using mechanical means

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CPC
H01L21/687

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/687using mechanical means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Temperature controlled substrate carrier and polishing components
- Patent number 12,217,979
- Issue date Feb 4, 2025
- Axus Technology, LLC
- Daniel Ray Trojan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing a wafer, and method of controlling such an...
- Patent number 12,217,980
- Issue date Feb 4, 2025
- Lam Research AG
- Daniel Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleanroom compatible robotic end effector exchange system
- Patent number 12,217,997
- Issue date Feb 4, 2025
- KLA Corporation
- Benjamin James Thomas Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,217,998
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Junnosuke Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing apparatus including EFEM and method of processing...
- Patent number 12,217,984
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jinhyuk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer placement correction in indexed multi-station processing cham...
- Patent number 12,217,985
- Issue date Feb 4, 2025
- Lam Research Corporation
- Stephen Topping
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of optical inspection of electronic device manu...
- Patent number 12,215,966
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Mohsin Waqar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck design with improved chucking and arcing perfor...
- Patent number 12,211,728
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Abdul Aziz Khaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,211,716
- Issue date Jan 28, 2025
- Semes Co., Ltd.
- Jaeseong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lift pin mechanism
- Patent number 12,211,734
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Alexander Sulyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning chamber for metal oxide removal
- Patent number 12,211,737
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage, film-forming apparatus, and film-processing apparatus
- Patent number 12,211,710
- Issue date Jan 28, 2025
- NHK Spring Co., Ltd.
- Toshihiko Hanamachi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reconfigurable mainframe with replaceable interface plate
- Patent number 12,211,714
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Michael R. Rice
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Alignment device and alignment method
- Patent number 12,211,723
- Issue date Jan 28, 2025
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous bonding approach for high quality wafer stacking
- Patent number 12,211,727
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Load lock device
- Patent number 12,211,735
- Issue date Jan 28, 2025
- Canon Anelva Corporation
- Jun Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,211,733
- Issue date Jan 28, 2025
- Ebara Corporation
- Nobuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed-architecture robot with multiple linkages
- Patent number 12,208,517
- Issue date Jan 28, 2025
- Persimmon Technologies Corporation
- Martin Hosek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating a substrate
- Patent number 12,205,837
- Issue date Jan 21, 2025
- Semes Co., Ltd.
- Seong Hyun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing chamber to accommodate parasitic plasma fo...
- Patent number 12,205,845
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,204,256
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Kouichi Mizunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing device and etching liquid
- Patent number 12,203,021
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Koukichi Hiroshiro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate cleaning apparatus, substrate cleaning method, and non-tr...
- Patent number 12,202,016
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Yuki Ito
- B08 - CLEANING
Information Patent Grant
Method and apparatus for anisotropic pattern etching and treatment
- Patent number 12,205,793
- Issue date Jan 21, 2025
- Lam Research Corporation
- Seokmin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vision-based wafer pre-alignment platform and alignment method
- Patent number 12,205,325
- Issue date Jan 21, 2025
- WUXI XIVI SCIENCE AND TECHNOLOGY CO., LTD.
- Minjie Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cleaning apparatus and polishing apparatus
- Patent number 12,205,831
- Issue date Jan 21, 2025
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate debonding apparatus
- Patent number 12,205,832
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Jonghyeon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning apparatus for semiconductor wafer and method of cleaning s...
- Patent number 12,205,830
- Issue date Jan 21, 2025
- Sumco Corporation
- Kaito Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch curing chamber with gas distribution and individual pumping
- Patent number 12,203,171
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Adib Khan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
DIRECT-PICK ROBOT FOR MULTI-STATION SEMICONDUCTOR PROCESSING CHAMBERS
- Publication number 20250046643
- Publication date Feb 6, 2025
- LAM RESEARCH CORPORATION
- Richard M. Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE MAP GENERATING METHOD
- Publication number 20250046646
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Junnosuke TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBOTIC ARM WITH VIBRATION DETECTION AND IMAGE RECOGNITION
- Publication number 20250046636
- Publication date Feb 6, 2025
- JUN-FU TECHNOLOGY INC
- Cheng-Hsiang LU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
VACUUM PROCESSING APPARATUS AND METHOD OF CONTROLLING VACUUM PROCES...
- Publication number 20250046648
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Kiyoshi MORI
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
HEAT TREATMENT APPARATUS AND METHOD OF OPERATING THEREOF
- Publication number 20250046632
- Publication date Feb 6, 2025
- Rohm Co., Ltd.
- Makoto TAKAMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING
- Publication number 20250046635
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Sangchul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC CORRECTION DEVICE OF ROBOTIC ARM AND METHOD THEREOF
- Publication number 20250046637
- Publication date Feb 6, 2025
- JUN-FU TECHNOLOGY INC
- Cheng-Hsiang LU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250046624
- Publication date Feb 6, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED EPITAXY AND PRECLEAN SYSTEM
- Publication number 20250046596
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Lara HAWRYLCHAK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER TRANSFER PADDLES WITH MINIMUM CONTACT AREA STRUCTURES FOR RED...
- Publication number 20250046644
- Publication date Feb 6, 2025
- LAM RESEARCH CORPORATION
- Andrew Borth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT SYSTEM, AND METHOD...
- Publication number 20250046645
- Publication date Feb 6, 2025
- Tokyo Electron Limited
- Tamihiro KOBAYASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PROCESS DEVICE AND WAFER SUPPORT STRUCTURE THEREOF
- Publication number 20250046647
- Publication date Feb 6, 2025
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Shoulin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER UNIT AND TRANSFER ROBOT SYSTEM INCLUDING TRANSFER ROBOT
- Publication number 20250038032
- Publication date Jan 30, 2025
- SEMES CO., LTD.
- Donghoon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR
- Publication number 20250038041
- Publication date Jan 30, 2025
- NGK Insulators, Ltd.
- Yutaka UNNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT FRAMES FOR CENTRAL HEATING, AND RELATED PROCESSING CHAMBERS AN...
- Publication number 20250038040
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Ala MORADIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Throughput Substrate Processing Cluster Tool With Factory Inte...
- Publication number 20250038021
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Upendra UMMETHALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT DEVICE AND METHOD AND WAFER SPEED CALCULATION METHOD
- Publication number 20250038031
- Publication date Jan 30, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Qi YIN
- B08 - CLEANING
Information Patent Application
WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS
- Publication number 20250038037
- Publication date Jan 30, 2025
- UTAC Headquarters Pte. Ltd.
- IL KWON SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT PINS, LIFT PIN ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS,...
- Publication number 20250038039
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Ion Hong Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-WET MODULE
- Publication number 20250038014
- Publication date Jan 30, 2025
- EBARA CORPORATION
- Mitsutoshi YAHAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED FACEPLATE FOR EXTREME EDGE FILM UNIFORMITY
- Publication number 20250029849
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Anish Janakiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ANALYZING UNIFORMITY, AND RELATED APPARATUS AND SYSTEMS,...
- Publication number 20250029850
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Kim Ramkumar VELLORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT PIN PROTECTION ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250029868
- Publication date Jan 23, 2025
- EUGENE TECHNOLOGY CO., LTD.
- Doo Yeol RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20250029865
- Publication date Jan 23, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL DEVICE FOR SUBSTRATE TRANSFER ROBOT AND CONTROL METHOD FOR...
- Publication number 20250026013
- Publication date Jan 23, 2025
- KAWASAKI JUKOGYO KABUSHIKI KAISHA
- Hiroki IMANISHI
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
MATERIAL FRAME UNLOCKING DEVICE
- Publication number 20250029867
- Publication date Jan 23, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Mengcheng QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK TABLE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING TH...
- Publication number 20250029864
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- KANG GYUNE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEPARATING WAFER SLICES
- Publication number 20250029846
- Publication date Jan 23, 2025
- Yield Engineering Systems, Inc.
- Al Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING CHUCK WITH DISCRETE ACTUATORS
- Publication number 20250029866
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Craig A. Hickman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE-COVERAGE EDGE RING FOR ENHANCED SHIELDING IN SUBSTRATE PROCESS...
- Publication number 20250022691
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Shang-I CHOU
- H01 - BASIC ELECTRIC ELEMENTS

using mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Temperature controlled substrate carrier and polishing components

Apparatus for processing a wafer, and method of controlling such an...

Cleanroom compatible robotic end effector exchange system

Substrate processing apparatus

Wafer processing apparatus including EFEM and method of processing...

Wafer placement correction in indexed multi-station processing cham...

Methods and systems of optical inspection of electronic device manu...

Electrostatic chuck design with improved chucking and arcing perfor...

Substrate processing apparatus and substrate processing method

Lift pin mechanism

Cleaning chamber for metal oxide removal

Stage, film-forming apparatus, and film-processing apparatus

Reconfigurable mainframe with replaceable interface plate

Alignment device and alignment method

Simultaneous bonding approach for high quality wafer stacking

Load lock device

Substrate processing apparatus and substrate processing method

Distributed-architecture robot with multiple linkages

Apparatus for treating a substrate

Semiconductor processing chamber to accommodate parasitic plasma fo...

Substrate processing apparatus

Substrate processing device and etching liquid

Substrate cleaning apparatus, substrate cleaning method, and non-tr...

Method and apparatus for anisotropic pattern etching and treatment

Plasma control method in semiconductor wafer fabrication

Vision-based wafer pre-alignment platform and alignment method

Cleaning apparatus and polishing apparatus

Substrate debonding apparatus

Cleaning apparatus for semiconductor wafer and method of cleaning s...

Batch curing chamber with gas distribution and individual pumping

Patents Applicationslast 30 patents

DIRECT-PICK ROBOT FOR MULTI-STATION SEMICONDUCTOR PROCESSING CHAMBERS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE MAP GENERATING METHOD

ROBOTIC ARM WITH VIBRATION DETECTION AND IMAGE RECOGNITION

VACUUM PROCESSING APPARATUS AND METHOD OF CONTROLLING VACUUM PROCES...

HEAT TREATMENT APPARATUS AND METHOD OF OPERATING THEREOF

SUBSTRATE PROCESSING

AUTOMATIC CORRECTION DEVICE OF ROBOTIC ARM AND METHOD THEREOF

METHOD OF PROCESSING WAFER

INTEGRATED EPITAXY AND PRECLEAN SYSTEM

WAFER TRANSFER PADDLES WITH MINIMUM CONTACT AREA STRUCTURES FOR RED...

SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT SYSTEM, AND METHOD...

SEMICONDUCTOR PROCESS DEVICE AND WAFER SUPPORT STRUCTURE THEREOF

TRANSFER UNIT AND TRANSFER ROBOT SYSTEM INCLUDING TRANSFER ROBOT

CERAMIC SUSCEPTOR

LIFT FRAMES FOR CENTRAL HEATING, AND RELATED PROCESSING CHAMBERS AN...

High Throughput Substrate Processing Cluster Tool With Factory Inte...

WAFER ALIGNMENT DEVICE AND METHOD AND WAFER SPEED CALCULATION METHOD

WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS

LIFT PINS, LIFT PIN ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS,...

PRE-WET MODULE

SHAPED FACEPLATE FOR EXTREME EDGE FILM UNIFORMITY

METHODS OF ANALYZING UNIFORMITY, AND RELATED APPARATUS AND SYSTEMS,...

LIFT PIN PROTECTION ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS

WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS

CONTROL DEVICE FOR SUBSTRATE TRANSFER ROBOT AND CONTROL METHOD FOR...

MATERIAL FRAME UNLOCKING DEVICE

CHUCK TABLE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING TH...

APPARATUS AND METHOD FOR SEPARATING WAFER SLICES

WAFER BONDING CHUCK WITH DISCRETE ACTUATORS

WIDE-COVERAGE EDGE RING FOR ENHANCED SHIELDING IN SUBSTRATE PROCESS...