using marks formed outside the semiconductor or solid-state body

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H01L2224/83132

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83132using marks formed outside the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 12,074,152
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus, manufacturing system, and semiconducto...
- Patent number 11,776,931
- Issue date Oct 3, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 11,742,298
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach systems including a verification substrate
- Patent number 11,574,832
- Issue date Feb 7, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 11,569,186
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 11,487,170
- Issue date Nov 1, 2022
- Japan Display Inc.
- Yasushi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and electronic device having the same
- Patent number 11,437,295
- Issue date Sep 6, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of surface-mounting components
- Patent number 11,342,489
- Issue date May 24, 2022
- DST Innovations Limited
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 11,309,277
- Issue date Apr 19, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,957,812
- Issue date Mar 23, 2021
- LG Display Co., Ltd.
- ChungHwan An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 10,903,180
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-precision bond head positioning method and apparatus
- Patent number 10,861,819
- Issue date Dec 8, 2020
- ASM Technology Singapore Pte. Ltd.
- Jiangwen Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 10,734,351
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package and electronic device having the same
- Patent number 10,636,721
- Issue date Apr 28, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 10,522,473
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,510,923
- Issue date Dec 17, 2019
- LG Display Co., Ltd.
- ChungHwan An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film (ACF) and forming method thereof, ACF r...
- Patent number 10,510,708
- Issue date Dec 17, 2019
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducial mark for chip bonding
- Patent number 10,438,897
- Issue date Oct 8, 2019
- 3M Innovative Properties Company
- Siang Sin Foo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press fitting head and semiconductor manufacturing apparatus using...
- Patent number 10,388,625
- Issue date Aug 20, 2019
- J-DEVICES CORPORATION
- Minoru Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body and method of manufacturing connection body
- Patent number 10,373,927
- Issue date Aug 6, 2019
- Dexerials Corporation
- Reiji Tsukao
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID COMPONENT COUPLED TO DIES IN MULTI-CHIP PACKAGE USING DIELECT...
- Publication number 20230197664
- Publication date Jun 22, 2023
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20230170319
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230163096
- Publication date May 25, 2023
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20230148420
- Publication date May 11, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
- Publication number 20210305201
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20210223597
- Publication date Jul 22, 2021
- Japan Display Inc.
- Yasushi NAKANO
- G02 - OPTICS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20210151401
- Publication date May 20, 2021
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...
- Publication number 20210074670
- Publication date Mar 11, 2021
- Kioxia Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20200219784
- Publication date Jul 9, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Mark Design for Packages
- Publication number 20200091086
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20200075381
- Publication date Mar 5, 2020
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...
- Publication number 20190206831
- Publication date Jul 4, 2019
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electronic Device and Method of Making the Same Using Surface Mount...
- Publication number 20190059160
- Publication date Feb 21, 2019
- Thin Film Electronics ASA
- Olle HAGEL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM (ACF) AND FORMING METHOD THEREOF, ACF R...
- Publication number 20190035760
- Publication date Jan 31, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
- Publication number 20180358326
- Publication date Dec 13, 2018
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED FIDUCIAL VISIBILITY AND RECOGNITION
- Publication number 20180182712
- Publication date Jun 28, 2018
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Surface-Mounting Components
- Publication number 20180182944
- Publication date Jun 28, 2018
- DST Innovations Limited
- Anthony MILES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Transferring and Placing a Semiconductor Device on a Sub...
- Publication number 20180166416
- Publication date Jun 14, 2018
- IMEC vzw
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF
- Publication number 20180065186
- Publication date Mar 8, 2018
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20180026012
- Publication date Jan 25, 2018
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING SUBSTRATE AND DISPLAY DEVICE
- Publication number 20180004030
- Publication date Jan 4, 2018
- SHARP KABUSHIKI KAISHA
- Katsuhiro YAMAGUCHI
- G02 - OPTICS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170365534
- Publication date Dec 21, 2017
- J-DEVICES CORPORATION
- Hirokazu MACHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION BODY
- Publication number 20170236795
- Publication date Aug 17, 2017
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20170148759
- Publication date May 25, 2017
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20170071061
- Publication date Mar 9, 2017
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...
- Publication number 20140347835
- Publication date Nov 27, 2014
- Meiko Electronics Co., Ltd.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

using marks formed outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Device including semiconductor chips and method for producing such...

Bonding apparatus and method of fabricating display device using th...

Circuit board structure and method for manufacturing a circuit boar...

Substrate bonding apparatus, manufacturing system, and semiconducto...

Alignment mark design for packages

Die attach systems including a verification substrate

Device including semiconductor chips and method for producing such...

Chip assembly

Display device and method for manufacturing display device

Semiconductor package and electronic device having the same

Method of surface-mounting components

Chip assembling on adhesion layer or dielectric layer, extending be...

Wafer level integration including design/co-design, structure proce...

Circuit board structure and method for manufacturing a circuit boar...

Alignment method, method for connecting electronic component, metho...

Display device and method of manufacturing the same

Method for transferring and placing a semiconductor device on a sub...

Device including semiconductor chips and method for producing such...

High-precision bond head positioning method and apparatus

Chip assembling on adhesion layer or dielectric layer, extending be...

Micro-selective sintering laser systems and methods thereof

Semiconductor package and electronic device having the same

Chip assembly

Alignment mark design for packages

Display device and method of manufacturing the same

Anisotropic conductive film (ACF) and forming method thereof, ACF r...

Fiducial mark for chip bonding

Press fitting head and semiconductor manufacturing apparatus using...

Connection body and method of manufacturing connection body

Patents Applicationslast 30 patents

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

SOLID COMPONENT COUPLED TO DIES IN MULTI-CHIP PACKAGE USING DIELECT...

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

MOUNTING DEVICE AND MOUNTING METHOD

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

Alignment Mark Design for Packages

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...

Electronic Device and Method of Making the Same Using Surface Mount...

ANISOTROPIC CONDUCTIVE FILM (ACF) AND FORMING METHOD THEREOF, ACF R...

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...

ENHANCED FIDUCIAL VISIBILITY AND RECOGNITION

Method of Surface-Mounting Components

Method for Transferring and Placing a Semiconductor Device on a Sub...

MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF

MULTILAYER SUBSTRATE

MOUNTING SUBSTRATE AND DISPLAY DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

CONNECTION BODY

BONDING APPARATUS AND BONDING METHOD

Circuit board structure and method for manufacturing a circuit boar...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...