using electro-static corona discharge

Follow

Industry

CPC
H01L2224/80236

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80236using electro-static corona discharge

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Silicon carbide composite wafer and manufacturing method thereof
- Patent number 12,159,855
- Issue date Dec 3, 2024
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION
- Publication number 20240071984
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON CARBIDE COMPOSITE WAFER AND MANUFACTURING METHOD THEREOF
- Publication number 20220384385
- Publication date Dec 1, 2022
- Hong Chuang Applied Technology Co., Ltd
- Yan-Kai ZENG
- H01 - BASIC ELECTRIC ELEMENTS