using marks formed outside the semiconductor or solid-state body

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CPC
H01L2224/81132

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81132using marks formed outside the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,137,649
- Issue date Oct 5, 2021
- Samsung Display Co., Ltd.
- Myong Hoon Roh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,081,503
- Issue date Aug 3, 2021
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bond head assemblies including reflective optical elements, related...
- Patent number 11,031,367
- Issue date Jun 8, 2021
- Kulicke and Soffa Industries, In.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 10,916,514
- Issue date Feb 9, 2021
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip carrier for bridge assembly
- Patent number 10,916,507
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Charles L Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Photodetector-arrays and methods of fabrication thereof
- Patent number 10,644,061
- Issue date May 5, 2020
- Semi-Conductor Devices-An Elbit Systems-Rafael Partnership
- Yoram Karni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered solder for fine pitch first-level interconnect (FLI) appli...
- Patent number 10,515,914
- Issue date Dec 24, 2019
- Intel Corporation
- Mihir A. Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 10,490,525
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 10,461,047
- Issue date Oct 29, 2019
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducial mark for chip bonding
- Patent number 10,438,897
- Issue date Oct 8, 2019
- 3M Innovative Properties Company
- Siang Sin Foo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 10,373,987
- Issue date Aug 6, 2019
- Samsung Display Co., Ltd.
- Dae Geun Lee
- G02 - OPTICS
Information Patent Grant
Connection body and method of manufacturing connection body
- Patent number 10,373,927
- Issue date Aug 6, 2019
- Dexerials Corporation
- Reiji Tsukao
- G02 - OPTICS
Information Patent Grant
Mounting substrate and display device
- Patent number 10,353,253
- Issue date Jul 16, 2019
- SHARP KABUSHIKI KAISHA
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Mounting device and mounting method
- Patent number 10,199,349
- Issue date Feb 5, 2019
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 10,199,358
- Issue date Feb 5, 2019
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body, method for manufacturing a connection body, connec...
- Patent number 10,175,544
- Issue date Jan 8, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- G02 - OPTICS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 10,109,612
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-alignment for redistribution layer
- Patent number 10,074,595
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Company
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...
- Publication number 20240243094
- Publication date Jul 18, 2024
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20240234443
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Adaptive Flip Chip Bonding for Semiconductor Packages
- Publication number 20240213035
- Publication date Jun 27, 2024
- INFINEON TECHNOLOGIES AG
- Chew Yeek Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20240194636
- Publication date Jun 13, 2024
- Canon Kabushiki Kaisha
- KENICHIRO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20230197536
- Publication date Jun 22, 2023
- AUO Corporation
- Chung-Chan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW ASSEMBLIES, IMAGING SYSTEM INCLUDING THE SAME, METHOD OF MAN...
- Publication number 20230111183
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Duhyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20210125942
- Publication date Apr 29, 2021
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20200271979
- Publication date Aug 27, 2020
- SAMSUNG DISPLAY CO., LTD.
- Myong Hoon ROH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY
- Publication number 20200176383
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20200013734
- Publication date Jan 9, 2020
- Intel Corporation
- Dae-Woo KIM
- G01 - MEASURING TESTING
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20190333939
- Publication date Oct 31, 2019
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HETEROGENEOUS INTEGRATED CIRCUITS WITH INTEGRATED COVERS
- Publication number 20190311962
- Publication date Oct 10, 2019
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Timothy M. DRESSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...
- Publication number 20190206831
- Publication date Jul 4, 2019
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20180226364
- Publication date Aug 9, 2018
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20180182781
- Publication date Jun 28, 2018
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun Lee
- G02 - OPTICS
Information Patent Application
MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF
- Publication number 20180065186
- Publication date Mar 8, 2018
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20180026012
- Publication date Jan 25, 2018
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Alignment for Redistribution Layer
- Publication number 20180012825
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20170148759
- Publication date May 25, 2017
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20170071061
- Publication date Mar 9, 2017
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140284817
- Publication date Sep 25, 2014
- Kabushiki Kaisha Toshiba
- Takao SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH SILICON VIA AND ALIGNMENT MARK
- Publication number 20140183705
- Publication date Jul 3, 2014
- ELPIDA MEMORY, INC.
- Nobuyuki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

using marks formed outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Metal-free frame design for silicon bridges for semiconductor packages

Array substrate and method of mounting integrated circuit using the...

Circuit board structure and method for manufacturing a circuit boar...

Metal-free frame design for silicon bridges for semiconductor packages

System for processing semiconductor devices

High speed handling of ultra-small chips by selective laser bonding...

Display device

Circuit board structure and method for manufacturing a circuit boar...

Array substrate and method of mounting integrated circuit using the...

Alignment method, method for connecting electronic component, metho...

Bond head assemblies including reflective optical elements, related...

Metal-free frame design for silicon bridges for semiconductor packages

Multiple chip carrier for bridge assembly

Method for transferring and placing a semiconductor device on a sub...

Mounting Method of a semiconductor device using a colored auxiliary...

Micro-selective sintering laser systems and methods thereof

Photodetector-arrays and methods of fabrication thereof

Sintered solder for fine pitch first-level interconnect (FLI) appli...

High speed handling of ultra-small chips by selective laser bonding...

Metal-free frame design for silicon bridges for semiconductor packages

Fiducial mark for chip bonding

Array substrate and method of mounting integrated circuit using the...

Connection body and method of manufacturing connection body

Mounting substrate and display device

Mounting device and mounting method

Multilayer substrate

Connection body, method for manufacturing a connection body, connec...

Tools and systems for processing semiconductor devices, and methods...

Self-alignment for redistribution layer

Patents Applicationslast 30 patents

BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

Adaptive Flip Chip Bonding for Semiconductor Packages

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

WINDOW ASSEMBLIES, IMAGING SYSTEM INCLUDING THE SAME, METHOD OF MAN...

Tools and Systems for Processing Semiconductor Devices, and Methods...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

DISPLAY DEVICE

MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

HETEROGENEOUS INTEGRATED CIRCUITS WITH INTEGRATED COVERS

ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...

Tools and Systems for Processing Semiconductor Devices, and Methods...

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF

MULTILAYER SUBSTRATE

Self-Alignment for Redistribution Layer

BONDING APPARATUS AND BONDING METHOD

Circuit board structure and method for manufacturing a circuit boar...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

SEMICONDUCTOR DEVICE WITH THROUGH SILICON VIA AND ALIGNMENT MARK