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using means for applying energy being within the device
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CPC
H01L2224/80234
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80234
using means for applying energy being within the device
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Patents Grants
last 30 patents
Information
Patent Grant
Piezoelectric materials for on-die thermal enhancement of hybrid bo...
Patent number
12,334,469
Issue date
Jun 17, 2025
Micron Technology, Inc.
Byung Hoon Moon
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BO...
Publication number
20240071986
Publication date
Feb 29, 2024
Micron Technology, Inc.
Byung Hoon Moon
H01 - BASIC ELECTRIC ELEMENTS