using electric resistance welding

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H01L2224/84238

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/84238using electric resistance welding

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Patents Grantslast 30 patents

Information Patent Grant
High density and durable semiconductor device interconnect
- Patent number 11,756,923
- Issue date Sep 12, 2023
- Infineon Technologies AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY AND DURABLE SEMICONDUCTOR DEVICE INTERCONNECT
- Publication number 20230063259
- Publication date Mar 2, 2023
- INFINEON TECHNOLOGIES AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS