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METAL ETCHING WITH REDUCED TILT ANGLE
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Publication number 20240429064
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Publication date Dec 26, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chao-Hsuan CHEN
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Device and Method
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Publication number 20240413012
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Publication date Dec 12, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Tzuan-Horng Liu
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H01 - BASIC ELECTRIC ELEMENTS
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PARASITIC CAPACITANCE REDUCTION
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Publication number 20240363733
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Publication date Oct 31, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Jia-Heng Wang
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H01 - BASIC ELECTRIC ELEMENTS
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ION BEAM ETCH SYSTEM AND METHOD
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Publication number 20240355597
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Publication date Oct 24, 2024
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LAM RESEARCH CORPORATION
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Chih-Yang CHANG
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H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR DICING A SEMICONDUCTOR WAFER
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Publication number 20240321639
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Publication date Sep 26, 2024
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STMicroelectronics International N.V.
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Carlos Augusto SUAREZ SEGOVIA
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H01 - BASIC ELECTRIC ELEMENTS
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PLASMA PROCESSING METHOD
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Publication number 20240304456
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Publication date Sep 12, 2024
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Hitachi High-Tech Corporation
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Koichi TAKASAKI
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H01 - BASIC ELECTRIC ELEMENTS
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HIGH ENERGY ATOMIC LAYER ETCHING
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Publication number 20240274408
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Publication date Aug 15, 2024
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LAM RESEARCH CORPORATION
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Wenbing Yang
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H01 - BASIC ELECTRIC ELEMENTS
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WAFER BONDING METHOD
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Publication number 20240250061
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Publication date Jul 25, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Yung-Chi Lin
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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PLASMA PROCESSING METHOD
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Publication number 20240203751
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Publication date Jun 20, 2024
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Hitachi High-Tech Corporation
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Tatsuya HAYASHI
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H01 - BASIC ELECTRIC ELEMENTS