using marks formed outside the semiconductor or solid-state body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80132using marks formed outside the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 12,062,638
- Issue date Aug 13, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tool and bonding method thereof
- Patent number 12,009,337
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding interface
- Patent number 11,876,049
- Issue date Jan 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 11,862,235
- Issue date Jan 2, 2024
- RAMBUS INC.
- Frederick A. Ware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Notched wafer and bonding support structure to improve wafer stacking
- Patent number 11,682,652
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post bond inspection of devices for panel packaging
- Patent number 11,552,043
- Issue date Jan 10, 2023
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding in interface
- Patent number 11,289,422
- Issue date Mar 29, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 11,170,842
- Issue date Nov 9, 2021
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Bond head assemblies including reflective optical elements, related...
- Patent number 11,031,367
- Issue date Jun 8, 2021
- Kulicke and Soffa Industries, In.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 10,916,523
- Issue date Feb 9, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure of three-dimensional chip stacking
- Patent number 10,867,985
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 10,784,219
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure of three-dimensional chip stacking
- Patent number 10,515,940
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 10,475,505
- Issue date Nov 12, 2019
- Rambus Inc.
- Frederick A. Ware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display panel, display device nd bonding method thereof
- Patent number 10,451,932
- Issue date Oct 22, 2019
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer-level semiconductor die attachment
- Patent number 10,217,718
- Issue date Feb 26, 2019
- Denselight Semiconductors Pte Ltd
- Yee Loy Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 9,881,663
- Issue date Jan 30, 2018
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacking apparatus having a transport device configured to tra...
- Patent number 9,842,823
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment systems and wafer bonding systems and methods
- Patent number 9,646,860
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,601,459
- Issue date Mar 21, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 9,362,002
- Issue date Jun 7, 2016
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor device
- Patent number 9,142,262
- Issue date Sep 22, 2015
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20240297143
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YUAN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240203483
- Publication date Jun 20, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING
- Publication number 20230275064
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME
- Publication number 20230163095
- Publication date May 25, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
- Publication number 20230030272
- Publication date Feb 2, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20230032570
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YUAN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING METHOD AND DIE BONDING APPARATUS
- Publication number 20230028219
- Publication date Jan 26, 2023
- SEMES CO., LTD.
- Chang Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING
- Publication number 20220293556
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20220278063
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT MARKS AT BONDING INTERFACE
- Publication number 20220173038
- Publication date Jun 2, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20220139445
- Publication date May 5, 2022
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
- Publication number 20210305201
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST BOND INSPECTION OF DEVICES FOR PANEL PACKAGING
- Publication number 20210118841
- Publication date Apr 22, 2021
- PYXIS CF PTE. LTD.
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20210005561
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20200411471
- Publication date Dec 31, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20180211701
- Publication date Jul 26, 2018
- RAMBUS INC.
- Frederick A. Ware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20120201068
- Publication date Aug 9, 2012
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CIRCUIT SUBSTRATE, AND METHOD O...
- Publication number 20120032296
- Publication date Feb 9, 2012
- Mitsubishi Electric Corporation
- Naoki Kosaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using marks formed outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microdevice transfer setup and integration of micro-devices into sy...

Bonding tool and bonding method thereof

Semiconductor device and method of manufacturing

Bonding alignment marks at bonding interface

Stacked semiconductor device

Bonding apparatus and method of fabricating display device using th...

Notched wafer and bonding support structure to improve wafer stacking

Post bond inspection of devices for panel packaging

Semiconductor device and method of manufacturing

Bonding alignment marks at bonding in interface

Stacked semiconductor device

Bond head assemblies including reflective optical elements, related...

Microdevice transfer setup and integration of micro-devices into sy...

Method and structure of three-dimensional chip stacking

Bonding system

Semiconductor device and method of manufacturing

Method for bonding substrates together, and substrate bonding device

Method and structure of three-dimensional chip stacking

Stacked semiconductor device

Flexible display panel, display device nd bonding method thereof

Method for wafer-level semiconductor die attachment

Stacked semiconductor device

Method for bonding substrates

Chip-stacking apparatus having a transport device configured to tra...

Bonding method, storage medium, bonding apparatus and bonding system

Alignment systems and wafer bonding systems and methods

Method for aligning micro-electronic components

Stacked semiconductor device

Chip-on-wafer bonding method and bonding device, and structure comp...

Stacked semiconductor device

Patents Applicationslast 30 patents

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

BONDING TOOL AND BONDING METHOD THEREOF

STACKED SEMICONDUCTOR DEVICE

NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING

DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME

BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE

BONDING TOOL AND BONDING METHOD THEREOF

DIE BONDING METHOD AND DIE BONDING APPARATUS

NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING

Semiconductor Device and Method of Manufacturing

BONDING ALIGNMENT MARKS AT BONDING INTERFACE

STACKED SEMICONDUCTOR DEVICE

BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...

POST BOND INSPECTION OF DEVICES FOR PANEL PACKAGING

Semiconductor Device and Method of Manufacturing

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

STACKED SEMICONDUCTOR DEVICE

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

STACKED SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR CIRCUIT SUBSTRATE, AND METHOD O...