using peeling wheel

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H01L2221/68395

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

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H01L2221/68395using peeling wheel

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging apparatus and method of manufacturing semic...
- Patent number 11,923,214
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Junghyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode devices based on superconductivity
- Patent number 11,502,237
- Issue date Nov 15, 2022
- PSIQUANTUM CORP.
- Faraz Najafi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, and separation...
- Patent number 11,107,846
- Issue date Aug 31, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Hideaki Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging apparatus and method of manufacturing semic...
- Patent number 11,062,924
- Issue date Jul 13, 2021
- Samsung Electronics Co., Ltd.
- Junghyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode devices based on superconductivity
- Patent number 10,861,734
- Issue date Dec 8, 2020
- PSIQUANTUM CORP.
- Faraz Najafi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Temporary bonding layer for flexible electronics fabrication
- Patent number 10,840,120
- Issue date Nov 17, 2020
- ARES MATERIALS INC.
- Radu Reit
- B32 - LAYERED PRODUCTS
Information Patent Grant
LED module and method for fabricating the same
- Patent number 10,756,071
- Issue date Aug 25, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module and method for fabricating the same
- Patent number 10,756,070
- Issue date Aug 25, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, and separation...
- Patent number 10,586,817
- Issue date Mar 10, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Hideaki Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating LED module using transfer tape
- Patent number 10,559,554
- Issue date Feb 11, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED module and method for fabricating the same
- Patent number 10,468,393
- Issue date Nov 5, 2019
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module and method for fabricating the same
- Patent number 10,468,392
- Issue date Nov 5, 2019
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for forming die stacks
- Patent number 10,269,782
- Issue date Apr 23, 2019
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling apparatus and manufacturing apparatus of semiconductor device
- Patent number 10,134,784
- Issue date Nov 20, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Shingo Eguchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
LED Module and method for fabricating the same
- Patent number 10,103,131
- Issue date Oct 16, 2018
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for forming die stacks
- Patent number 10,062,679
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for forming die stacks
- Patent number 9,881,910
- Issue date Jan 30, 2018
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation apparatus
- Patent number 9,849,660
- Issue date Dec 26, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Saki Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding a glass substrate from carrier using ultrasonic wave
- Patent number 9,847,243
- Issue date Dec 19, 2017
- Corning Incorporated
- Alain Robert Emile Carre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling apparatus and manufacturing apparatus of semiconductor device
- Patent number 9,570,329
- Issue date Feb 14, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Shingo Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus of separating flexible substrate from glass substrate and...
- Patent number 9,508,585
- Issue date Nov 29, 2016
- BOE Technology Group Co., Ltd.
- Xue Mao
- G02 - OPTICS
Information Patent Grant
Peeling apparatus and manufacturing apparatus of semiconductor device
- Patent number 9,397,126
- Issue date Jul 19, 2016
- Semiconductor Energy Laboratory Co., Ltd.
- Shingo Eguchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for processing, in particular, thin rear sides of a wafer, w...
- Patent number 8,911,583
- Issue date Dec 16, 2014
- Thin Materials AG
- Andreas Jakob
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling apparatus and manufacturing apparatus of semiconductor device
- Patent number 8,889,438
- Issue date Nov 18, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Shingo Eguchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing multilayer film
- Patent number 8,801,879
- Issue date Aug 12, 2014
- Hitachi Chemical Company, Ltd.
- Tsuyoshi Tamaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Peeling apparatus and manufacturing apparatus of semiconductor device
- Patent number 8,137,417
- Issue date Mar 20, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Shingo Eguchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device and method for joining substrates
- Patent number 7,988,803
- Issue date Aug 2, 2011
- FUJIFILM Corporation
- Kosuke Takasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor circuit device
- Patent number 7,968,428
- Issue date Jun 28, 2011
- Renesas Electronics Corporation
- Yoshiyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet peeling apparatus and sheet peeling method
- Patent number 7,846,289
- Issue date Dec 7, 2010
- Lintec Corporation
- Masaki Tsujimoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Roll-on encapsulation method for semiconductor packages
- Patent number 7,829,389
- Issue date Nov 9, 2010
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Diode Devices Based on Superconductivity
- Publication number 20230217841
- Publication date Jul 6, 2023
- PsiQuantum Corp.
- Faraz Najafi
- B32 - LAYERED PRODUCTS
Information Patent Application
Diode Devices Based on Superconductivity
- Publication number 20210408356
- Publication date Dec 30, 2021
- PsiQuantum Corp.
- Faraz Najafi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEPARATION...
- Publication number 20200203397
- Publication date Jun 25, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Hideaki KUWABARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200126957
- Publication date Apr 23, 2020
- LUMENS CO., LTD
- Taekyung YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUSES AND METHODS FOR FORMING DIE STACKS
- Publication number 20180337166
- Publication date Nov 22, 2018
- Micron Technology, Inc.
- MICHEL KOOPMANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180145056
- Publication date May 24, 2018
- LUMENS CO., LTD.
- Taekyoung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR FORMING DIE STACKS
- Publication number 20180108645
- Publication date Apr 19, 2018
- Micron Technology, Inc.
- MICHEL KOOPMANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEPARATION...
- Publication number 20170278878
- Publication date Sep 28, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Hideaki KUWABARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEELING METHOD
- Publication number 20170271380
- Publication date Sep 21, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Seiji YASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR FORMING DIE STACKS
- Publication number 20170221873
- Publication date Aug 3, 2017
- Micron Technology, Inc.
- MICHEL KOOPMANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS OF SEPARATING FLEXIBLE SUBSTRATE FROM GLASS SUBSTRATE AND...
- Publication number 20160358806
- Publication date Dec 8, 2016
- BOE TECHNOLOGY GROUP CO., LTD.
- Xue MAO
- B32 - LAYERED PRODUCTS
Information Patent Application
PEELING APPARATUS AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- Publication number 20160314999
- Publication date Oct 27, 2016
- Semiconductor Energy Laboratory Co., Ltd.
- Shingo EGUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS OF SEPARATING FLEXIBLE SUBSTRATE FROM GLASS SUBSTRATE AND...
- Publication number 20160118286
- Publication date Apr 28, 2016
- BOE TECHNOLOGY GROUP CO., LTD.
- Xue MAO
- B32 - LAYERED PRODUCTS
Information Patent Application
PEELING APPARATUS AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- Publication number 20120168066
- Publication date Jul 5, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Shingo EGUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
MOUNTED WAFER MANUFACTURING METHOD
- Publication number 20120160397
- Publication date Jun 28, 2012
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIV...
- Publication number 20110193244
- Publication date Aug 11, 2011
- Takashi MASUKO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DEBONDING A GLASS SUBSTRATE FROM CARRIER USING ULTRASONIC WAVE
- Publication number 20110048611
- Publication date Mar 3, 2011
- Alain Robert Emile Carre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR JOINING SUBSTRATES
- Publication number 20100108237
- Publication date May 6, 2010
- Fuji Photo Film Co., Ltd.
- Kosuke TAKASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING, IN PARTICULAR, THIN REAR SIDES OF A WAFER, W...
- Publication number 20100043608
- Publication date Feb 25, 2010
- JAKOB + RICHTER IP-VERWERTUNGS- GESELLSCHAFT MBH
- Andreas Jakob
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER FILM
- Publication number 20090236026
- Publication date Sep 24, 2009
- Hitachi Chemical Company, Ltd.
- Tsuyoshi Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROLL-ON ENCAPSULATION METHOD FOR SEMICONDUCTOR PACKAGES
- Publication number 20090093088
- Publication date Apr 9, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sheet peeling apparatus and peeling method
- Publication number 20090014124
- Publication date Jan 15, 2009
- LINTEC CORPORATION
- Masaki Tsujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER ASSEMBLY AND METHOD OF PROCESSING SEMICONDUCTOR...
- Publication number 20080296733
- Publication date Dec 4, 2008
- Disco Corporation
- Kiyotaka Kizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Peeling apparatus and manufacturing apparatus of semiconductor device
- Publication number 20080113486
- Publication date May 15, 2008
- Shingo Eguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Sheet Peeling Apparatus and Peeling Method
- Publication number 20080011412
- Publication date Jan 17, 2008
- LINTEC CORPORATION
- Masaki Tsujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sheet Peeling Apparatus and Sheet Peeling Method
- Publication number 20070235131
- Publication date Oct 11, 2007
- LINTEC CORPORATION
- Masaki Tsujimoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Device And Method For Joining Substrates
- Publication number 20070194438
- Publication date Aug 23, 2007
- Kosuke Takasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Suction unit
- Publication number 20070169895
- Publication date Jul 26, 2007
- LINTEC CORPORATION
- Kenji Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive film and process for preparing the same as well as adhesiv...
- Publication number 20070098995
- Publication date May 3, 2007
- HITACHI CHEMICAL CO., Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method and apparatus for peeling surface protective film
- Publication number 20070087475
- Publication date Apr 19, 2007
- Masaki Kanazawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

using peeling wheel

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packaging apparatus and method of manufacturing semic...

Diode devices based on superconductivity

Semiconductor device, manufacturing method thereof, and separation...

Semiconductor packaging apparatus and method of manufacturing semic...

Diode devices based on superconductivity

Temporary bonding layer for flexible electronics fabrication

LED module and method for fabricating the same

LED module and method for fabricating the same

Semiconductor device, manufacturing method thereof, and separation...

Method for fabricating LED module using transfer tape

LED module and method for fabricating the same

LED module and method for fabricating the same

Apparatuses and methods for forming die stacks

Peeling apparatus and manufacturing apparatus of semiconductor device

LED Module and method for fabricating the same

Apparatuses and methods for forming die stacks

Apparatuses and methods for forming die stacks

Separation apparatus

Debonding a glass substrate from carrier using ultrasonic wave

Peeling apparatus and manufacturing apparatus of semiconductor device

Apparatus of separating flexible substrate from glass substrate and...

Peeling apparatus and manufacturing apparatus of semiconductor device

Method for processing, in particular, thin rear sides of a wafer, w...

Peeling apparatus and manufacturing apparatus of semiconductor device

Method for manufacturing multilayer film

Peeling apparatus and manufacturing apparatus of semiconductor device

Device and method for joining substrates

Fabrication method of semiconductor circuit device

Sheet peeling apparatus and sheet peeling method

Roll-on encapsulation method for semiconductor packages

Patents Applicationslast 30 patents

Diode Devices Based on Superconductivity

Diode Devices Based on Superconductivity

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEPARATION...

LED MODULE AND METHOD FOR FABRICATING THE SAME

APPARATUSES AND METHODS FOR FORMING DIE STACKS

LED MODULE AND METHOD FOR FABRICATING THE SAME

APPARATUSES AND METHODS FOR FORMING DIE STACKS

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEPARATION...

PEELING METHOD

APPARATUSES AND METHODS FOR FORMING DIE STACKS

APPARATUS OF SEPARATING FLEXIBLE SUBSTRATE FROM GLASS SUBSTRATE AND...

PEELING APPARATUS AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

APPARATUS OF SEPARATING FLEXIBLE SUBSTRATE FROM GLASS SUBSTRATE AND...

PEELING APPARATUS AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

MOUNTED WAFER MANUFACTURING METHOD

ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIV...

DEBONDING A GLASS SUBSTRATE FROM CARRIER USING ULTRASONIC WAVE

DEVICE AND METHOD FOR JOINING SUBSTRATES

METHOD FOR PROCESSING, IN PARTICULAR, THIN REAR SIDES OF A WAFER, W...

METHOD FOR MANUFACTURING MULTILAYER FILM

ROLL-ON ENCAPSULATION METHOD FOR SEMICONDUCTOR PACKAGES

Sheet peeling apparatus and peeling method

SEMICONDUCTOR WAFER ASSEMBLY AND METHOD OF PROCESSING SEMICONDUCTOR...

Peeling apparatus and manufacturing apparatus of semiconductor device

Sheet Peeling Apparatus and Peeling Method

Sheet Peeling Apparatus and Sheet Peeling Method

Device And Method For Joining Substrates

Suction unit

Adhesive film and process for preparing the same as well as adhesiv...

Method and apparatus for peeling surface protective film