using different masks

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H01L2224/03903

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03903using different masks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,652,076
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,355,467
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 10,910,331
- Issue date Feb 2, 2021
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level device and method with cantilever pillar structure
- Patent number 9,806,047
- Issue date Oct 31, 2017
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 9,780,063
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,673,139
- Issue date Jun 6, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroshige Hirano
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 9,576,923
- Issue date Feb 21, 2017
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for wafer-level processing of QFN packages
- Patent number 9,472,451
- Issue date Oct 18, 2016
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 9,209,146
- Issue date Dec 8, 2015
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating structure for wafer level packages
- Patent number 9,070,675
- Issue date Jun 30, 2015
- Amkor Technology, Inc.
- Kwang Sup So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having under-bump metallization (UBM) structur...
- Patent number 9,059,158
- Issue date Jun 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines and pads and method of manufacturing thereof
- Patent number 9,006,898
- Issue date Apr 14, 2015
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 8,907,487
- Issue date Dec 9, 2014
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 8,866,293
- Issue date Oct 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for wafer-level processing of QFN packages
- Patent number 8,860,222
- Issue date Oct 14, 2014
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 8,835,301
- Issue date Sep 16, 2014
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having under-bump metallization (UBM) structur...
- Patent number 8,803,338
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming wafer-level chip scale package structures with reduced numb...
- Patent number 8,735,273
- Issue date May 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines and pads and method of manufacturing thereof
- Patent number 8,586,472
- Issue date Nov 19, 2013
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump metallization (UBM) structure and method of forming the...
- Patent number 8,581,420
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and semiconductor apparatus unit
- Patent number 8,492,896
- Issue date Jul 23, 2013
- Panasonic Corporation
- Sumiaki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer via structure
- Patent number 8,405,223
- Issue date Mar 26, 2013
- Princo Middle East FZE
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and manufacturing method of semiconductor s...
- Patent number 8,319,346
- Issue date Nov 27, 2012
- Teramikros, Inc.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 8,273,662
- Issue date Sep 25, 2012
- Hynix Semiconductor Inc.
- Hyung Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package (WLP) device having bump assemblies including a...
- Patent number 8,259,464
- Issue date Sep 4, 2012
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 7,838,412
- Issue date Nov 23, 2010
- Hynix Semiconductor Inc.
- Hyung Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making solder pad
- Patent number 7,566,648
- Issue date Jul 28, 2009
- Freescale Semiconductor Inc.
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
- Publication number 20220262757
- Publication date Aug 18, 2022
- Samsung Electronics Co., LTD
- Taeho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
- Publication number 20210217720
- Publication date Jul 15, 2021
- Samsung Electronics Co., Ltd.
- Taeho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...
- Publication number 20140327136
- Publication date Nov 6, 2014
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20140319680
- Publication date Oct 30, 2014
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating Structure For Wafer Level Packages
- Publication number 20140070408
- Publication date Mar 13, 2014
- Kwang Sup So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20140048940
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...
- Publication number 20140042619
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20130334683
- Publication date Dec 19, 2013
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Die And Method Of Fabricating
- Publication number 20130193569
- Publication date Aug 1, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Licheng Marshal Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES
- Publication number 20130161817
- Publication date Jun 27, 2013
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Wafer-Level Chip Scale Package Structures with Reduced numb...
- Publication number 20130009307
- Publication date Jan 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20120315726
- Publication date Dec 13, 2012
- HAK-KYOON BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick A...
- Publication number 20120299187
- Publication date Nov 29, 2012
- BROADCOM CORPORATION
- Kent Charles OERTLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120280384
- Publication date Nov 8, 2012
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20120217640
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE...
- Publication number 20120091576
- Publication date Apr 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20120013011
- Publication date Jan 19, 2012
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER VIA STRUCTURE
- Publication number 20120007254
- Publication date Jan 12, 2012
- PRINCO CORP.
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGE (WLP) DEVICE HAVING BUMP ASSEMBLIES INCLUDING A...
- Publication number 20110317385
- Publication date Dec 29, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS UNIT
- Publication number 20110285008
- Publication date Nov 24, 2011
- Sumiaki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR S...
- Publication number 20110233787
- Publication date Sep 29, 2011
- CASIO COMPUTER CO., LTD.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Semiconductor Device
- Publication number 20110027983
- Publication date Feb 3, 2011
- Hynix Semiconductor Inc.
- Hyung Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Semiconductor Device
- Publication number 20090111258
- Publication date Apr 30, 2009
- Hyung Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SOLDER PAD
- Publication number 20080258297
- Publication date Oct 23, 2008
- Heng Keong YIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080050905
- Publication date Feb 28, 2008
- Kabushiki Kaisha Toshiba
- Masayuki UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS

using different masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices including thick pad

Semiconductor device bonding area including fused solder film and m...

Semiconductor devices including thick pad

Semiconductor chip with patterned underbump metallization and polym...

Semiconductor device bonding area including fused solder film and m...

Wafer level device and method with cantilever pillar structure

Semiconductor device and method of forming bump structure with insu...

Semiconductor device

Semiconductor chip with patterned underbump metallization and polym...

Technique for wafer-level processing of QFN packages

Electronic device packages having bumps and methods of manufacturin...

Plating structure for wafer level packages

Semiconductor device having under-bump metallization (UBM) structur...

Conductive lines and pads and method of manufacturing thereof

Electronic device packages having bumps and methods of manufacturin...

Semiconductor structure and fabrication method thereof

Techniques for wafer-level processing of QFN packages

Semiconductor device and method of forming bump structure with insu...

Semiconductor device having under-bump metallization (UBM) structur...

Forming wafer-level chip scale package structures with reduced numb...

Conductive lines and pads and method of manufacturing thereof

Under-bump metallization (UBM) structure and method of forming the...

Semiconductor apparatus and semiconductor apparatus unit

Multi-layer via structure

Semiconductor structure and manufacturing method of semiconductor s...

Method for manufacturing a semiconductor device

Wafer level package (WLP) device having bump assemblies including a...

Method for manufacturing a semiconductor device

Method of making solder pad

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES INCLUDING THICK PAD

SEMICONDUCTOR DEVICES INCLUDING THICK PAD

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...

Semiconductor Device and Method of Forming Bump Structure with Insu...

Plating Structure For Wafer Level Packages

Conductive Lines and Pads and Method of Manufacturing Thereof

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...

ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...

Integrated Circuit Die And Method Of Fabricating

TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES

Forming Wafer-Level Chip Scale Package Structures with Reduced numb...

METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE

Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick A...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor Device and Method of Forming Bump Structure with Insu...

UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE...

Conductive Lines and Pads and Method of Manufacturing Thereof

MULTI-LAYER VIA STRUCTURE

WAFER LEVEL PACKAGE (WLP) DEVICE HAVING BUMP ASSEMBLIES INCLUDING A...

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS UNIT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR S...

Method for Manufacturing a Semiconductor Device

Method for Manufacturing a Semiconductor Device

METHOD OF MAKING SOLDER PAD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE