVICE AND FABRICATION METHOD THEREOF

PROBING BUMP PLACEMENT OVER MULTIPLE VIA OPENINGS

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...

SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE

OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...

Die Stacking with Integrated Thermal Treatment