using mechanical means

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CPC
H01L21/687

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/687using mechanical means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Detection and analysis of substrate support and pre-heat ring in a...
- Patent number 12,243,761
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Martin Jeffrey Salinas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support assembly and substrate processing apparatus
- Patent number 12,243,767
- Issue date Mar 4, 2025
- Eugene Technology Co., Ltd.
- Sang Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,243,760
- Issue date Mar 4, 2025
- BEILAB CORP.
- Jihyun Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for etching a substrate using a hybrid wet atomic layer etc...
- Patent number 12,243,752
- Issue date Mar 4, 2025
- Tokyo Electron Limited
- Paul Abel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide body with localized diamond reinforcement
- Patent number 12,240,788
- Issue date Mar 4, 2025
- II-VI DELAWARE, INC.
- Jon Coppola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support, lithographic apparatus, method for manipulating...
- Patent number 12,242,204
- Issue date Mar 4, 2025
- ASML Netherlands B.V.
- Ruud Antonius Catharina Maria Beerens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate fixing device and electrostatic chuck
- Patent number 12,243,763
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Masakuni Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for improving fusion bonding
- Patent number 12,243,848
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Ta Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus including electrostatic chuck, subst...
- Patent number 12,243,727
- Issue date Mar 4, 2025
- Semes Co., Ltd.
- Dong Chan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder for use in a lithographic apparatus and a device m...
- Patent number 12,243,768
- Issue date Mar 4, 2025
- ASML Netherlands B.V.
- Johannes Josephus Maassen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating structure and wafer test device
- Patent number 12,237,184
- Issue date Feb 25, 2025
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding system with heated automatic collet changer
- Patent number 12,237,202
- Issue date Feb 25, 2025
- MRSI Systems, LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic susceptor and method of manufacturing same
- Patent number 12,237,204
- Issue date Feb 25, 2025
- MiCo Ceramics Ltd.
- So Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for etching the periphery edge of a substrate
- Patent number 12,237,206
- Issue date Feb 25, 2025
- DEVICEENG CO., LTD
- Taek Youb Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lift pin interface in a substrate support
- Patent number 12,237,200
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Alexander Sulyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer storage devices configured to measure physical properties of...
- Patent number 12,237,189
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Nagasubramaniyan Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom and middle edge rings
- Patent number 12,237,154
- Issue date Feb 25, 2025
- Lam Research Corporation
- Hiran Rajitha Rathnasinghe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support unit and substrate treating apparatus
- Patent number 12,237,181
- Issue date Feb 25, 2025
- Semes Co., Ltd.
- Ho Jong Hwang
- B08 - CLEANING
Information Patent Grant
Substrate treating apparatus and filler member provided therein
- Patent number 12,234,555
- Issue date Feb 25, 2025
- Semes Co., Ltd.
- Jin Mo Jae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for transferring substrate in vaccum chamber
- Patent number 12,234,106
- Issue date Feb 25, 2025
- T-ROBOTICS CO., LTD.
- Soo Jong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method, and user interface for edge ring wear compensation
- Patent number 12,237,203
- Issue date Feb 25, 2025
- Lam Research Corporation
- Tom A. Kamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Docking device with moveable frame and sealing component
- Patent number 12,237,196
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support assembly for substrate treatment apparatus
- Patent number 12,237,205
- Issue date Feb 25, 2025
- Deviceeng Co. Ltd
- Taek Youb Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,230,515
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Grant
Moveable edge ring designs
- Patent number 12,230,482
- Issue date Feb 18, 2025
- Lam Research Corporation
- Hiran Rajitha Rathnasinghe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supporting apparatus, substrate processing apparatus incl...
- Patent number 12,230,531
- Issue date Feb 18, 2025
- ASM IP Holding B.V.
- Seung Woo Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nanosecond pulser ADC system
- Patent number 12,230,477
- Issue date Feb 18, 2025
- Eagle Harbor Technologies, Inc.
- Kenneth Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,230,540
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Yoshihiro Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate support with varying depths of areas between mesas and co...
- Patent number 12,227,840
- Issue date Feb 18, 2025
- Lam Research Corporation
- Keith Gaff
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Level monitoring and active adjustment of a substrate support assembly
- Patent number 12,227,847
- Issue date Feb 18, 2025
- Applied Materials, Inc.
- James V. Santiago
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WAFER CHUCK INCLUDING SELF-SEALING VACUUM SEAL ASSEMBLIES AND METHO...
- Publication number 20250079228
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE AND METHOD OF USING THE SAME
- Publication number 20250079230
- Publication date Mar 6, 2025
- NGK Insulators, Ltd.
- Ikuhisa MORIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SWITCH FOR WAFER TEMPERATURE MODULATION
- Publication number 20250079234
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Hang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INSPECTION APPARATUS
- Publication number 20250076360
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Daesung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, AND ABNORMALITY DETERMINATION METHOD
- Publication number 20250073841
- Publication date Mar 6, 2025
- EBARA CORPORATION
- Yoshimasa OZONE
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
- Publication number 20250079153
- Publication date Mar 6, 2025
- SCREEN Holdings Co., Ltd.
- Noritake SUMI
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250079220
- Publication date Mar 6, 2025
- SCREEN Holdings Co., Ltd.
- Satoshi KAKINOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRIC...
- Publication number 20250079232
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- TAEJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR
- Publication number 20250079233
- Publication date Mar 6, 2025
- MICO CERAMICS LTD.
- Mina CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20250079229
- Publication date Mar 6, 2025
- NGK Insulators, Ltd.
- Seiya INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT POCKET SUSCEPTOR DESIGN WITH IMPROVED HEAT TRANSFER
- Publication number 20250079203
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, ROTATION STATE DETECTION METHOD, ME...
- Publication number 20250079231
- Publication date Mar 6, 2025
- Kokusai Electric Corporation
- Naofumi OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SUPPORT TABLE AND RF ROD
- Publication number 20250079235
- Publication date Mar 6, 2025
- NGK Insulators, Ltd.
- Tomohiro HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vacuum Wafer Chuck With Solid Diamond Pins
- Publication number 20250079226
- Publication date Mar 6, 2025
- II-VI Delaware, Inc.
- Jonathan Coppola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER RETAINING DEVICE
- Publication number 20250079227
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Lu-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATE PROCESSING SYSTEM WITH ADVANCED SUBSTRATE HAND...
- Publication number 20250069926
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Arunkumar Ramachandraiah
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MULTI ZONE SPOT HEATING IN EPI
- Publication number 20250066918
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Shu-Kwan LAU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE DEGAS STATION
- Publication number 20250069915
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Thomas BREZOCZKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD
- Publication number 20250069937
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Toshichika TAKEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250069939
- Publication date Feb 27, 2025
- BROOKS AUTOMATION US, LLC
- Alexander Krupyshev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING SAME
- Publication number 20250069941
- Publication date Feb 27, 2025
- MICO CERAMICS LTD.
- So Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER PLATE FOR COVERING THE SUSCEPTOR SIDE FACING THE PROCESS CHAM...
- Publication number 20250066917
- Publication date Feb 27, 2025
- AIXTRON SE
- Benjamin David WRIGHT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSFER DEVICE, TRANSFER SYSTEM, AND END EFFECTOR
- Publication number 20250069940
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS
- Publication number 20250069944
- Publication date Feb 27, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Bo-Ru CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE DEGAS STATION
- Publication number 20250069914
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Thomas BREZOCZKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SUPPORT
- Publication number 20250069942
- Publication date Feb 27, 2025
- FERROTEC MATERIAL TECHNOLOGIES CORPORATION
- Wataru YAMAGISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SHAFT ASSEMBLY FOR THERMAL CONTROL IN HEATED SEMICONDUCTOR P...
- Publication number 20250069943
- Publication date Feb 27, 2025
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Michael PARKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF QUARTZ MEMBER, AND METHOD FOR SPRAY COATING...
- Publication number 20250066614
- Publication date Feb 27, 2025
- MITSUBISHI CHEMICAL CORPORATION
- Masami MUNEHIRA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING METHODS
- Publication number 20250062148
- Publication date Feb 20, 2025
- GLOBALWAFERS CO., LTD.
- ShinBae Park
- B08 - CLEANING
Information Patent Application
ELECTROSTATIC CHUCK WITH SEAL SURFACE
- Publication number 20250062150
- Publication date Feb 20, 2025
- LAM RESEARCH CORPORATION
- Patrick Girard Breiling
- H01 - BASIC ELECTRIC ELEMENTS

using mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Detection and analysis of substrate support and pre-heat ring in a...

Substrate support assembly and substrate processing apparatus

Substrate processing apparatus

Systems for etching a substrate using a hybrid wet atomic layer etc...

Silicon carbide body with localized diamond reinforcement

Substrate support, lithographic apparatus, method for manipulating...

Substrate fixing device and electrostatic chuck

Methods and systems for improving fusion bonding

Substrate processing apparatus including electrostatic chuck, subst...

Substrate holder for use in a lithographic apparatus and a device m...

Heating structure and wafer test device

Die bonding system with heated automatic collet changer

Ceramic susceptor and method of manufacturing same

Device for etching the periphery edge of a substrate

Lift pin interface in a substrate support

Wafer storage devices configured to measure physical properties of...

Bottom and middle edge rings

Support unit and substrate treating apparatus

Substrate treating apparatus and filler member provided therein

Apparatus for transferring substrate in vaccum chamber

System, method, and user interface for edge ring wear compensation

Docking device with moveable frame and sealing component

Substrate support assembly for substrate treatment apparatus

Substrate processing apparatus and substrate processing method

Moveable edge ring designs

Substrate supporting apparatus, substrate processing apparatus incl...

Nanosecond pulser ADC system

Substrate processing system and substrate processing method

Substrate support with varying depths of areas between mesas and co...

Level monitoring and active adjustment of a substrate support assembly

Patents Applicationslast 30 patents

WAFER CHUCK INCLUDING SELF-SEALING VACUUM SEAL ASSEMBLIES AND METHO...

WAFER PLACEMENT TABLE AND METHOD OF USING THE SAME

THERMAL SWITCH FOR WAFER TEMPERATURE MODULATION

SUBSTRATE INSPECTION APPARATUS

SUBSTRATE PROCESSING APPARATUS, AND ABNORMALITY DETERMINATION METHOD

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SEMICONDUCTOR PACKAGE BONDING TOOL AND SEMICONDUCTOR PACKAGE FABRIC...

CERAMIC SUSCEPTOR

WAFER PLACEMENT TABLE

FLAT POCKET SUSCEPTOR DESIGN WITH IMPROVED HEAT TRANSFER

SUBSTRATE PROCESSING APPARATUS, ROTATION STATE DETECTION METHOD, ME...

WAFER SUPPORT TABLE AND RF ROD

Vacuum Wafer Chuck With Solid Diamond Pins

WAFER RETAINING DEVICE

INTEGRATED SUBSTRATE PROCESSING SYSTEM WITH ADVANCED SUBSTRATE HAND...

MULTI ZONE SPOT HEATING IN EPI

SUBSTRATE DEGAS STATION

SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD

SUBSTRATE PROCESSING APPARATUS

CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING SAME

COVER PLATE FOR COVERING THE SUSCEPTOR SIDE FACING THE PROCESS CHAM...

TRANSFER DEVICE, TRANSFER SYSTEM, AND END EFFECTOR

SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS

SUBSTRATE DEGAS STATION

WAFER SUPPORT

HYBRID SHAFT ASSEMBLY FOR THERMAL CONTROL IN HEATED SEMICONDUCTOR P...

MANUFACTURING METHOD OF QUARTZ MEMBER, AND METHOD FOR SPRAY COATING...

AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING METHODS

ELECTROSTATIC CHUCK WITH SEAL SURFACE