using electric resistance welding

Industry

CPC
H01L2224/81238

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81238using electric resistance welding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flip-chip hybridization of microelectronic components using suspend...
- Patent number 9,165,915
- Issue date Oct 20, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridization of microelectronic components by local heat...
- Patent number 9,111,924
- Issue date Aug 18, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20220254751
- Publication date Aug 11, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TRANSFERRING SYSTEM AND CHIP-TRANSFERRING METHOD
- Publication number 20220093557
- Publication date Mar 24, 2022
- Skiileux Electricity Inc.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP INITIAL STRUCTURE, SUBSTRATE STRUCTURE, CHIP TRANSFERRING...
- Publication number 20210320088
- Publication date Oct 14, 2021
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER BOARD HAVING HEATING FUNCTION AND ELECTRONIC DEVICE USIN...
- Publication number 20210134695
- Publication date May 6, 2021
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERCONNECTION STRUCTURE, CHIP, AND CHIP INTERCONNECTION METHOD
- Publication number 20210050330
- Publication date Feb 18, 2021
- Shenzhen Goodix Technology Co., Ltd.
- Hanjian LENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPEND...
- Publication number 20140220737
- Publication date Aug 7, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...
- Publication number 20140210076
- Publication date Jul 31, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS

using electric resistance welding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flip-chip hybridization of microelectronic components using suspend...

Flip-chip hybridization of microelectronic components by local heat...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

CHIP-TRANSFERRING SYSTEM AND CHIP-TRANSFERRING METHOD

LED CHIP INITIAL STRUCTURE, SUBSTRATE STRUCTURE, CHIP TRANSFERRING...

INTERPOSER BOARD HAVING HEATING FUNCTION AND ELECTRONIC DEVICE USIN...

CHIP INTERCONNECTION STRUCTURE, CHIP, AND CHIP INTERCONNECTION METHOD

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPEND...

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...