using marks formed outside the semiconductor or solid-state body

Industry

CPC
H01L2224/82132

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82132using marks formed outside the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,894,336
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography process for semiconductor packaging and structures resu...
- Patent number 11,158,600
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,114,407
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,071,207
- Issue date Jul 20, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,833,039
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,765,006
- Issue date Sep 1, 2020
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,163,857
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,085,345
- Issue date Sep 25, 2018
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 9,691,706
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for component incorporated substrate and compo...
- Patent number 9,596,765
- Issue date Mar 14, 2017
- MEIKO ELECTRONICS CO., LTD.
- Akira Yamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Component-embedded substrate manufacturing method
- Patent number 9,526,182
- Issue date Dec 20, 2016
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186283
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210398942
- Publication date Dec 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHY PROCESS FOR SEMICONDUCTOR PACKAGING AND STRUCTURES RESU...
- Publication number 20200105711
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190385975
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Fan Out Package and Methods of Forming the Same
- Publication number 20190109118
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module
- Publication number 20180376597
- Publication date Dec 27, 2018
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...
- Publication number 20140347835
- Publication date Nov 27, 2014
- Meiko Electronics Co., Ltd.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component-Embedded Substrate Manufacturing Method and Component-Emb...
- Publication number 20140299367
- Publication date Oct 9, 2014
- Meiko Electronics Co., Ltd.
- Yoshio Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH EMBEDDED DEVICE, BUILT-IN STOPPER AND ELECTROMAGN...
- Publication number 20140061877
- Publication date Mar 6, 2014
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Fan Out Package and Methods of Forming the Same
- Publication number 20130187270
- Publication date Jul 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

using marks formed outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated fan-out package and manufacturing method thereof

Lithography process for semiconductor packaging and structures resu...

Integrated fan-out package and manufacturing method thereof

Electronic module

Multi-chip fan out package and methods of forming the same

Electronic module

Multi-chip fan out package and methods of forming the same

Electronic module

Multi-chip fan out package and methods of forming the same

Manufacturing method for component incorporated substrate and compo...

Component-embedded substrate manufacturing method

Patents Applicationslast 30 patents

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

LITHOGRAPHY PROCESS FOR SEMICONDUCTOR PACKAGING AND STRUCTURES RESU...

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

Multi-Chip Fan Out Package and Methods of Forming the Same

Electronic module

COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...

Component-Embedded Substrate Manufacturing Method and Component-Emb...

WIRING BOARD WITH EMBEDDED DEVICE, BUILT-IN STOPPER AND ELECTROMAGN...

Multi-Chip Fan Out Package and Methods of Forming the Same