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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/76251
using bonding techniques
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last 30 patents
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Patent Grant
Apparatus with multi-wafer based device and method for forming such
Patent number
11,948,831
Issue date
Apr 2, 2024
Intel Corporation
Anup Pancholi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Radio frequency silicon on insulator structure with superior perfor...
Patent number
11,942,360
Issue date
Mar 26, 2024
GlobalWafers Co., Ltd.
Michael R. Seacrist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Top gate recessed channel CMOS thin film transistor in the back end...
Patent number
11,929,320
Issue date
Mar 12, 2024
Intel Corporation
Gilbert Dewey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
11,923,205
Issue date
Mar 5, 2024
United Microelectronics Corporation
Kun-Ju Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Radio frequency silicon on insulator wafer platform with superior p...
Patent number
11,887,885
Issue date
Jan 30, 2024
GlobalWafers Co., Ltd.
Michael R. Seacrist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer with devices having different top layer thickne...
Patent number
11,887,987
Issue date
Jan 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of transferring device layer to transfer substrate and highl...
Patent number
11,876,014
Issue date
Jan 16, 2024
Shin-Etsu Chemical Co., Ltd.
Shigeru Konishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single crystalline silicon stack formation and bonding to a CMOS wafer
Patent number
11,869,803
Issue date
Jan 9, 2024
Micron Technology, Inc.
Si-Woo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit with biofets and fabrication thereof
Patent number
11,860,120
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Tung-Tsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit with BioFETs
Patent number
11,860,121
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Tung-Tsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Atomic layer deposition bonding for heterogeneous integration of ph...
Patent number
11,846,803
Issue date
Dec 19, 2023
OpenLight Photonics, Inc.
John Parker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure and method for manufacturing the same
Patent number
11,837,595
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for surface treatment of substrates
Patent number
11,776,842
Issue date
Oct 3, 2023
EV Group E. Thallner GmbH
Markus Wimplinger
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of room temperature covalent bonding
Patent number
11,760,059
Issue date
Sep 19, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Qin-Yi Tong
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Apparatus for bond wave propagation control
Patent number
11,742,321
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Xin-Hua Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of mechanical separation for a double layer transfer
Patent number
11,742,233
Issue date
Aug 29, 2023
Soitec
Marcel Broekaart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
Patent number
11,705,328
Issue date
Jul 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Ta Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing epitaxy substrate
Patent number
11,688,628
Issue date
Jun 27, 2023
GlobalWafers Co., Ltd.
Ying-Ru Shih
B32 - LAYERED PRODUCTS
Information
Patent Grant
Substrate for radiofrequency applications and associated manufactur...
Patent number
11,688,627
Issue date
Jun 27, 2023
Soitec
Frederic Allibert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a fluid sensor device and a fluid sensor d...
Patent number
11,676,851
Issue date
Jun 13, 2023
Imec VZW
Aurelie Humbert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a semiconductor arrangement
Patent number
11,670,539
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Che Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrates including useful layers
Patent number
11,670,540
Issue date
Jun 6, 2023
Soitec
Didier Landru
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device integrating silicon-based device with semicond...
Patent number
11,664,372
Issue date
May 30, 2023
United Microelectronics Corp.
Zhi-Biao Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor substrate and method of fabricating the same
Patent number
11,658,061
Issue date
May 23, 2023
WAFER WORKS CORPORATION
Ping-Hai Chiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SLT integrated circuit capacitor structure and methods
Patent number
11,652,112
Issue date
May 16, 2023
pSemi Corporation
Abhijeet Paul
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Radio frequency silicon on insulator structure with superior perfor...
Patent number
11,626,318
Issue date
Apr 11, 2023
GlobalWafers Co., Ltd.
Michael R. Seacrist
C30 - CRYSTAL GROWTH
Information
Patent Grant
Semiconductor-on-insulator substrate for rf applications
Patent number
11,626,319
Issue date
Apr 11, 2023
Soitec
Arnaud Castex
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication and use of through silicon vias on double sided interco...
Patent number
11,594,524
Issue date
Feb 28, 2023
Intel Corporation
Brennen K. Mueller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High resistivity SOI wafers and a method of manufacturing thereof
Patent number
11,594,446
Issue date
Feb 28, 2023
GlobalWafers Co., Ltd.
Igor Peidous
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor structure
Patent number
11,587,824
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yu-Hsiang Tsai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
TOP GATE RECESSED CHANNEL CMOS THIN FILM TRANSISTOR AND METHODS OF...
Publication number
20240136277
Publication date
Apr 25, 2024
Intel Corporation
Gilbert Dewey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT WITH BIOFETS
Publication number
20240102959
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tung-Tsun CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240105502
Publication date
Mar 28, 2024
United Microelectronics Corp.
Tien-Tsai HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NITRIDE SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Publication number
20240079412
Publication date
Mar 7, 2024
Shin-Etsu Handotai Co., Ltd.
Ippei KUBONO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING METHOD OF WAFER
Publication number
20240079243
Publication date
Mar 7, 2024
Disco Corporation
Satoshi KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240055347
Publication date
Feb 15, 2024
Macronix International Co., Ltd.
Chih-Chieh CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS
Publication number
20240047266
Publication date
Feb 8, 2024
UNITED MICROELECTRONICS CORP.
Chia-Liang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH ASSISTANT LAYER
Publication number
20240021666
Publication date
Jan 18, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ASSISTANT LAYER AND METHOD FOR FABRICATIN...
Publication number
20240021665
Publication date
Jan 18, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
Publication number
20240021461
Publication date
Jan 18, 2024
SOITEC
Marcel Broekaart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230386893
Publication date
Nov 30, 2023
United Microelectronics Corp.
Tien-Tsai HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRONG BASE-ASSISTED DIRECT BONDING METHOD
Publication number
20230386894
Publication date
Nov 30, 2023
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Frank FOURNEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEQUENTIAL COMPLIMENTARY FET INCORPORATING BACKSIDE POWER DISTRIBUT...
Publication number
20230378138
Publication date
Nov 23, 2023
TOKYO ELECTRON LIMITED
Jeffrey SMITH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLT Integrated Circuit Capacitor Structure and Methods
Publication number
20230361135
Publication date
Nov 9, 2023
pSemi Corporation
Abhijeet Paul
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR BONDING A FIRST SUBSTRATE AT A SURFACE HAVING AN ELASTIC...
Publication number
20230317510
Publication date
Oct 5, 2023
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Frank FOURNEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
Publication number
20230307231
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ta Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Hybrid Integrated Circuit Dies and Methods of Forming the Same
Publication number
20230282525
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hong-Shyang Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVE CAP FOR GERMANIUM-CONTAINING LAYER
Publication number
20230282476
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Lung Yuan Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SOI WAFER AND SOI WAFER
Publication number
20230268222
Publication date
Aug 24, 2023
Shin-Etsu Handotai Co., Ltd.
Isao YOKOKAWA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SEMICONDUCTOR STRUCTURES INCLUDING...
Publication number
20230261004
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company Limited
Harry-Hak-Lay CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
Publication number
20230246023
Publication date
Aug 3, 2023
United Microelectronics Corp.
Zhi-Biao Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR RF APPLICATIONS
Publication number
20230238274
Publication date
Jul 27, 2023
SOITEC
Arnaud Castex
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RADIO FREQUENCY SILICON ON INSULATOR STRUCTURE WITH SUPERIOR PERFOR...
Publication number
20230215759
Publication date
Jul 6, 2023
GLOBALWAFERS CO., LTD.
Michael R. Seacrist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSISTOR STACKING BY WAFER BONDING
Publication number
20230207397
Publication date
Jun 29, 2023
TOKYO ELECTRON LIMITED
Mark I. Gardner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SINGLE CRYSTAL SILICON TRANSISTOR DESIGN INTEGRATED WITH 3D WAFE...
Publication number
20230207660
Publication date
Jun 29, 2023
TOKYO ELECTRON LIMITED
Mark I. Gardner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230197467
Publication date
Jun 22, 2023
UNITED MICROELECTRONICS CORPORATION
KUN-JU LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES, SYSTEMS AND METHODS FOR ELECTROSTATIC FORCE ENHANCED SEMIC...
Publication number
20230187254
Publication date
Jun 15, 2023
Micron Technology, Inc.
Shu Qin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
N-FACE POLAR GAN-BASED DEVICE AND COMPOSITE SUBSTRATE THEREOF, AND...
Publication number
20230154785
Publication date
May 18, 2023
ENKRIS SEMICONDUCTOR, INC.
Kai CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE
Publication number
20230129131
Publication date
Apr 27, 2023
SOITEC
Bich-Yen Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRONT-SIDE TYPE IMAGE SENSORS
Publication number
20230127950
Publication date
Apr 27, 2023
SOITEC
Walter Schwarzenbach
H01 - BASIC ELECTRIC ELEMENTS