using laser direct writing

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CPC
H01L2224/82103

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82103using laser direct writing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method to electrically connect chip with top connectors using 3D pr...
- Patent number 12,046,575
- Issue date Jul 23, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection of circuit elements on a substrate witho...
- Patent number 11,881,466
- Issue date Jan 23, 2024
- Orbotech Ltd.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,569,196
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,133,281
- Issue date Sep 28, 2021
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 10,522,524
- Issue date Dec 31, 2019
- LG Display Co., Ltd.
- Seungchul Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for printing integrated circuit bond connections
- Patent number 9,935,028
- Issue date Apr 3, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with printed bond connections
- Patent number 9,824,948
- Issue date Nov 21, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a fan-out WLP with package
- Patent number 9,337,165
- Issue date May 10, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out microelectronic unit WLP having interconnects comprising a...
- Patent number 8,890,304
- Issue date Nov 18, 2014
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct write interconnections and method of manufacturing thereof
- Patent number 8,716,870
- Issue date May 6, 2014
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device comprising conductors made of carbonized plastic,...
- Patent number 7,709,379
- Issue date May 4, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with conductor tracks between semiconductor ch...
- Patent number 7,443,019
- Issue date Oct 28, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system to manufacture stacked chip devices
- Patent number 6,777,648
- Issue date Aug 17, 2004
- Intel Corporation
- Boyd L. Coomer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240250062
- Publication date Jul 25, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...
- Publication number 20240145429
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Riccardo VILLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnection Of Circuit Elements On A Substrate Witho...
- Publication number 20210028141
- Publication date Jan 28, 2021
- ORBOTECH LTD.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PR...
- Publication number 20200350275
- Publication date Nov 5, 2020
- IO TECH GROUP LTD.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190006335
- Publication date Jan 3, 2019
- LG Display Co., Ltd.
- Seungchul LEE
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
3D Printed Hermetic Package Assembly and Method
- Publication number 20180053702
- Publication date Feb 22, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remapped Packaged Extracted Die with 3D Printed Bond Connections
- Publication number 20180040529
- Publication date Feb 8, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for printing integrated circuit bond connections
- Publication number 20140252584
- Publication date Sep 11, 2014
- GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT WRITE INTERCONNECTIONS AND METHOD OF MANUFACTURING THEREOF
- Publication number 20130154110
- Publication date Jun 20, 2013
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WLP WITH PACKAGE
- Publication number 20120313253
- Publication date Dec 13, 2012
- Tessera, Inc.
- Yoshikuni Nakadaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical device comprising conductors made of carbonized plastic,...
- Publication number 20070113305
- Publication date May 17, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with conductor tracks between semiconductor ch...
- Publication number 20070034997
- Publication date Feb 15, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system to manufacture stacked chip devices
- Publication number 20040222512
- Publication date Nov 11, 2004
- Intel Corporation
- Boyd L. Coomer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system to manufacture stacked chip devices
- Publication number 20030132527
- Publication date Jul 17, 2003
- Boyd L. Coomer
- H01 - BASIC ELECTRIC ELEMENTS

using laser direct writing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method to electrically connect chip with top connectors using 3D pr...

Electrical interconnection of circuit elements on a substrate witho...

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Display device and method for fabricating the same

Remapped packaged extracted die with 3D printed bond connections

3D printed hermetic package assembly and method

Method and apparatus for printing integrated circuit bond connections

Integrated circuit with printed bond connections

Method for manufacturing a fan-out WLP with package

Fan-out microelectronic unit WLP having interconnects comprising a...

Direct write interconnections and method of manufacturing thereof

Electrical device comprising conductors made of carbonized plastic,...

Semiconductor device with conductor tracks between semiconductor ch...

Method and system to manufacture stacked chip devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...

Electrical Interconnection Of Circuit Elements On A Substrate Witho...

METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PR...

DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME

3D Printed Hermetic Package Assembly and Method

Remapped Packaged Extracted Die with 3D Printed Bond Connections

Method and apparatus for printing integrated circuit bond connections

DIRECT WRITE INTERCONNECTIONS AND METHOD OF MANUFACTURING THEREOF

FAN-OUT WLP WITH PACKAGE

Electrical device comprising conductors made of carbonized plastic,...

Semiconductor device with conductor tracks between semiconductor ch...

Method and system to manufacture stacked chip devices

Method and system to manufacture stacked chip devices