using electric resistance welding

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H01L2224/83238

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83238using electric resistance welding

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Patents Grantslast 30 patents

Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-conductivity bonding of metal nanowire arrays
- Patent number 10,180,288
- Issue date Jan 15, 2019
- Northrop Grumman Systems Corporation
- John A. Starkovich
- B82 - NANO-TECHNOLOGY
Information Patent Grant
High-conductivity bonding of metal nanowire arrays
- Patent number 9,601,452
- Issue date Mar 21, 2017
- Northrup Grumman Systems Corporation
- John A. Starkovich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device and method for producing a power semicon...
- Patent number 9,111,900
- Issue date Aug 18, 2015
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,754,533
- Issue date Jul 13, 2010
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220254745
- Publication date Aug 11, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220130783
- Publication date Apr 28, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327739
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327740
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20200350281
- Publication date Nov 5, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190157241
- Publication date May 23, 2019
- Toyota Jidosha Kabushiki Kaisha
- Satoru TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS
- Publication number 20160372438
- Publication date Dec 22, 2016
- Northrop Grumman Systems Corporation
- John A. Starkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor device and method for producing a power semicon...
- Publication number 20150061112
- Publication date Mar 5, 2015
- SEMIKRON Elektronik GmbH & Co., KG
- Ingo BOGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD
- Publication number 20120279653
- Publication date Nov 8, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method Of Manufacturing Semiconductor Package Board
- Publication number 20120122278
- Publication date May 17, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwan Ho LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20100055839
- Publication date Mar 4, 2010
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS

using electric resistance welding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective transfer of micro devices

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

High-conductivity bonding of metal nanowire arrays

High-conductivity bonding of metal nanowire arrays

Power semiconductor device and method for producing a power semicon...

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF MICRO DEVICES

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS

Power semiconductor device and method for producing a power semicon...

HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD

Method Of Manufacturing Semiconductor Package Board

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE