using marks formed outside the semiconductor or solid-state body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85132using marks formed outside the semiconductor or solid-state body

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for linearly moving movable body relative to o...
- Patent number 11,410,866
- Issue date Aug 9, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducial mark for chip bonding
- Patent number 10,438,897
- Issue date Oct 8, 2019
- 3M Innovative Properties Company
- Siang Sin Foo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a substrate strip with wiring
- Patent number 9,380,706
- Issue date Jun 28, 2016
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,257,408
- Issue date Feb 9, 2016
- Mitsubishi Electric Corporation
- Takayuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...
- Publication number 20230069967
- Publication date Mar 9, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT
- Publication number 20200411352
- Publication date Dec 31, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...
- Publication number 20120024089
- Publication date Feb 2, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jeremiah Couey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRIP WITH WIRING AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110303442
- Publication date Dec 15, 2011
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method for wire bond integrity check on BGA substrate...
- Publication number 20090001573
- Publication date Jan 1, 2009
- Phontara Jirawongsapiwat
- H01 - BASIC ELECTRIC ELEMENTS