using epoxydisednovolak resin

Industry

CPC
G03F7/0385

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Parent Industries

GPHYSICS G03Photography G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES G03F7/00Photomechanical

Current Industry

G03F7/0385using epoxydisednovolak resin

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hollow package and method for manufacturing same
- Patent number 11,955,394
- Issue date Apr 9, 2024
- Nippon Kayaku Kabushiki Kaisha
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photoimageable compositions and processes for fabrication of relief...
- Patent number 11,635,688
- Issue date Apr 25, 2023
- KAYAKU ADVANCED MATERIALS, INC.
- Daniel J. Nawrocki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive epoxy resin composition for formation of optical wav...
- Patent number 11,421,072
- Issue date Aug 23, 2022
- Nitto Denko Corporation
- Tomoyuki Hirayama
- G02 - OPTICS
Information Patent Grant
Negative type photosensitive resin composition, photosensitive resi...
- Patent number 11,415,888
- Issue date Aug 16, 2022
- Tokyo Ohka Kogyo Co., Ltd.
- Ryosuke Nakamura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition, photosensitive resin laminate, an...
- Patent number 11,294,283
- Issue date Apr 5, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoichiro Ichioka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for making three dimensional structures using photolithograp...
- Patent number 11,143,959
- Issue date Oct 12, 2021
- Mercene Labs AB
- Carl Fredrik Carlborg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Negative-type photosensitive resin composition, cured film, display...
- Patent number 10,983,436
- Issue date Apr 20, 2021
- Toray Industries, Inc.
- Yugo Tanigaki
- G02 - OPTICS
Information Patent Grant
Photosensitive resin composition for optical waveguide and photocur...
- Patent number 10,858,475
- Issue date Dec 8, 2020
- Nitto Denko Corporation
- Tomoyuki Hirayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin composition and electronic device including cu...
- Patent number 10,775,698
- Issue date Sep 15, 2020
- Samsung Display Co., Ltd.
- Yuiku Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing cliché for offset printing, and cliché for...
- Patent number 10,696,081
- Issue date Jun 30, 2020
- LG Chem, Ltd.
- Yong Goo Son
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for manufacturing MEMS devices and nano devices with varying...
- Patent number 10,599,034
- Issue date Mar 24, 2020
- Funai Electric Co., Ltd.
- David L. Bernard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Surfaces with tunable adhesion based on composite structures and me...
- Patent number 10,549,483
- Issue date Feb 4, 2020
- The Trustees of the University of Pennsylvania
- Kevin Turner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Liquid solder resist composition and covered-printed wiring board
- Patent number 10,527,937
- Issue date Jan 7, 2020
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Low Dk/Df solder resistant composition use for printed circuit board
- Patent number 10,527,936
- Issue date Jan 7, 2020
- Nan Ya Plastics Corporation
- Cheng-Chung Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Compound, photopolymerization initiator comprising said compound, a...
- Patent number 10,508,078
- Issue date Dec 17, 2019
- Tokyo University of Science Foundation
- Kiwamu Terada
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition, photosensitive film, and method f...
- Patent number 10,324,375
- Issue date Jun 18, 2019
- Hitachi Chemical Company, Ltd.
- Kenichi Iwashita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive epoxy resin composition, curable film for formation...
- Patent number 10,288,770
- Issue date May 14, 2019
- Nitto Denko Corporation
- Tomoyuki Hirayama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Liquid solder resist composition and printed wiring board
- Patent number 10,254,647
- Issue date Apr 9, 2019
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Tetracarboxylic acid diester compound, polyimide precursor polymer...
- Patent number 10,216,085
- Issue date Feb 26, 2019
- Shin-Etsu Chemical Co., Ltd.
- Katsuya Takemura
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Photosensitive resin composition and cured product thereof
- Patent number 10,197,913
- Issue date Feb 5, 2019
- Tokyo University of Science Foundation
- Koji Arimitsu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Solder resist composition, and covered-printed wiring board
- Patent number 10,151,976
- Issue date Dec 11, 2018
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition, dry film using same, printed wiri...
- Patent number 10,111,328
- Issue date Oct 23, 2018
- HTACHI CHEMICAL COMPANY, LTD.
- Nobuhito Komuro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive dry film and process for producing printed wiring bo...
- Patent number 9,891,523
- Issue date Feb 13, 2018
- TAIYO INK MFG. CO., LTD.
- Daichi Okamoto
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive negative resin composition
- Patent number 9,707,757
- Issue date Jul 18, 2017
- Canon Kabushiki Kaisha
- Hyou Takahashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive epoxy resin composition, curable film for formation...
- Patent number 9,459,530
- Issue date Oct 4, 2016
- Nitto Denko Corporation
- Tomoyuki Hirayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carboxyl-containing resin, resin composition for solder mask, and m...
- Patent number 9,458,284
- Issue date Oct 4, 2016
- Goo Chemical Co., Ltd.
- Michiya Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Negative photosensitive resin composition, cured resin film, partit...
- Patent number 9,459,529
- Issue date Oct 4, 2016
- Asahi Glass Company, Limited
- Keigo Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Preparation method of printing plate for alignment film
- Patent number 9,381,733
- Issue date Jul 5, 2016
- BOE Technology Group Co., Ltd.
- Hongpeng Li
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Photosensitive resin composition, pattern formed using same and dis...
- Patent number 9,341,946
- Issue date May 17, 2016
- LG Chem, Ltd.
- Kwang Han Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photosensitive resin composition and uses thereof
- Patent number 9,285,681
- Issue date Mar 15, 2016
- Chi Mei Corporation
- Li-Ting Hsieh
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
POLYCARBOXYLATE COMPOUND, RESIST COMPOSITION COMPRISING THE SAME AN...
- Publication number 20240317672
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dmitry ANDROSOV
- C07 - ORGANIC CHEMISTRY
Information Patent Application
PHOTO-DEFINABLE HYDROPHOBIC COMPOSITIONS
- Publication number 20240192599
- Publication date Jun 13, 2024
- Hewlett-Packard Development Company, L.P.
- Bo Song
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
RESIN MEMBRANE FILTER AND MANUFACTURING METHOD OF RESIN MEMBRANE FI...
- Publication number 20240139686
- Publication date May 2, 2024
- FUJIFILM CORPORATION
- Hiroyuki YONEZAWA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
NEGATIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMATION METHOD
- Publication number 20240045330
- Publication date Feb 8, 2024
- Tokyo Ohka Kogyo Co., Ltd.
- Shota Katayama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MICROCAPSULE IMAGING SYSTEM INCLUDING NON-PHOTOPOLYMERIZABLE REACTI...
- Publication number 20230393459
- Publication date Dec 7, 2023
- Polaroid IP B.V.
- Wei You
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CHEMICAL-RESISTANT PROTECTIVE FILM
- Publication number 20230333470
- Publication date Oct 19, 2023
- NISSAN CHEMICAL CORPORATION
- Tokio NISHITA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
A PHOTOCURABLE COMPOSITION
- Publication number 20230229081
- Publication date Jul 20, 2023
- Huntsman Advanced Materials Licensing (Switzerland)GmbH
- Yiwan Shu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MICROSTRUCTURE, METHOD FOR MANUFACTURING L...
- Publication number 20230144597
- Publication date May 11, 2023
- Canon Kabushiki Kaisha
- Yohei Hamade
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, SHAPED PRODUCT, METHOD FOR MANUFA...
- Publication number 20230090580
- Publication date Mar 23, 2023
- Canon Kabushiki Kaisha
- Miho Ishii
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CURED COATING FILM
- Publication number 20220390844
- Publication date Dec 8, 2022
- TAIYO INK MFG. CO., LTD.
- Nobuyuki YANAGIDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITION FOR FORMING UNDERLAYER FILM, RESIST PATTERN FORMING MET...
- Publication number 20220283499
- Publication date Sep 8, 2022
- FUJIFILM CORPORATION
- Takeshi KAWABATA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Hollow Package And Method For Manufacturing Same
- Publication number 20220068737
- Publication date Mar 3, 2022
- SUMITOMO BAKELITE CO., LTD.
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTOSENSITIVE DRY FILM, AND PRINTED WIRING BOARD WITH PHOTOSENSITI...
- Publication number 20220066322
- Publication date Mar 3, 2022
- TAMURA CORPORATION
- Ryoya TAKASHIMA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTORESIST COMPOSITION, LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE...
- Publication number 20210223693
- Publication date Jul 22, 2021
- Canon Kabushiki Kaisha
- Yohei Hamade
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive Resin Composition And Cured Product Therefrom
- Publication number 20210124265
- Publication date Apr 29, 2021
- Nipppon Kayaku Kabushiki Kaisha
- Yoshihiro Hakone
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive dry film sheets
- Publication number 20200209744
- Publication date Jul 2, 2020
- Donald W Johnson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE EPOXY RESIN COMPOSITION FOR FORMATION OF OPTICAL WAV...
- Publication number 20200071454
- Publication date Mar 5, 2020
- NITTO DENKO CORPORATION
- Tomoyuki HIRAYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AN...
- Publication number 20190294045
- Publication date Sep 26, 2019
- Shin-Etsu Chemical Co., Ltd.
- Yoichiro Ichioka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESI...
- Publication number 20190235380
- Publication date Aug 1, 2019
- Tokyo Ohka Kogyo Co., Ltd.
- Ryosuke NAKAMURA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
NEGATIVE PHOTORESIST COMPOSITION FOR KRF LASER, HAVING HIGH RESOLUT...
- Publication number 20190101827
- Publication date Apr 4, 2019
- YOUNG CHANG CHEMICAL CO., LTD
- Seung Hun LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, DISPLAY...
- Publication number 20190072851
- Publication date Mar 7, 2019
- TORAY INDUSTRIES, INC.
- Yugo TANIGAKI
- G02 - OPTICS
Information Patent Application
PHOTO-IMAGEABLE THIN FILMS WITH HIGH DIELECTRIC CONSTANTS
- Publication number 20190056665
- Publication date Feb 21, 2019
- DOW GLOBAL TECHNOLOGIES LLC
- Caroline Woelfle-Gupta
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER...
- Publication number 20180024434
- Publication date Jan 25, 2018
- Shin-Etsu Chemical Co., Ltd.
- Katsuya TAKEMURA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
METHOD FOR MANUFACTURING CLICHÉ FOR OFFSET PRINTING, AND CLICHÉ FOR...
- Publication number 20170368862
- Publication date Dec 28, 2017
- LG CHEM, LTD.
- Yong Goo SON
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD
- Publication number 20170336708
- Publication date Nov 23, 2017
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compositions Including Magnetic Materials
- Publication number 20170301441
- Publication date Oct 19, 2017
- SIMON FRASER UNIVERSITY
- Bonnie GRAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF
- Publication number 20170293225
- Publication date Oct 12, 2017
- TOKYO UNIVERSITY OF SCIENCE FOUNDATION
- Koji ARIMITSU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SURFACES WITH TUNABLE ADHESION BASED ON COMPOSITE STRUCTURES AND ME...
- Publication number 20170087763
- Publication date Mar 30, 2017
- The Trustees of the University of Pennsylvania
- Kevin TURNER
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CORE-SHELL NANOPARTICLES, METHODS OF MAKING SAME, AND USES OF SAME
- Publication number 20160202606
- Publication date Jul 14, 2016
- THE RESEARH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK
- Paras N. Prasad
- G01 - MEASURING TESTING
Information Patent Application
PHOTOSENSITIVE EPOXY RESIN COMPOSITION, CURABLE FILM FOR FORMATION...
- Publication number 20160085151
- Publication date Mar 24, 2016
- Nitto Denko Corporation
- Tomoyuki Hirayama
- G02 - OPTICS

using epoxydisednovolak resin

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hollow package and method for manufacturing same

Photoimageable compositions and processes for fabrication of relief...

Photosensitive epoxy resin composition for formation of optical wav...

Negative type photosensitive resin composition, photosensitive resi...

Photosensitive resin composition, photosensitive resin laminate, an...

Method for making three dimensional structures using photolithograp...

Negative-type photosensitive resin composition, cured film, display...

Photosensitive resin composition for optical waveguide and photocur...

Photosensitive resin composition and electronic device including cu...

Method for manufacturing cliché for offset printing, and cliché for...

Method for manufacturing MEMS devices and nano devices with varying...

Surfaces with tunable adhesion based on composite structures and me...

Liquid solder resist composition and covered-printed wiring board

Low Dk/Df solder resistant composition use for printed circuit board

Compound, photopolymerization initiator comprising said compound, a...

Photosensitive resin composition, photosensitive film, and method f...

Photosensitive epoxy resin composition, curable film for formation...

Liquid solder resist composition and printed wiring board

Tetracarboxylic acid diester compound, polyimide precursor polymer...

Photosensitive resin composition and cured product thereof

Solder resist composition, and covered-printed wiring board

Photosensitive resin composition, dry film using same, printed wiri...

Photosensitive dry film and process for producing printed wiring bo...

Photosensitive negative resin composition

Photosensitive epoxy resin composition, curable film for formation...

Carboxyl-containing resin, resin composition for solder mask, and m...

Negative photosensitive resin composition, cured resin film, partit...

Preparation method of printing plate for alignment film

Photosensitive resin composition, pattern formed using same and dis...

Photosensitive resin composition and uses thereof

Patents Applicationslast 30 patents

POLYCARBOXYLATE COMPOUND, RESIST COMPOSITION COMPRISING THE SAME AN...

PHOTO-DEFINABLE HYDROPHOBIC COMPOSITIONS

RESIN MEMBRANE FILTER AND MANUFACTURING METHOD OF RESIN MEMBRANE FI...

NEGATIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMATION METHOD

MICROCAPSULE IMAGING SYSTEM INCLUDING NON-PHOTOPOLYMERIZABLE REACTI...

CHEMICAL-RESISTANT PROTECTIVE FILM

A PHOTOCURABLE COMPOSITION

METHOD FOR MANUFACTURING MICROSTRUCTURE, METHOD FOR MANUFACTURING L...

PHOTOSENSITIVE RESIN COMPOSITION, SHAPED PRODUCT, METHOD FOR MANUFA...

CURED COATING FILM

COMPOSITION FOR FORMING UNDERLAYER FILM, RESIST PATTERN FORMING MET...

Hollow Package And Method For Manufacturing Same

PHOTOSENSITIVE DRY FILM, AND PRINTED WIRING BOARD WITH PHOTOSENSITI...

PHOTORESIST COMPOSITION, LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE...

Photosensitive Resin Composition And Cured Product Therefrom

Photosensitive dry film sheets

PHOTOSENSITIVE EPOXY RESIN COMPOSITION FOR FORMATION OF OPTICAL WAV...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AN...

NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESI...

NEGATIVE PHOTORESIST COMPOSITION FOR KRF LASER, HAVING HIGH RESOLUT...

NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, DISPLAY...

PHOTO-IMAGEABLE THIN FILMS WITH HIGH DIELECTRIC CONSTANTS

TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER...

METHOD FOR MANUFACTURING CLICHÉ FOR OFFSET PRINTING, AND CLICHÉ FOR...

SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD

Compositions Including Magnetic Materials

PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF

SURFACES WITH TUNABLE ADHESION BASED ON COMPOSITE STRUCTURES AND ME...

CORE-SHELL NANOPARTICLES, METHODS OF MAKING SAME, AND USES OF SAME

PHOTOSENSITIVE EPOXY RESIN COMPOSITION, CURABLE FILM FOR FORMATION...