using optical controlling means

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CPC
H01L21/681

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/681using optical controlling means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Information processing apparatus for teaching transfer position of...
- Patent number 12,367,602
- Issue date Jul 22, 2025
- Tokyo Electron Limited
- Tadashi Enomoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for correcting non-ideal wafer topography
- Patent number 12,368,066
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Mu Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for laser drilling blind vias
- Patent number 12,358,073
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pedestal setup using camera wafer
- Patent number 12,362,153
- Issue date Jul 15, 2025
- Lam Research Corporation
- Prasanna Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer alignment apparatus and method for multi-cassette load port
- Patent number 12,347,704
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer positioning and correction method, system, and device
- Patent number 12,347,714
- Issue date Jul 1, 2025
- Rongsheng Lyu
- G05 - CONTROLLING REGULATING
Information Patent Grant
Ring carrier and substrate treating system
- Patent number 12,340,988
- Issue date Jun 24, 2025
- Semes Co., Ltd.
- Mun Gi Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer apparatus and transfer method
- Patent number 12,341,046
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Norihiko Amikura
- G01 - MEASURING TESTING
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Estimation of chamber component conditions using substrate measurem...
- Patent number 12,339,645
- Issue date Jun 24, 2025
- Applied Materials, Inc.
- Chunlei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay measurement device and method, and system and program therefor
- Patent number 12,341,047
- Issue date Jun 24, 2025
- AUROS TECHNOLOGY, INC.
- Sol-Lee Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for mass transfer of mini light-emitting diodes (mini-LEDs)...
- Patent number 12,336,324
- Issue date Jun 17, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay measurement device and method, and system and program therefor
- Patent number 12,334,382
- Issue date Jun 17, 2025
- AUROS TECHNOLOGY, INC.
- Sol-Lee Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer apparatus
- Patent number 12,334,387
- Issue date Jun 17, 2025
- Kawasaki Jukogyo Kabushiki Kaisha
- Masaya Yoshida
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
FOUP transfer device
- Patent number 12,327,746
- Issue date Jun 10, 2025
- Rorze Corporation
- Yoshiyuki Fujishiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate inspection system and method of use thereof
- Patent number 12,322,616
- Issue date Jun 3, 2025
- JNK TECH
- Youngjin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate alignment systems and related methods
- Patent number 12,322,632
- Issue date Jun 3, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer positioning method and apparatus
- Patent number 12,315,753
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Cheng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method for correcting movement amount of bond...
- Patent number 12,308,273
- Issue date May 20, 2025
- Shinkawa Ltd.
- Makoto Takahashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing system
- Patent number 12,300,524
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yoshifumi Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment of targets on opposite sides of a substrate
- Patent number 12,300,529
- Issue date May 13, 2025
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing control method, substrate processing apparatus...
- Patent number 12,300,526
- Issue date May 13, 2025
- Tokyo Electron Limited
- Toyohisa Tsuruda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer calibraiton method for a wafer calibration device
- Patent number 12,288,712
- Issue date Apr 29, 2025
- Han Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating die attach systems
- Patent number 12,288,711
- Issue date Apr 29, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus and substrate treating method using th...
- Patent number 12,283,510
- Issue date Apr 22, 2025
- Semes Co., Ltd.
- Sang Oh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate storing and aligning apparatus in substrate bonding equip...
- Patent number 12,278,130
- Issue date Apr 15, 2025
- Semes Co., Ltd.
- Ho Cheon Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system and method for providing a fiber optic coupler
- Patent number 12,272,587
- Issue date Apr 8, 2025
- JABIL INC.
- Jeroen Bosboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate inspection system and a method of use thereof
- Patent number 12,258,665
- Issue date Mar 25, 2025
- JNK TECH
- Youngjin Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for mass transfer of mini light-emitting diodes (...
- Patent number 12,261,239
- Issue date Mar 25, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONVEYANCE APPARATUS, CONVEYANCE METHOD, AND SEMICONDUCTOR APPARATU...
- Publication number 20250232996
- Publication date Jul 17, 2025
- JSW Aktina System Co., Ltd.
- Teruaki SHIMOJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20250233000
- Publication date Jul 17, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POSITIONING AND CORRECTION METHOD, SYSTEM, AND DEVICE
- Publication number 20250232999
- Publication date Jul 17, 2025
- Hito Robotic System Inc.
- RONGSHENG LYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...
- Publication number 20250226243
- Publication date Jul 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Semiconductor Fabrication
- Publication number 20250226250
- Publication date Jul 10, 2025
- Nanoverse Technologies Inc.
- Jeffrey Albelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250218842
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Byoung Min YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250219015
- Publication date Jul 3, 2025
- Canon Kabushiki Kaisha
- Nilabh K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MEASURING EDGE ECCENTRICITY WHILE WAFER IS ON PRE-ALIGNER
- Publication number 20250198748
- Publication date Jun 19, 2025
- Canon Kabushiki Kaisha
- Logan L. Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER UNIT, AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
- Publication number 20250198833
- Publication date Jun 19, 2025
- SEMES CO., LTD.
- Ki Sang EUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS)...
- Publication number 20250204089
- Publication date Jun 19, 2025
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-AXIS OPERATION APPARATUS IN ISOTROPIC ARRANGEMENT
- Publication number 20250189350
- Publication date Jun 12, 2025
- GALLANT MICRO. MACHINING CO., LTD.
- TUN-CHIH SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20250181941
- Publication date Jun 5, 2025
- NOVA LTD
- EITAN ROTHSTEIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...
- Publication number 20250183084
- Publication date Jun 5, 2025
- SAMSUNG DISPLAY CO., LTD.
- YONGHYUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF OPTICAL NANOSCALE ALIGNMENT
- Publication number 20250183080
- Publication date Jun 5, 2025
- Institut National de la Recherche Scientifique
- Jinyang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND POSITIONING METHOD OF CONVEYANCE ARM
- Publication number 20250183081
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Junya MIYAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...
- Publication number 20250174473
- Publication date May 29, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...
- Publication number 20250167031
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Hosin SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIZONE COATED VACUUM CHUCK FOR IR MEASUREMENT
- Publication number 20250167036
- Publication date May 22, 2025
- Applied Materials, Inc.
- Sanjay BHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND PROCESS FOR SORTING DIE FROM WAFER USING ANGLED WAFER TA...
- Publication number 20250140586
- Publication date May 1, 2025
- MIT SEMICONDUCTOR (TIAN JIN) CO., LTD.
- Kim Mone KWONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DIE BONDING
- Publication number 20250140592
- Publication date May 1, 2025
- Canon Kabushiki Kaisha
- Nilabh K ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD INCLUDING REMOVING TRANSPARENT OR TRANSLUCENT...
- Publication number 20250140710
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- TAE SUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Calibration Method and Substrate Processing System
- Publication number 20250125173
- Publication date Apr 17, 2025
- TOKYO ELECTRON LIMITED
- Toshiaki KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-SEMICONDUCTOR CHIP WETTING ALIGNMENT APPARATUS
- Publication number 20250125179
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COORDINATE SYSTEM CALIBRATION AND EQUIPMENT ALIGNMENT METHOD,...
- Publication number 20250113682
- Publication date Apr 3, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Chengfei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Detecting Semiconductor Wafer Ce...
- Publication number 20250112078
- Publication date Apr 3, 2025
- STATS ChipPAC Pte Ltd.
- Tack Chee Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20250107424
- Publication date Mar 27, 2025
- SAMSUNG DISPLAY CO., LTD.
- Hyoungjun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRECISION HETEROGENEOUS INTEGRATION
- Publication number 20250105009
- Publication date Mar 27, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...
- Publication number 20250105041
- Publication date Mar 27, 2025
- SCREEN Holdings Co., Ltd.
- Hiroyuki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Tool Alignment Device And Method
- Publication number 20250096025
- Publication date Mar 20, 2025
- DIODES INCORPORATED
- Bartosz Kielban
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE
- Publication number 20250096023
- Publication date Mar 20, 2025
- SCREEN Holdings Co., Ltd.
- Joji KUWAHARA
- H01 - BASIC ELECTRIC ELEMENTS

using optical controlling means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Information processing apparatus for teaching transfer position of...

System and method for correcting non-ideal wafer topography

Method and apparatus for laser drilling blind vias

Pedestal setup using camera wafer

Wafer alignment apparatus and method for multi-cassette load port

Wafer positioning and correction method, system, and device

Ring carrier and substrate treating system

Transfer apparatus and transfer method

Resin shaping device

Estimation of chamber component conditions using substrate measurem...

Overlay measurement device and method, and system and program therefor

Device for mass transfer of mini light-emitting diodes (mini-LEDs)...

Overlay measurement device and method, and system and program therefor

Substrate transfer apparatus

FOUP transfer device

Substrate inspection system and method of use thereof

Substrate alignment systems and related methods

Wafer positioning method and apparatus

Method for manufacturing display device and apparatus for manufactu...

Bonding apparatus and method for correcting movement amount of bond...

Substrate processing system

Alignment of targets on opposite sides of a substrate

Substrate processing control method, substrate processing apparatus...

Wafer calibraiton method for a wafer calibration device

Methods of operating die attach systems

Substrate treating apparatus and substrate treating method using th...

Substrate storing and aligning apparatus in substrate bonding equip...

Apparatus, system and method for providing a fiber optic coupler

Substrate inspection system and a method of use thereof

Device and method for mass transfer of mini light-emitting diodes (...

Patents Applicationslast 30 patents

CONVEYANCE APPARATUS, CONVEYANCE METHOD, AND SEMICONDUCTOR APPARATU...

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

WAFER POSITIONING AND CORRECTION METHOD, SYSTEM, AND DEVICE

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...

Method of Semiconductor Fabrication

SUBSTRATE PROCESSING APPARATUS

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

METHOD OF MEASURING EDGE ECCENTRICITY WHILE WAFER IS ON PRE-ALIGNER

TRANSFER UNIT, AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

DEVICE FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS)...

MULTI-AXIS OPERATION APPARATUS IN ISOTROPIC ARRANGEMENT

METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...

METHOD AND SYSTEM OF OPTICAL NANOSCALE ALIGNMENT

SUBSTRATE PROCESSING DEVICE AND POSITIONING METHOD OF CONVEYANCE ARM

DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...

CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...

MULTIZONE COATED VACUUM CHUCK FOR IR MEASUREMENT

SYSTEM AND PROCESS FOR SORTING DIE FROM WAFER USING ANGLED WAFER TA...

METHOD AND SYSTEM FOR DIE BONDING

WAFER BONDING METHOD INCLUDING REMOVING TRANSPARENT OR TRANSLUCENT...

Calibration Method and Substrate Processing System

MICRO-SEMICONDUCTOR CHIP WETTING ALIGNMENT APPARATUS

MULTI-COORDINATE SYSTEM CALIBRATION AND EQUIPMENT ALIGNMENT METHOD,...

Semiconductor Device and Method of Detecting Semiconductor Wafer Ce...

APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE

HIGH-PRECISION HETEROGENEOUS INTEGRATION

SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...

Semiconductor Manufacturing Tool Alignment Device And Method

APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE