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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32using masks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor device structure with metal-semico...
- Patent number 12,183,793
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,183,805
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhi-Qiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating gallium nitride substrate using ion implantation
- Patent number 12,183,575
- Issue date Dec 31, 2024
- IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
- Jea Gun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and patterning a layer and/or substrate
- Patent number 12,183,578
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etching method
- Patent number 12,183,588
- Issue date Dec 31, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tianyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested and non-nested SEI messages in video bitstreams
- Patent number 12,184,899
- Issue date Dec 31, 2024
- BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
- Ye-Kui Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote source pulsing with advanced pulse control
- Patent number 12,183,583
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Peter Lowell George Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure including complemen...
- Patent number 12,183,585
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 12,183,589
- Issue date Dec 31, 2024
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of performing gap filling including filling trenches between...
- Patent number 12,183,590
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determination of pretreatment conditions of heat treatmen...
- Patent number 12,183,600
- Issue date Dec 31, 2024
- Sumco Corporation
- Yoshihiro Kuwano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical field effect transistor with low-resistance bottom source-...
- Patent number 12,183,826
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Choonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact with air spacer
- Patent number 12,176,400
- Issue date Dec 24, 2024
- TAIWAN SEMINCODCUTOR MANUFACTURING COMPANY, LTD.
- Chen-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device forming method and substrate processing apparatus
- Patent number 12,176,219
- Issue date Dec 24, 2024
- SCREEN Holdings Co., Ltd.
- Eiji Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,178,042
- Issue date Dec 24, 2024
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head membrane with regions of different roughness
- Patent number 12,172,264
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Young J. Paik
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,176,216
- Issue date Dec 24, 2024
- Kokusai Electric Corporation
- Motomu Degai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for forming silicon-containing resist underlayer film a...
- Patent number 12,174,541
- Issue date Dec 24, 2024
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu Ogihara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Formation and in-situ etching processes for metal layers
- Patent number 12,170,202
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage MOSFET device with improved breakdown voltage
- Patent number 12,170,329
- Issue date Dec 17, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anupam Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,170,206
- Issue date Dec 17, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for cleaning high aspect ratio structures
- Patent number 12,170,196
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- Schubert S. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal lines
- Patent number 12,170,268
- Issue date Dec 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for advanced ion control for etching processes
- Patent number 12,165,872
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mask reshaping using a sacrificial layer
- Patent number 12,165,878
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES
- Publication number 20250006506
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Julien LADROUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interfacial Layer for Anneal Capping Layer
- Publication number 20250006507
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Yi ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250006801
- Publication date Jan 2, 2025
- SK HYNIX INC.
- Young Gwang YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH CHANNEL-SYMMETRIC GATE
- Publication number 20250006810
- Publication date Jan 2, 2025
- Intel Corporation
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250006798
- Publication date Jan 2, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hideyuki OKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR HEATING FOR THIN FILM EVAPORATION AND DIRECTIONAL SOLIDIFICATION
- Publication number 20250003054
- Publication date Jan 2, 2025
- Blue Origin, LLC
- Alexander lmbault
- C01 - INORGANIC CHEMISTRY
Information Patent Application
BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES
- Publication number 20250006552
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Liqi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF JUNCTION TERMINATION EXTENSION IN HIGH VOLTAGE...
- Publication number 20250006784
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Subhash Srinivas PIDAPARTHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING
- Publication number 20250006518
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Shiyu YUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Publication number 20250006499
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20250001547
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR REDUCING CRITICAL DIMENSION OF PATTERNS GENERATED USING...
- Publication number 20240429053
- Publication date Dec 26, 2024
- Silicon Laboratories Inc.
- Jiye Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Feature Through Heterogeneous Stacked Film and Methods of M...
- Publication number 20240429090
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jhen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCK-ON-BLOCK MEMORY ARRAY ARCHITECTURE USING BI-DIRECTIONAL STAIR...
- Publication number 20240431110
- Publication date Dec 26, 2024
- Lodestar Licensing Group LLC
- Aaron S. Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR MANUFACTURING SEMICONDUCTOR, METHOD FOR TREATING OB...
- Publication number 20240425754
- Publication date Dec 26, 2024
- FUJIFILM CORPORATION
- Yuta SHIGENOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING ELEMENTAL METALS
- Publication number 20240429065
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jane P. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ETCHING WITH REDUCED TILT ANGLE
- Publication number 20240429064
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICS IN ELECTRONICS TESTER
- Publication number 20240426938
- Publication date Dec 26, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...
- Publication number 20240426939
- Publication date Dec 26, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...
- Publication number 20240425723
- Publication date Dec 26, 2024
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
- Publication number 20240417595
- Publication date Dec 19, 2024
- FUJIMI INCORPORATED
- Tzu-Chun TSENG
- C01 - INORGANIC CHEMISTRY
Information Patent Application
MOLYBDENUM FILM ETCHANT COMPOSITION AND ETCHING METHOD USING SAME
- Publication number 20240417620
- Publication date Dec 19, 2024
- YCCHEM CO., LTD.
- Jun Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER REFLOW BY SURFACE MODIFICATION
- Publication number 20240420966
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
- Publication number 20240420978
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PHOTONICS STRUCTURES
- Publication number 20240411090
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THEREOF
- Publication number 20240413014
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING

using masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming semiconductor device structure with metal-semico...

Semiconductor device and manufacturing method thereof

Method of fabricating gallium nitride substrate using ion implantation

Method for forming and patterning a layer and/or substrate

Wet etching method

Nested and non-nested SEI messages in video bitstreams

Bottom lateral expansion of contact plugs through implantation

Remote source pulsing with advanced pulse control

Manufacturing method of semiconductor structure including complemen...

Tin oxide mandrels in patterning

Method of performing gap filling including filling trenches between...

Method of determination of pretreatment conditions of heat treatmen...

Vertical field effect transistor with low-resistance bottom source-...

Backside contact with air spacer

Semiconductor device forming method and substrate processing apparatus

Metal oxide composite as etch stop layer

Semiconductor device and a method of manufacturing a semiconductor...

Trench capacitor profile to decrease substrate warpage

Carrier head membrane with regions of different roughness

Method of manufacturing semiconductor device, substrate processing...

Composition for forming silicon-containing resist underlayer film a...

Formation and in-situ etching processes for metal layers

Selective passivation and selective deposition

High voltage MOSFET device with improved breakdown voltage

Method for separating dies from a semiconductor substrate

Method of processing substrate, method of manufacturing semiconduct...

Methods and systems for cleaning high aspect ratio structures

Embedded metal lines

Methods and systems for advanced ion control for etching processes

Semiconductor mask reshaping using a sacrificial layer

Patents Applicationslast 30 patents

SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES

Interfacial Layer for Anneal Capping Layer

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

TRANSISTOR WITH CHANNEL-SYMMETRIC GATE

NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SOLAR HEATING FOR THIN FILM EVAPORATION AND DIRECTIONAL SOLIDIFICATION

BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES

METHOD AND SYSTEM OF JUNCTION TERMINATION EXTENSION IN HIGH VOLTAGE...

BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING

INTEGRATED DIPOLE REGION FOR TRANSISTOR

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

METHOD FOR REDUCING CRITICAL DIMENSION OF PATTERNS GENERATED USING...

Contact Feature Through Heterogeneous Stacked Film and Methods of M...

BLOCK-ON-BLOCK MEMORY ARRAY ARCHITECTURE USING BI-DIRECTIONAL STAIR...

COMPOSITION FOR MANUFACTURING SEMICONDUCTOR, METHOD FOR TREATING OB...

METHOD OF PATTERNING ELEMENTAL METALS

METAL ETCHING WITH REDUCED TILT ANGLE

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICS IN ELECTRONICS TESTER

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...

PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...

POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME

MOLYBDENUM FILM ETCHANT COMPOSITION AND ETCHING METHOD USING SAME

COPPER REFLOW BY SURFACE MODIFICATION

RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

METHOD OF FORMING PHOTONICS STRUCTURES

SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THEREOF

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS