using optical controlling means

Industry

CPC
H01L21/681

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/681using optical controlling means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatus, system and method for providing a fiber optic coupler
- Patent number 12,272,587
- Issue date Apr 8, 2025
- JABIL INC.
- Jeroen Bosboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate inspection system and a method of use thereof
- Patent number 12,258,665
- Issue date Mar 25, 2025
- JNK TECH
- Youngjin Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for mass transfer of mini light-emitting diodes (...
- Patent number 12,261,239
- Issue date Mar 25, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system and component mounting method
- Patent number 12,261,070
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component transfer apparatus, electronic component trans...
- Patent number 12,261,071
- Issue date Mar 25, 2025
- ASTI GLOBAL INC., TAIWAN
- Ming-Feng Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for dynamically provisioning cyber training environments
- Patent number 12,237,199
- Issue date Feb 25, 2025
- Circadence Corporation
- Laura Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for PUF generation using variations in transistor threshold...
- Patent number 12,237,197
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Lien Linus Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area camera substrate pre-aligner
- Patent number 12,237,198
- Issue date Feb 25, 2025
- Onto Innovation Inc.
- Jason Paul Remillard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metrology and process control for semiconductor manufacturing
- Patent number 12,236,364
- Issue date Feb 25, 2025
- Nova Ltd.
- Eitan Rothstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Micro-semiconductor chip wetting alignment apparatus
- Patent number 12,230,525
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and image capturing method
- Patent number 12,230,523
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Tadashi Enomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus, method of reading position o...
- Patent number 12,224,196
- Issue date Feb 11, 2025
- SK hynix Inc.
- Chan Ho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of image based robot alignment
- Patent number 12,211,718
- Issue date Jan 28, 2025
- GlobalWafers Co., Ltd.
- TaeHyeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component conveying instrument with an adjusting unit and method of...
- Patent number 12,211,721
- Issue date Jan 28, 2025
- Muehlbauer GmbH & Co. KG
- Rainer Miehlich
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Alignment device and alignment method
- Patent number 12,211,723
- Issue date Jan 28, 2025
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical measurement tool containing chromatic aberration enhancemen...
- Patent number 12,211,724
- Issue date Jan 28, 2025
- SanDisk Technologies LLC
- Michio Ohi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vision-based wafer pre-alignment platform and alignment method
- Patent number 12,205,325
- Issue date Jan 21, 2025
- WUXI XIVI SCIENCE AND TECHNOLOGY CO., LTD.
- Minjie Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding system
- Patent number 12,198,963
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer method and substrate transfer system
- Patent number 12,198,955
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Wataru Matsumoto
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method and system for positioning center of V-type notch of wafer,...
- Patent number 12,183,616
- Issue date Dec 31, 2024
- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD.
- Leilei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bonding a plurality of dies to a carrier p...
- Patent number 12,183,620
- Issue date Dec 31, 2024
- PYXIS CF PTE. LTD.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly and method for transferring substrate
- Patent number 12,176,234
- Issue date Dec 24, 2024
- Semes Co., Ltd.
- Sung Hyuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer detection method and substrate processing apparatus
- Patent number 12,159,798
- Issue date Dec 3, 2024
- Tokyo Electron Limited
- Akira Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in wafer processing
- Patent number 12,148,640
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated substrate measurement system
- Patent number 12,148,647
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration jig and calibration method
- Patent number 12,148,645
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Andrew Myles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligner apparatus
- Patent number 12,148,646
- Issue date Nov 19, 2024
- Kawasaki Jukogyo Kabushiki Kaisha
- Haruhiko Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing system, processing method, measurement apparatus, substr...
- Patent number 12,140,878
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Shinichi Egashira
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor manufacturing apparatus including bonding head
- Patent number 12,136,563
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Mingu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-COORDINATE SYSTEM CALIBRATION AND EQUIPMENT ALIGNMENT METHOD,...
- Publication number 20250113682
- Publication date Apr 3, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Chengfei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Detecting Semiconductor Wafer Ce...
- Publication number 20250112078
- Publication date Apr 3, 2025
- STATS ChipPAC Pte Ltd.
- Tack Chee Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRECISION HETEROGENEOUS INTEGRATION
- Publication number 20250105009
- Publication date Mar 27, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...
- Publication number 20250105041
- Publication date Mar 27, 2025
- SCREEN Holdings Co., Ltd.
- Hiroyuki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20250107424
- Publication date Mar 27, 2025
- SAMSUNG DISPLAY CO., LTD.
- Hyoungjun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Tool Alignment Device And Method
- Publication number 20250096025
- Publication date Mar 20, 2025
- DIODES INCORPORATED
- Bartosz Kielban
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE
- Publication number 20250096023
- Publication date Mar 20, 2025
- SCREEN Holdings Co., Ltd.
- Joji KUWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PRE-ALIGNER
- Publication number 20250079221
- Publication date Mar 6, 2025
- APPLIED MATERIALS ISRAEL LTD.
- Itamar Orenbuch
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT HANDLER
- Publication number 20250079222
- Publication date Mar 6, 2025
- Semiconductor Technologies & Instruments Pte Ltd
- Chin Fong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD
- Publication number 20250079397
- Publication date Mar 6, 2025
- Canon Kabushiki Kaisha
- SHUN TOKAIRIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHELF STATUS DETERMINATION
- Publication number 20250054795
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Guancyun LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING SYSTEM AND METHOD
- Publication number 20250054798
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20250054806
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Misato HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR THE ALIGNMENT OF A SUBSTRATE
- Publication number 20250046639
- Publication date Feb 6, 2025
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT SYSTEM, AND METHOD...
- Publication number 20250046645
- Publication date Feb 6, 2025
- Tokyo Electron Limited
- Tamihiro KOBAYASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...
- Publication number 20250038030
- Publication date Jan 30, 2025
- CANON KABUSIKI KAISHA
- Byung-Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER UNIT AND TRANSFER ROBOT SYSTEM INCLUDING TRANSFER ROBOT
- Publication number 20250038032
- Publication date Jan 30, 2025
- SEMES CO., LTD.
- Donghoon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT DEVICE AND METHOD AND WAFER SPEED CALCULATION METHOD
- Publication number 20250038031
- Publication date Jan 30, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Qi YIN
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD
- Publication number 20250024155
- Publication date Jan 16, 2025
- SCREEN Holdings Co., Ltd.
- Shinji SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE AND SUBSTRATE INSPECTION METHOD IN...
- Publication number 20240429083
- Publication date Dec 26, 2024
- PSK INC.
- Man Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Teaching Transfer Robot and Substrate Processing System
- Publication number 20240424666
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Kosuke KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOUP HAVING END EFFECTOR DETECTION SENSOR, AND INTEGRATED DATA MANA...
- Publication number 20240429082
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Kyu Ok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR ADJUSTING A DETECTION MEANS
- Publication number 20240420976
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Harald ROHRINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE AND CONTROL OF THE SAME
- Publication number 20240412407
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Junghee Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-PRECISION IN-SITU VERIFICATION AND CORRECTION OF WAFER POSITIO...
- Publication number 20240412997
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Michael Lee SWEARS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR III-V/SILICON HYBRID INTEGRATION
- Publication number 20240402427
- Publication date Dec 5, 2024
- ROCKLEY PHOTONICS LIMITED
- Guomin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240404852
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20240395634
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Takamasa Sugiura
- G06 - COMPUTING CALCULATING COUNTING

using optical controlling means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus, system and method for providing a fiber optic coupler

Substrate inspection system and a method of use thereof

Device and method for mass transfer of mini light-emitting diodes (...

Component mounting system and component mounting method

Electronic component transfer apparatus, electronic component trans...

System for dynamically provisioning cyber training environments

Method for PUF generation using variations in transistor threshold...

Area camera substrate pre-aligner

Metrology and process control for semiconductor manufacturing

Micro-semiconductor chip wetting alignment apparatus

Substrate processing apparatus and image capturing method

Semiconductor manufacturing apparatus, method of reading position o...

Methods and systems of image based robot alignment

Component conveying instrument with an adjusting unit and method of...

Alignment device and alignment method

Optical measurement tool containing chromatic aberration enhancemen...

Vision-based wafer pre-alignment platform and alignment method

Bonding system

Substrate transfer method and substrate transfer system

Method and system for positioning center of V-type notch of wafer,...

Apparatus and method for bonding a plurality of dies to a carrier p...

Assembly and method for transferring substrate

Transfer detection method and substrate processing apparatus

Mounting device and mounting method

Method and apparatus for use in wafer processing

Integrated substrate measurement system

Calibration jig and calibration method

Aligner apparatus

Processing system, processing method, measurement apparatus, substr...

Semiconductor manufacturing apparatus including bonding head

Patents Applicationslast 30 patents

MULTI-COORDINATE SYSTEM CALIBRATION AND EQUIPMENT ALIGNMENT METHOD,...

Semiconductor Device and Method of Detecting Semiconductor Wafer Ce...

HIGH-PRECISION HETEROGENEOUS INTEGRATION

SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...

APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE

Semiconductor Manufacturing Tool Alignment Device And Method

APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE

SUBSTRATE PRE-ALIGNER

COMPONENT HANDLER

BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD

SHELF STATUS DETERMINATION

BONDING SYSTEM AND METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

METHOD AND DEVICE FOR THE ALIGNMENT OF A SUBSTRATE

SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT SYSTEM, AND METHOD...

SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...

TRANSFER UNIT AND TRANSFER ROBOT SYSTEM INCLUDING TRANSFER ROBOT

WAFER ALIGNMENT DEVICE AND METHOD AND WAFER SPEED CALCULATION METHOD

SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD

APPARATUS FOR TREATING SUBSTRATE AND SUBSTRATE INSPECTION METHOD IN...

Method for Teaching Transfer Robot and Substrate Processing System

FOUP HAVING END EFFECTOR DETECTION SENSOR, AND INTEGRATED DATA MANA...

DEVICE AND METHOD FOR ADJUSTING A DETECTION MEANS

SEMICONDUCTOR MANUFACTURING DEVICE AND CONTROL OF THE SAME

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

HIGH-PRECISION IN-SITU VERIFICATION AND CORRECTION OF WAFER POSITIO...

METHOD FOR III-V/SILICON HYBRID INTEGRATION

PROCESSING METHOD AND PROCESSING SYSTEM

System and Method for Bonding Semiconductor Devices

MOUNTING DEVICE AND MOUNTING METHOD