using mechanical means

Industry

CPC
H01L21/687

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/687using mechanical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wafer clamping method and semiconductor manufacturing apparatus
- Patent number 12,272,588
- Issue date Apr 8, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ejector pin device for chip packaging
- Patent number 12,272,589
- Issue date Apr 8, 2025
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Chaochao Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate supporting plate, thin film deposition apparatus includin...
- Patent number 12,270,118
- Issue date Apr 8, 2025
- ASM IP Holding B.V.
- Yong Min Yoo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate retaining apparatus, system including the apparatus, and...
- Patent number 12,270,106
- Issue date Apr 8, 2025
- ASM IP Holding B.V.
- Shiva K. T. Rajavelu Muralidhar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 12,272,590
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Junnosuke Taguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Friction stir welding in semiconductor manufacturing applications
- Patent number 12,272,591
- Issue date Apr 8, 2025
- Lam Research Corporation
- Nick Ray Linebarger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,272,541
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Naoki Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system and method for providing a fiber optic coupler
- Patent number 12,272,587
- Issue date Apr 8, 2025
- JABIL INC.
- Jeroen Bosboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage and plasma processing apparatus
- Patent number 12,272,528
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Yasuharu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating substrate and method for treating substrate
- Patent number 12,272,544
- Issue date Apr 8, 2025
- Semes Co., Ltd.
- Do Gyeong Ha
- B08 - CLEANING
Information Patent Grant
Holding device and method of manufacturing holding device
- Patent number 12,273,965
- Issue date Apr 8, 2025
- NITERRA CO., LTD.
- Ryunosuke Sakamaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Apparatus for cleaning semiconductor silicon wafer and method for c...
- Patent number 12,272,542
- Issue date Apr 8, 2025
- Shin-Etsu Handotai Co., Ltd.
- Kensaku Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manipulator
- Patent number 12,263,574
- Issue date Apr 1, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Hao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid supply nozzle for semiconductor substrate treatment and semic...
- Patent number 12,266,549
- Issue date Apr 1, 2025
- APET CO., LTD.
- Tae Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating substrate and method of coupling support unit
- Patent number 12,266,561
- Issue date Apr 1, 2025
- Semes Co., Ltd.
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring system, measuring device, and measuring method
- Patent number 12,264,947
- Issue date Apr 1, 2025
- Tokyo Electron Limited
- Takayuki Hatanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermal control of devices in electronics tester
- Patent number 12,265,136
- Issue date Apr 1, 2025
- AEHR Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,266,562
- Issue date Apr 1, 2025
- Tokyo Electron Limited
- Hajime Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film thickness uniformity improvement using edge ring and bias elec...
- Patent number 12,266,560
- Issue date Apr 1, 2025
- Applied Materials, Inc.
- Kin Pong Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annealing method
- Patent number 12,266,553
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of manufacturing semiconductor package, method of handling w...
- Patent number 12,266,559
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate test apparatus and method for measuring dechucking force...
- Patent number 12,261,072
- Issue date Mar 25, 2025
- Semes Co., Ltd.
- Jong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method and processing apparatus
- Patent number 12,261,078
- Issue date Mar 25, 2025
- Tokyo Electron Limited
- Takuya Umise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot heating by moving a beam with horizontal rotary motion
- Patent number 12,261,062
- Issue date Mar 25, 2025
- Applied Materials, Inc.
- Shu-Kwan Danny Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma processing apparatus
- Patent number 12,261,028
- Issue date Mar 25, 2025
- Tokyo Electron Limited
- Shuichi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system and component mounting method
- Patent number 12,261,070
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and stage cleaning method
- Patent number 12,261,060
- Issue date Mar 25, 2025
- Tokyo Electron Limited
- Tsutomu Hiroki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Robot apparatus, systems, and methods for transporting substrates i...
- Patent number 12,255,089
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Jeffrey C. Hudgens
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,255,092
- Issue date Mar 18, 2025
- Tokyo Electron Limited
- Junnosuke Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,255,063
- Issue date Mar 18, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING CHAMBER WITH RF RETURN PATH
- Publication number 20250118593
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Vellaichamy NAGAPPAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TRANSFER DEVICE, NOTCH POSITION CORRECTION METHOD, SUBSTR...
- Publication number 20250118584
- Publication date Apr 10, 2025
- ASM IP HOLDING B.V.
- Masashi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20250118586
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20250118587
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANNEAL CHAMBER
- Publication number 20250118572
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR GAS ACTIVATION I...
- Publication number 20250118576
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Chen-Ying WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250118591
- Publication date Apr 10, 2025
- Kokusai Electric Corporation
- Naofumi OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR BACKSIDE WAFER PROCESSING WITH EDGE-ONLY WAFER CONTACT
- Publication number 20250118592
- Publication date Apr 10, 2025
- LAM RESEARCH CORPORATION
- Nick Ray Linebarger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT DYNAMIC LEVELING LIFT MECHANISM
- Publication number 20250115999
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Tuan Anh Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-MATERIAL CHUCK
- Publication number 20250112083
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE
- Publication number 20250112084
- Publication date Apr 3, 2025
- CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.
- Te-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR CURTAIN DEVICE AND WORKPIECE PROCESSING TOOL
- Publication number 20250109870
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU FLUORESCENCE-BASED CHAMBER AND WAFER MONITORING
- Publication number 20250110055
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- David Eitan BARLAZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LIFT PIN GUIDE
- Publication number 20250112082
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Hugo RIVERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDED ESC WITH OUTER CERAMIC VACUUM ISOLATION RING FOR CRYOG...
- Publication number 20250112075
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Alexander SULYMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND S...
- Publication number 20250105038
- Publication date Mar 27, 2025
- SCREEN Holdings Co., Ltd.
- Yuichi TAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250105040
- Publication date Mar 27, 2025
- SCREEN Holdings Co., Ltd.
- Yuichi TAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD
- Publication number 20250105049
- Publication date Mar 27, 2025
- SEMES CO., LTD.
- Seung Eun NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTAL HEATER
- Publication number 20250105034
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Justin GAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...
- Publication number 20250105039
- Publication date Mar 27, 2025
- SCREEN Holdings Co., Ltd.
- Takuya SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LIFT PIN
- Publication number 20250105048
- Publication date Mar 27, 2025
- TOKAI CARBON CO., LTD.
- Takeshi Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOTOR ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS HAVING MOTOR A...
- Publication number 20250105705
- Publication date Mar 27, 2025
- ASM IP HOLDING B.V.
- Mario Gonzalez
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
MODULAR SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20250105051
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING T...
- Publication number 20250105052
- Publication date Mar 27, 2025
- SEMES CO., LTD.
- Yong Jun BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...
- Publication number 20250105041
- Publication date Mar 27, 2025
- SCREEN Holdings Co., Ltd.
- Hiroyuki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK PIN AND SUBSTRATE HOLDING DEVICE
- Publication number 20250105050
- Publication date Mar 27, 2025
- SCREEN Holdings Co., Ltd.
- Kazuma FUNAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETICLE CARRIER AND ASSOCIATED METHODS
- Publication number 20250093789
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY COMPOSITION FOR CORROSION RESISTANCE
- Publication number 20250092491
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Chien-Min Liao
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRICAL TERMINAL CONNECTOR, SUBSTRATE SUPPORT, SUBSTRATE TREATIN...
- Publication number 20250096496
- Publication date Mar 20, 2025
- Jae Oh BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEMS AND METHODS USING VIRTUAL MACHINE ARCH...
- Publication number 20250096019
- Publication date Mar 20, 2025
- ASM IP HOLDING B.V.
- Eric Steinseifer
- H01 - BASIC ELECTRIC ELEMENTS

using mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer clamping method and semiconductor manufacturing apparatus

Ejector pin device for chip packaging

Substrate supporting plate, thin film deposition apparatus includin...

Substrate retaining apparatus, system including the apparatus, and...

Substrate processing apparatus

Friction stir welding in semiconductor manufacturing applications

Etching method and etching apparatus

Apparatus, system and method for providing a fiber optic coupler

Stage and plasma processing apparatus

Apparatus for treating substrate and method for treating substrate

Holding device and method of manufacturing holding device

Apparatus for cleaning semiconductor silicon wafer and method for c...

Manipulator

Fluid supply nozzle for semiconductor substrate treatment and semic...

Apparatus for treating substrate and method of coupling support unit

Measuring system, measuring device, and measuring method

Method and system for thermal control of devices in electronics tester

Substrate processing method and substrate processing apparatus

Film thickness uniformity improvement using edge ring and bias elec...

Annealing method

Method of manufacturing semiconductor package, method of handling w...

Substrate test apparatus and method for measuring dechucking force...

Processing method and processing apparatus

Spot heating by moving a beam with horizontal rotary motion

Plasma processing apparatus

Component mounting system and component mounting method

Substrate processing apparatus and stage cleaning method

Robot apparatus, systems, and methods for transporting substrates i...

Substrate processing apparatus

Substrate processing system and substrate processing method

Patents Applicationslast 30 patents

PROCESSING CHAMBER WITH RF RETURN PATH

SUBSTRATE TRANSFER DEVICE, NOTCH POSITION CORRECTION METHOD, SUBSTR...

ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

ANNEAL CHAMBER

CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR GAS ACTIVATION I...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

APPARATUSES FOR BACKSIDE WAFER PROCESSING WITH EDGE-ONLY WAFER CONTACT

COMPACT DYNAMIC LEVELING LIFT MECHANISM

MULTI-MATERIAL CHUCK

MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE

AIR CURTAIN DEVICE AND WORKPIECE PROCESSING TOOL

IN-SITU FLUORESCENCE-BASED CHAMBER AND WAFER MONITORING

WAFER LIFT PIN GUIDE

METAL BONDED ESC WITH OUTER CERAMIC VACUUM ISOLATION RING FOR CRYOG...

SUBSTRATE TRANSFER APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND S...

SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND METHOD

PEDESTAL HEATER

SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...

WAFER LIFT PIN

MOTOR ARRANGEMENTS, SEMICONDUCTOR PROCESSING SYSTEMS HAVING MOTOR A...

MODULAR SUBSTRATE SUPPORT ASSEMBLY

SUBSTRATE SUPPORT UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING T...

SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...

CHUCK PIN AND SUBSTRATE HOLDING DEVICE

RETICLE CARRIER AND ASSOCIATED METHODS

ALLOY COMPOSITION FOR CORROSION RESISTANCE

ELECTRICAL TERMINAL CONNECTOR, SUBSTRATE SUPPORT, SUBSTRATE TREATIN...

SUBSTRATE PROCESSING SYSTEMS AND METHODS USING VIRTUAL MACHINE ARCH...