using optical controlling means

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CPC
H01L21/681

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/681using optical controlling means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer positioning method and apparatus
- Patent number 12,315,753
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Cheng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method for correcting movement amount of bond...
- Patent number 12,308,273
- Issue date May 20, 2025
- Shinkawa Ltd.
- Makoto Takahashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing system
- Patent number 12,300,524
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yoshifumi Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment of targets on opposite sides of a substrate
- Patent number 12,300,529
- Issue date May 13, 2025
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing control method, substrate processing apparatus...
- Patent number 12,300,526
- Issue date May 13, 2025
- Tokyo Electron Limited
- Toyohisa Tsuruda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer calibraiton method for a wafer calibration device
- Patent number 12,288,712
- Issue date Apr 29, 2025
- Han Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating die attach systems
- Patent number 12,288,711
- Issue date Apr 29, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus and substrate treating method using th...
- Patent number 12,283,510
- Issue date Apr 22, 2025
- Semes Co., Ltd.
- Sang Oh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate storing and aligning apparatus in substrate bonding equip...
- Patent number 12,278,130
- Issue date Apr 15, 2025
- Semes Co., Ltd.
- Ho Cheon Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system and method for providing a fiber optic coupler
- Patent number 12,272,587
- Issue date Apr 8, 2025
- JABIL INC.
- Jeroen Bosboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate inspection system and a method of use thereof
- Patent number 12,258,665
- Issue date Mar 25, 2025
- JNK TECH
- Youngjin Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for mass transfer of mini light-emitting diodes (...
- Patent number 12,261,239
- Issue date Mar 25, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system and component mounting method
- Patent number 12,261,070
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component transfer apparatus, electronic component trans...
- Patent number 12,261,071
- Issue date Mar 25, 2025
- ASTI GLOBAL INC., TAIWAN
- Ming-Feng Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for dynamically provisioning cyber training environments
- Patent number 12,237,199
- Issue date Feb 25, 2025
- Circadence Corporation
- Laura Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for PUF generation using variations in transistor threshold...
- Patent number 12,237,197
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Lien Linus Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area camera substrate pre-aligner
- Patent number 12,237,198
- Issue date Feb 25, 2025
- Onto Innovation Inc.
- Jason Paul Remillard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metrology and process control for semiconductor manufacturing
- Patent number 12,236,364
- Issue date Feb 25, 2025
- Nova Ltd.
- Eitan Rothstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Micro-semiconductor chip wetting alignment apparatus
- Patent number 12,230,525
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and image capturing method
- Patent number 12,230,523
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Tadashi Enomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus, method of reading position o...
- Patent number 12,224,196
- Issue date Feb 11, 2025
- SK hynix Inc.
- Chan Ho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of image based robot alignment
- Patent number 12,211,718
- Issue date Jan 28, 2025
- GlobalWafers Co., Ltd.
- TaeHyeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component conveying instrument with an adjusting unit and method of...
- Patent number 12,211,721
- Issue date Jan 28, 2025
- Muehlbauer GmbH & Co. KG
- Rainer Miehlich
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Alignment device and alignment method
- Patent number 12,211,723
- Issue date Jan 28, 2025
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical measurement tool containing chromatic aberration enhancemen...
- Patent number 12,211,724
- Issue date Jan 28, 2025
- SanDisk Technologies LLC
- Michio Ohi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vision-based wafer pre-alignment platform and alignment method
- Patent number 12,205,325
- Issue date Jan 21, 2025
- WUXI XIVI SCIENCE AND TECHNOLOGY CO., LTD.
- Minjie Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding system
- Patent number 12,198,963
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer method and substrate transfer system
- Patent number 12,198,955
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Wataru Matsumoto
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method and system for positioning center of V-type notch of wafer,...
- Patent number 12,183,616
- Issue date Dec 31, 2024
- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD.
- Leilei Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...
- Publication number 20250174473
- Publication date May 29, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...
- Publication number 20250167031
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Hosin SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIZONE COATED VACUUM CHUCK FOR IR MEASUREMENT
- Publication number 20250167036
- Publication date May 22, 2025
- Applied Materials, Inc.
- Sanjay BHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND PROCESS FOR SORTING DIE FROM WAFER USING ANGLED WAFER TA...
- Publication number 20250140586
- Publication date May 1, 2025
- MIT SEMICONDUCTOR (TIAN JIN) CO., LTD.
- Kim Mone KWONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DIE BONDING
- Publication number 20250140592
- Publication date May 1, 2025
- Canon Kabushiki Kaisha
- Nilabh K ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD INCLUDING REMOVING TRANSPARENT OR TRANSLUCENT...
- Publication number 20250140710
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- TAE SUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Calibration Method and Substrate Processing System
- Publication number 20250125173
- Publication date Apr 17, 2025
- TOKYO ELECTRON LIMITED
- Toshiaki KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-SEMICONDUCTOR CHIP WETTING ALIGNMENT APPARATUS
- Publication number 20250125179
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COORDINATE SYSTEM CALIBRATION AND EQUIPMENT ALIGNMENT METHOD,...
- Publication number 20250113682
- Publication date Apr 3, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Chengfei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Detecting Semiconductor Wafer Ce...
- Publication number 20250112078
- Publication date Apr 3, 2025
- STATS ChipPAC Pte Ltd.
- Tack Chee Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRECISION HETEROGENEOUS INTEGRATION
- Publication number 20250105009
- Publication date Mar 27, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...
- Publication number 20250105041
- Publication date Mar 27, 2025
- SCREEN Holdings Co., Ltd.
- Hiroyuki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20250107424
- Publication date Mar 27, 2025
- SAMSUNG DISPLAY CO., LTD.
- Hyoungjun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Tool Alignment Device And Method
- Publication number 20250096025
- Publication date Mar 20, 2025
- DIODES INCORPORATED
- Bartosz Kielban
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE
- Publication number 20250096023
- Publication date Mar 20, 2025
- SCREEN Holdings Co., Ltd.
- Joji KUWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PRE-ALIGNER
- Publication number 20250079221
- Publication date Mar 6, 2025
- APPLIED MATERIALS ISRAEL LTD.
- Itamar Orenbuch
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT HANDLER
- Publication number 20250079222
- Publication date Mar 6, 2025
- Semiconductor Technologies & Instruments Pte Ltd
- Chin Fong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD
- Publication number 20250079397
- Publication date Mar 6, 2025
- Canon Kabushiki Kaisha
- SHUN TOKAIRIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHELF STATUS DETERMINATION
- Publication number 20250054795
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Guancyun LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING SYSTEM AND METHOD
- Publication number 20250054798
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20250054806
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Misato HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR THE ALIGNMENT OF A SUBSTRATE
- Publication number 20250046639
- Publication date Feb 6, 2025
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT SYSTEM, AND METHOD...
- Publication number 20250046645
- Publication date Feb 6, 2025
- Tokyo Electron Limited
- Tamihiro KOBAYASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...
- Publication number 20250038030
- Publication date Jan 30, 2025
- CANON KABUSIKI KAISHA
- Byung-Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER UNIT AND TRANSFER ROBOT SYSTEM INCLUDING TRANSFER ROBOT
- Publication number 20250038032
- Publication date Jan 30, 2025
- SEMES CO., LTD.
- Donghoon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT DEVICE AND METHOD AND WAFER SPEED CALCULATION METHOD
- Publication number 20250038031
- Publication date Jan 30, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Qi YIN
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD
- Publication number 20250024155
- Publication date Jan 16, 2025
- SCREEN Holdings Co., Ltd.
- Shinji SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE AND SUBSTRATE INSPECTION METHOD IN...
- Publication number 20240429083
- Publication date Dec 26, 2024
- PSK INC.
- Man Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Teaching Transfer Robot and Substrate Processing System
- Publication number 20240424666
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Kosuke KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOUP HAVING END EFFECTOR DETECTION SENSOR, AND INTEGRATED DATA MANA...
- Publication number 20240429082
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Kyu Ok LEE
- H01 - BASIC ELECTRIC ELEMENTS

using optical controlling means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer positioning method and apparatus

Method for manufacturing display device and apparatus for manufactu...

Bonding apparatus and method for correcting movement amount of bond...

Substrate processing system

Alignment of targets on opposite sides of a substrate

Substrate processing control method, substrate processing apparatus...

Wafer calibraiton method for a wafer calibration device

Methods of operating die attach systems

Substrate treating apparatus and substrate treating method using th...

Substrate storing and aligning apparatus in substrate bonding equip...

Apparatus, system and method for providing a fiber optic coupler

Substrate inspection system and a method of use thereof

Device and method for mass transfer of mini light-emitting diodes (...

Component mounting system and component mounting method

Electronic component transfer apparatus, electronic component trans...

System for dynamically provisioning cyber training environments

Method for PUF generation using variations in transistor threshold...

Area camera substrate pre-aligner

Metrology and process control for semiconductor manufacturing

Micro-semiconductor chip wetting alignment apparatus

Substrate processing apparatus and image capturing method

Semiconductor manufacturing apparatus, method of reading position o...

Methods and systems of image based robot alignment

Component conveying instrument with an adjusting unit and method of...

Alignment device and alignment method

Optical measurement tool containing chromatic aberration enhancemen...

Vision-based wafer pre-alignment platform and alignment method

Bonding system

Substrate transfer method and substrate transfer system

Method and system for positioning center of V-type notch of wafer,...

Patents Applicationslast 30 patents

DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...

CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...

MULTIZONE COATED VACUUM CHUCK FOR IR MEASUREMENT

SYSTEM AND PROCESS FOR SORTING DIE FROM WAFER USING ANGLED WAFER TA...

METHOD AND SYSTEM FOR DIE BONDING

WAFER BONDING METHOD INCLUDING REMOVING TRANSPARENT OR TRANSLUCENT...

Calibration Method and Substrate Processing System

MICRO-SEMICONDUCTOR CHIP WETTING ALIGNMENT APPARATUS

MULTI-COORDINATE SYSTEM CALIBRATION AND EQUIPMENT ALIGNMENT METHOD,...

Semiconductor Device and Method of Detecting Semiconductor Wafer Ce...

HIGH-PRECISION HETEROGENEOUS INTEGRATION

SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...

APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE

Semiconductor Manufacturing Tool Alignment Device And Method

APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE

SUBSTRATE PRE-ALIGNER

COMPONENT HANDLER

BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD

SHELF STATUS DETERMINATION

BONDING SYSTEM AND METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

METHOD AND DEVICE FOR THE ALIGNMENT OF A SUBSTRATE

SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT SYSTEM, AND METHOD...

SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...

TRANSFER UNIT AND TRANSFER ROBOT SYSTEM INCLUDING TRANSFER ROBOT

WAFER ALIGNMENT DEVICE AND METHOD AND WAFER SPEED CALCULATION METHOD

SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD

APPARATUS FOR TREATING SUBSTRATE AND SUBSTRATE INSPECTION METHOD IN...

Method for Teaching Transfer Robot and Substrate Processing System

FOUP HAVING END EFFECTOR DETECTION SENSOR, AND INTEGRATED DATA MANA...