using means for applying energy being within the device

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H01L2224/85234

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85234using means for applying energy being within the device

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Patents Grantslast 30 patents

Information Patent Grant
Method for joining a micorelectronic chip to a wire element
- Patent number 11,081,466
- Issue date Aug 3, 2021
- PRIMO1D
- Delphine Rolland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connection method
- Patent number 9,352,562
- Issue date May 31, 2016
- Canon Kabushiki Kaisha
- Tomohiro Takahashi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRIC CONNECTION METHOD
- Publication number 20140225957
- Publication date Aug 14, 2014
- Canon Kabushiki Kaisha
- Tomohiro Takahashi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS