using bonding techniques

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CPC
H01L21/76251

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76251using bonding techniques

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor on insulator having a semiconductor layer with differ...
- Patent number 12,170,284
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 12,165,900
- Issue date Dec 10, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide composite wafer and manufacturing method thereof
- Patent number 12,159,855
- Issue date Dec 3, 2024
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pseudo-substrate with improved efficiency of usage of single crysta...
- Patent number 12,112,976
- Issue date Oct 8, 2024
- Soitec
- Fabrice Letertre
- C30 - CRYSTAL GROWTH
Information Patent Grant
Methods of forming a semiconductor device including active patterns...
- Patent number 12,112,952
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Sungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a crack in an edge region of a donor substrate
- Patent number 12,097,641
- Issue date Sep 24, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,094,758
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Tien-Tsai Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with assistant layer and method for fabricatin...
- Patent number 12,080,754
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanorod production method and nanorod produced thereby
- Patent number 12,074,247
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- B82 - NANO-TECHNOLOGY
Information Patent Grant
SLT integrated circuit capacitor structure and methods
- Patent number 12,062,669
- Issue date Aug 13, 2024
- Murata Manufacturing Co., Ltd.
- Abhijeet Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
- Patent number 12,062,539
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with assistant layer
- Patent number 12,051,718
- Issue date Jul 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems and methods for electrostatic force enhanced semic...
- Patent number 12,040,211
- Issue date Jul 16, 2024
- Micron Technology, Inc.
- Shu Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 12,027,413
- Issue date Jul 2, 2024
- Vanguard International Semiconductor Corporation
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture hermetic guard ring for semiconductor on insulator devices
- Patent number 12,014,996
- Issue date Jun 18, 2024
- Intel Corporation
- Mohammad Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strained semiconductor using elastic edge relaxation of a stressor...
- Patent number 11,978,800
- Issue date May 7, 2024
- ACORN SEMI, LLC
- Paul A. Clifton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator (SOI) semiconductor structures including...
- Patent number 11,978,740
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with multi-wafer based device and method for forming such
- Patent number 11,948,831
- Issue date Apr 2, 2024
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon on insulator structure with superior perfor...
- Patent number 11,942,360
- Issue date Mar 26, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top gate recessed channel CMOS thin film transistor in the back end...
- Patent number 11,929,320
- Issue date Mar 12, 2024
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,923,205
- Issue date Mar 5, 2024
- United Microelectronics Corporation
- Kun-Ju Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon on insulator wafer platform with superior p...
- Patent number 11,887,885
- Issue date Jan 30, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with devices having different top layer thickne...
- Patent number 11,887,987
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring device layer to transfer substrate and highl...
- Patent number 11,876,014
- Issue date Jan 16, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shigeru Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single crystalline silicon stack formation and bonding to a CMOS wafer
- Patent number 11,869,803
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with biofets and fabrication thereof
- Patent number 11,860,120
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Tsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with BioFETs
- Patent number 11,860,121
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Tsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition bonding for heterogeneous integration of ph...
- Patent number 11,846,803
- Issue date Dec 19, 2023
- OpenLight Photonics, Inc.
- John Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for manufacturing the same
- Patent number 11,837,595
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...
- Publication number 20240429057
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Sungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectromechanical Systems (MEMS) Fabrication Process Including...
- Publication number 20240395540
- Publication date Nov 28, 2024
- StethX Microsystems
- Farrokh Ayazi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SUPPORT SUBSTRATE PROVIDED WITH A CHARGE-TRA...
- Publication number 20240387243
- Publication date Nov 21, 2024
- SOITEC
- Youngpil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387242
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-YING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT DIES
- Publication number 20240379462
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...
- Publication number 20240371882
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS AND METHODS FOR ELECTROSTATIC FORCE ENHANCED SEMIC...
- Publication number 20240363384
- Publication date Oct 31, 2024
- Micron Technology, Inc.
- Shu Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
- Publication number 20240355618
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN ELECTROLESS DEPOSITION
- Publication number 20240355676
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Marvin L. Bernt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240321626
- Publication date Sep 26, 2024
- Vanguard International Semiconductor Corporation
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240297045
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND PREPARATION METHOD THEREOF, AND SEMICONDUCT...
- Publication number 20240297069
- Publication date Sep 5, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR-ON-INSULATOR WAFERS HAVING C...
- Publication number 20240258155
- Publication date Aug 1, 2024
- GLOBALWAFERS CO., LTD.
- Charles R. Lottes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STACK STRUCTURE WITH ULTRA T...
- Publication number 20240249973
- Publication date Jul 25, 2024
- Tzu-wei CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SEMICONDUCTOR STRUCTURES INCLUDING...
- Publication number 20240250089
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAINED SEMICONDUCTOR USING ELASTIC EDGE RELAXATION OF A STRESSOR...
- Publication number 20240250172
- Publication date Jul 25, 2024
- Acorn Semi, LLC
- Paul A. Clifton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
- Publication number 20240243006
- Publication date Jul 18, 2024
- TOKYO ELECTRON LIMITED
- Scott Lefevre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE-AREA III-V SEMICONDUCTOR LAYER TRANSFERRING METHOD
- Publication number 20240213085
- Publication date Jun 27, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ho Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A PATTERNED FD-SOI WAFER
- Publication number 20240170325
- Publication date May 23, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Steve Nagel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH DEVICES HAVING DIFFERENT TOP LAYER THICKNE...
- Publication number 20240170489
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240170299
- Publication date May 23, 2024
- UNITED MICROELECTRONICS CORPORATION
- KUN-JU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE CRYSTALLINE SILICON STACK FORMATION AND BONDING TO A CMOS WAFER
- Publication number 20240153813
- Publication date May 9, 2024
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES
- Publication number 20240145410
- Publication date May 2, 2024
- Intel Corporation
- Mohammad Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP GATE RECESSED CHANNEL CMOS THIN FILM TRANSISTOR AND METHODS OF...
- Publication number 20240136277
- Publication date Apr 25, 2024
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH BIOFETS
- Publication number 20240102959
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Tsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240105502
- Publication date Mar 28, 2024
- United Microelectronics Corp.
- Tien-Tsai HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240079412
- Publication date Mar 7, 2024
- Shin-Etsu Handotai Co., Ltd.
- Ippei KUBONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20240079243
- Publication date Mar 7, 2024
- Disco Corporation
- Satoshi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240055347
- Publication date Feb 15, 2024
- Macronix International Co., Ltd.
- Chih-Chieh CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS
- Publication number 20240047266
- Publication date Feb 8, 2024
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS

using bonding techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor on insulator having a semiconductor layer with differ...

Method of mechanical separation for a double layer transfer

Silicon carbide composite wafer and manufacturing method thereof

Semiconductor device package and manufacturing method thereof

Pseudo-substrate with improved efficiency of usage of single crysta...

Methods of forming a semiconductor device including active patterns...

Method for forming a crack in an edge region of a donor substrate

Semiconductor structure and method for manufacturing the same

Semiconductor device with assistant layer and method for fabricatin...

Nanorod production method and nanorod produced thereby

SLT integrated circuit capacitor structure and methods

Semiconductor-on-insulator (SOI) substrate and method for forming

Method for fabricating semiconductor device with assistant layer

Devices, systems and methods for electrostatic force enhanced semic...

Semiconductor structure and method of fabricating the same

Moisture hermetic guard ring for semiconductor on insulator devices

Strained semiconductor using elastic edge relaxation of a stressor...

Semiconductor-on-insulator (SOI) semiconductor structures including...

Apparatus with multi-wafer based device and method for forming such

Radio frequency silicon on insulator structure with superior perfor...

Top gate recessed channel CMOS thin film transistor in the back end...

Method for manufacturing semiconductor device

Radio frequency silicon on insulator wafer platform with superior p...

Semiconductor wafer with devices having different top layer thickne...

Method of transferring device layer to transfer substrate and highl...

Single crystalline silicon stack formation and bonding to a CMOS wafer

Integrated circuit with biofets and fabrication thereof

Integrated circuit with BioFETs

Atomic layer deposition bonding for heterogeneous integration of ph...

Semiconductor device structure and method for manufacturing the same

Patents Applicationslast 30 patents

METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...

Microelectromechanical Systems (MEMS) Fabrication Process Including...

METHOD FOR PREPARING A SUPPORT SUBSTRATE PROVIDED WITH A CHARGE-TRA...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

HYBRID INTEGRATED CIRCUIT DIES

SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...

DEVICES, SYSTEMS AND METHODS FOR ELECTROSTATIC FORCE ENHANCED SEMIC...

SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING

PROCESS FOR THIN ELECTROLESS DEPOSITION

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COMPOSITE SUBSTRATE AND PREPARATION METHOD THEREOF, AND SEMICONDUCT...

METHODS OF MANUFACTURING SEMICONDUCTOR-ON-INSULATOR WAFERS HAVING C...

METHOD FOR MANUFACTURING SEMICONDUCTOR STACK STRUCTURE WITH ULTRA T...

SEMICONDUCTOR-ON-INSULATOR (SOI) SEMICONDUCTOR STRUCTURES INCLUDING...

STRAINED SEMICONDUCTOR USING ELASTIC EDGE RELAXATION OF A STRESSOR...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES

LARGE-AREA III-V SEMICONDUCTOR LAYER TRANSFERRING METHOD

METHOD FOR FABRICATING A PATTERNED FD-SOI WAFER

SEMICONDUCTOR WAFER WITH DEVICES HAVING DIFFERENT TOP LAYER THICKNE...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SINGLE CRYSTALLINE SILICON STACK FORMATION AND BONDING TO A CMOS WAFER

MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES

TOP GATE RECESSED CHANNEL CMOS THIN FILM TRANSISTOR AND METHODS OF...

INTEGRATED CIRCUIT WITH BIOFETS

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

NITRIDE SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREFOR

PROCESSING METHOD OF WAFER

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS