TREA

using marks formed on the semiconductor or solid-state body

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  • CPC
  • H01L2224/8413
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8413using marks formed on the semiconductor or solid-state body
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
    • Publication number 20230326901
    • Publication date Oct 12, 2023
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210265243
    • Publication date Aug 26, 2021
    • Kabushiki Kaisha Toshiba
    • Hidetoshi KURAYA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS
    • Publication number 20190206773
    • Publication date Jul 4, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • Oscar Paulo RAZON
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140327138
    • Publication date Nov 6, 2014
    • RENESAS ELECTRONICS CORPORATION
    • Hiroyasu Miyamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER CONVERTER
    • Publication number 20140284809
    • Publication date Sep 25, 2014
    • Honda Motor Co., Ltd.
    • Asako YONEGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
    • Publication number 20140084438
    • Publication date Mar 27, 2014
    • FUJI ELECTRIC CO., LTD.
    • Shin Soyano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20130307130
    • Publication date Nov 21, 2013
    • MITSUBISHI ELECTRIC CORPORATION
    • Takuya Oga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked Semiconductor Package
    • Publication number 20130256852
    • Publication date Oct 3, 2013
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR MODULE AND POWER UNIT DEVICE
    • Publication number 20130241047
    • Publication date Sep 19, 2013
    • MITSUBISHI ELECTRIC CORPORATION
    • Katsuhiko Omae
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...
    • Publication number 20120119343
    • Publication date May 17, 2012
    • TEXAS INSTRUMENTS INCORPORATED
    • Jaime A. Bayan
    • H01 - BASIC ELECTRIC ELEMENTS