using optical controlling means

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CPC
H01L21/681

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/681using optical controlling means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus, method of reading position o...
- Patent number 12,224,196
- Issue date Feb 11, 2025
- SK hynix Inc.
- Chan Ho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of image based robot alignment
- Patent number 12,211,718
- Issue date Jan 28, 2025
- GlobalWafers Co., Ltd.
- TaeHyeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component conveying instrument with an adjusting unit and method of...
- Patent number 12,211,721
- Issue date Jan 28, 2025
- Muehlbauer GmbH & Co. KG
- Rainer Miehlich
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Alignment device and alignment method
- Patent number 12,211,723
- Issue date Jan 28, 2025
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical measurement tool containing chromatic aberration enhancemen...
- Patent number 12,211,724
- Issue date Jan 28, 2025
- SanDisk Technologies LLC
- Michio Ohi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vision-based wafer pre-alignment platform and alignment method
- Patent number 12,205,325
- Issue date Jan 21, 2025
- WUXI XIVI SCIENCE AND TECHNOLOGY CO., LTD.
- Minjie Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding system
- Patent number 12,198,963
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer method and substrate transfer system
- Patent number 12,198,955
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Wataru Matsumoto
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method and system for positioning center of V-type notch of wafer,...
- Patent number 12,183,616
- Issue date Dec 31, 2024
- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD.
- Leilei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bonding a plurality of dies to a carrier p...
- Patent number 12,183,620
- Issue date Dec 31, 2024
- PYXIS CF PTE. LTD.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly and method for transferring substrate
- Patent number 12,176,234
- Issue date Dec 24, 2024
- Semes Co., Ltd.
- Sung Hyuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer detection method and substrate processing apparatus
- Patent number 12,159,798
- Issue date Dec 3, 2024
- Tokyo Electron Limited
- Akira Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in wafer processing
- Patent number 12,148,640
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated substrate measurement system
- Patent number 12,148,647
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration jig and calibration method
- Patent number 12,148,645
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Andrew Myles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligner apparatus
- Patent number 12,148,646
- Issue date Nov 19, 2024
- Kawasaki Jukogyo Kabushiki Kaisha
- Haruhiko Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing system, processing method, measurement apparatus, substr...
- Patent number 12,140,878
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Shinichi Egashira
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor manufacturing apparatus including bonding head
- Patent number 12,136,563
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Mingu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device mass transfer tool
- Patent number 12,131,922
- Issue date Oct 29, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer system, transfer device, and transfer method
- Patent number 12,131,937
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment platform and electronic component transmission apparatus
- Patent number 12,131,935
- Issue date Oct 29, 2024
- HON. PRECISION, INC.
- Yuan-Long Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment and transport of substrate and focus ring
- Patent number 12,131,936
- Issue date Oct 29, 2024
- Keisuke Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for determining wafer characters
- Patent number 12,125,730
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Da Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement apparatus and arrangement method
- Patent number 12,112,962
- Issue date Oct 8, 2024
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for aligning substrates
- Patent number 12,106,993
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Jozsef Krol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test device, change kit, and method of exchanging change kit
- Patent number 12,106,997
- Issue date Oct 1, 2024
- Tokyo Electron Limited
- Hiroki Hosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing apparatus
- Patent number 12,094,742
- Issue date Sep 17, 2024
- Disco Corporation
- Yoshinobu Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate bonding device
- Patent number 12,094,747
- Issue date Sep 17, 2024
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHELF STATUS DETERMINATION
- Publication number 20250054795
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Guancyun LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING SYSTEM AND METHOD
- Publication number 20250054798
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20250054806
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Misato HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR THE ALIGNMENT OF A SUBSTRATE
- Publication number 20250046639
- Publication date Feb 6, 2025
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT SYSTEM, AND METHOD...
- Publication number 20250046645
- Publication date Feb 6, 2025
- Tokyo Electron Limited
- Tamihiro KOBAYASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...
- Publication number 20250038030
- Publication date Jan 30, 2025
- CANON KABUSIKI KAISHA
- Byung-Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER UNIT AND TRANSFER ROBOT SYSTEM INCLUDING TRANSFER ROBOT
- Publication number 20250038032
- Publication date Jan 30, 2025
- SEMES CO., LTD.
- Donghoon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT DEVICE AND METHOD AND WAFER SPEED CALCULATION METHOD
- Publication number 20250038031
- Publication date Jan 30, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Qi YIN
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD
- Publication number 20250024155
- Publication date Jan 16, 2025
- SCREEN Holdings Co., Ltd.
- Shinji SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE AND SUBSTRATE INSPECTION METHOD IN...
- Publication number 20240429083
- Publication date Dec 26, 2024
- PSK INC.
- Man Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Teaching Transfer Robot and Substrate Processing System
- Publication number 20240424666
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Kosuke KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOUP HAVING END EFFECTOR DETECTION SENSOR, AND INTEGRATED DATA MANA...
- Publication number 20240429082
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Kyu Ok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR ADJUSTING A DETECTION MEANS
- Publication number 20240420976
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Harald ROHRINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE AND CONTROL OF THE SAME
- Publication number 20240412407
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Junghee Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-PRECISION IN-SITU VERIFICATION AND CORRECTION OF WAFER POSITIO...
- Publication number 20240412997
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Michael Lee SWEARS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR III-V/SILICON HYBRID INTEGRATION
- Publication number 20240402427
- Publication date Dec 5, 2024
- ROCKLEY PHOTONICS LIMITED
- Guomin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240404852
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR TRANSFERRING SEMICONDUCTOR COMPONENT
- Publication number 20240395590
- Publication date Nov 28, 2024
- JI HUA LABORATORY
- Yanliang QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CHUCKING A WAFER
- Publication number 20240395594
- Publication date Nov 28, 2024
- PROTEC
- Hungsuk YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20240395634
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Takamasa Sugiura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHODS FOR DETERMINING WAFER CHARACTERS
- Publication number 20240387223
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Da KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING
- Publication number 20240387222
- Publication date Nov 21, 2024
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20240387177
- Publication date Nov 21, 2024
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHOD OF OPERATION
- Publication number 20240379398
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Chun LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PUF GENERATION USING VARIATIONS IN TRANSISTOR THRESHOLD...
- Publication number 20240371674
- Publication date Nov 7, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Shih-Lien Linus Lu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
DEVICE AND METHOD FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (...
- Publication number 20240363792
- Publication date Oct 31, 2024
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALIBRATION POD FOR ROBOTIC WAFER CARRIER HANDLING AND CALIBRATION...
- Publication number 20240363379
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG SUBSTRATE AND TEACHING METHOD
- Publication number 20240355662
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Hiromitsu SAKAUE
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

using optical controlling means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus, method of reading position o...

Methods and systems of image based robot alignment

Component conveying instrument with an adjusting unit and method of...

Alignment device and alignment method

Optical measurement tool containing chromatic aberration enhancemen...

Vision-based wafer pre-alignment platform and alignment method

Bonding system

Substrate transfer method and substrate transfer system

Method and system for positioning center of V-type notch of wafer,...

Apparatus and method for bonding a plurality of dies to a carrier p...

Assembly and method for transferring substrate

Transfer detection method and substrate processing apparatus

Mounting device and mounting method

Method and apparatus for use in wafer processing

Integrated substrate measurement system

Calibration jig and calibration method

Aligner apparatus

Processing system, processing method, measurement apparatus, substr...

Semiconductor manufacturing apparatus including bonding head

Micro device mass transfer tool

Transfer system, transfer device, and transfer method

Alignment platform and electronic component transmission apparatus

Alignment and transport of substrate and focus ring

Apparatus and methods for determining wafer characters

Arrangement apparatus and arrangement method

Method and device for aligning substrates

Test device, change kit, and method of exchanging change kit

Apparatus for stacking substrates and method for the same

Processing apparatus

Substrate bonding device

Patents Applicationslast 30 patents

SHELF STATUS DETERMINATION

BONDING SYSTEM AND METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

METHOD AND DEVICE FOR THE ALIGNMENT OF A SUBSTRATE

SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT SYSTEM, AND METHOD...

SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...

TRANSFER UNIT AND TRANSFER ROBOT SYSTEM INCLUDING TRANSFER ROBOT

WAFER ALIGNMENT DEVICE AND METHOD AND WAFER SPEED CALCULATION METHOD

SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD

APPARATUS FOR TREATING SUBSTRATE AND SUBSTRATE INSPECTION METHOD IN...

Method for Teaching Transfer Robot and Substrate Processing System

FOUP HAVING END EFFECTOR DETECTION SENSOR, AND INTEGRATED DATA MANA...

DEVICE AND METHOD FOR ADJUSTING A DETECTION MEANS

SEMICONDUCTOR MANUFACTURING DEVICE AND CONTROL OF THE SAME

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

HIGH-PRECISION IN-SITU VERIFICATION AND CORRECTION OF WAFER POSITIO...

METHOD FOR III-V/SILICON HYBRID INTEGRATION

PROCESSING METHOD AND PROCESSING SYSTEM

System and Method for Bonding Semiconductor Devices

DEVICE AND METHOD FOR TRANSFERRING SEMICONDUCTOR COMPONENT

APPARATUS FOR CHUCKING A WAFER

MOUNTING DEVICE AND MOUNTING METHOD

APPARATUS AND METHODS FOR DETERMINING WAFER CHARACTERS

METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

SEMICONDUCTOR PROCESSING TOOL AND METHOD OF OPERATION

METHOD FOR PUF GENERATION USING VARIATIONS IN TRANSISTOR THRESHOLD...

DEVICE AND METHOD FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (...

CALIBRATION POD FOR ROBOTIC WAFER CARRIER HANDLING AND CALIBRATION...

JIG SUBSTRATE AND TEACHING METHOD