using plate connectors

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H01L2021/60015

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2021/60015using plate connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing a metal-ceramic substrate
- Patent number 12,059,739
- Issue date Aug 13, 2024
- Heraeus Deutschland GmbH & Co. KG
- Andre Schwöbel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,854,958
- Issue date Dec 26, 2023
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leads for leadframe and semiconductor package
- Patent number 11,830,791
- Issue date Nov 28, 2023
- Texas Instruments Incorporated
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal capacity control for relative temperature-based thermal shu...
- Patent number 11,545,418
- Issue date Jan 3, 2023
- Texas Instruments Incorporated
- Ankur Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fastening a semiconductor chip on a lead frame, and elect...
- Patent number 11,545,369
- Issue date Jan 3, 2023
- OSRAM OLED GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating circuit components in matrix batches
- Patent number 11,521,862
- Issue date Dec 6, 2022
- Chih-liang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,430,728
- Issue date Aug 30, 2022
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,315,848
- Issue date Apr 26, 2022
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming leadless semiconductor packages with plated lead...
- Patent number 11,145,581
- Issue date Oct 12, 2021
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fastening a semiconductor chip on a lead frame, and elect...
- Patent number 11,094,559
- Issue date Aug 17, 2021
- OSRAM OLED GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that uses bonding layer to join semiconductor...
- Patent number 11,088,131
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 10,937,725
- Issue date Mar 2, 2021
- Mitsubishi Electric Corporation
- Yuya Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bonding sheet, thermal bonding sheet with dicing tape, bond...
- Patent number 10,748,866
- Issue date Aug 18, 2020
- Nitto Denko Corporation
- Yuki Sugo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing semiconductor device that uses bonding laye...
- Patent number 10,727,217
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 10,256,210
- Issue date Apr 9, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming leadless semiconductor packages with plated lead...
- Patent number 10,163,766
- Issue date Dec 25, 2018
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder transfer sheet, solder bump, and solder precoating method us...
- Patent number 10,111,342
- Issue date Oct 23, 2018
- Senju Metal Industry Co., Ltd.
- Kaichi Tsuruta
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing a power semiconductor module
- Patent number 10,096,584
- Issue date Oct 9, 2018
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 9,786,632
- Issue date Oct 10, 2017
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 9,437,508
- Issue date Sep 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Zyunya Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240266277
- Publication date Aug 8, 2024
- AOI ELECTRONICS CO., LTD.
- Katsuhiro TAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...
- Publication number 20240186285
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE
- Publication number 20240079283
- Publication date Mar 7, 2024
- NEXPERIA B.V.
- Vegneswary Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20230411175
- Publication date Dec 21, 2023
- NEXPERIA B.V.
- Wai Wai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230352313
- Publication date Nov 2, 2023
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230352378
- Publication date Nov 2, 2023
- Infineon Technologies Austria AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230136604
- Publication date May 4, 2023
- Sumitomo Electric Industries, Ltd.
- Hiroshi NOTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE
- Publication number 20220410299
- Publication date Dec 29, 2022
- Heraeus Deutschland GmbH & Co. KG
- Andre SCHWÖBEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES
- Publication number 20220367339
- Publication date Nov 17, 2022
- GENERAL ELECTRIC COMPANY
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME RELATED A...
- Publication number 20210265175
- Publication date Aug 26, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES
- Publication number 20210125918
- Publication date Apr 29, 2021
- GENERAL ELECTRIC COMPANY
- Marco Francesco Aimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...
- Publication number 20210013176
- Publication date Jan 14, 2021
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADS FOR LEADFRAME AND SEMICONDUCTOR PACKAGE
- Publication number 20200135621
- Publication date Apr 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20200105655
- Publication date Apr 2, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Yuya MURAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING LEADLESS SEMICONDUCTOR PACKAGES WITH PLATED LEAD...
- Publication number 20190088579
- Publication date Mar 21, 2019
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING LEADLESS SEMICONDUCTOR PACKAGES WITH PLATED LEAD...
- Publication number 20180145013
- Publication date May 24, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20170373038
- Publication date Dec 28, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Us...
- Publication number 20170354042
- Publication date Dec 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi Tsuruta
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FAN-OUT BACK-TO-BACK CHIP STACKED PACKAGES AND THE METHOD FOR MANUF...
- Publication number 20170229426
- Publication date Aug 10, 2017
- Powertech Technology Inc.
- Ching Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Power Semiconductor Module
- Publication number 20170125395
- Publication date May 4, 2017
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20170033079
- Publication date Feb 2, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE HAVING AN OXIDE SURFACE FINISH AS A SOLDER MASK,...
- Publication number 20160064252
- Publication date Mar 3, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Jack Ajoian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGE CARRIER, AND METHODS OF MANUFACTURING E...
- Publication number 20150262927
- Publication date Sep 17, 2015
- ADL ENGINEERING INC.
- CHENG-YU KANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20150035132
- Publication date Feb 5, 2015
- PANASONIC CORPORATION
- Zyunya Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

using plate connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing a metal-ceramic substrate

Wafer level stacked structures having integrated passive features

Leads for leadframe and semiconductor package

Power module package and method of manufacturing the same

Thermal capacity control for relative temperature-based thermal shu...

Method of fastening a semiconductor chip on a lead frame, and elect...

Process for fabricating circuit components in matrix batches

Wafer level stacked structures having integrated passive features

Semiconductor device and method of manufacturing semiconductor device

Methods of forming leadless semiconductor packages with plated lead...

Method of fastening a semiconductor chip on a lead frame, and elect...

Semiconductor device that uses bonding layer to join semiconductor...

Power module package

Semiconductor device and method for manufacturing thereof

Thermal bonding sheet, thermal bonding sheet with dicing tape, bond...

Method of manufacturing semiconductor device that uses bonding laye...

Semiconductor package structure and method for forming the same

Methods of forming leadless semiconductor packages with plated lead...

Solder transfer sheet, solder bump, and solder precoating method us...

Method for producing a power semiconductor module

Semiconductor package structure and method for forming the same

Method for manufacturing semiconductor device and semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...

SEMICONDUCTOR DEVICE AND A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE

WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES

POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME RELATED A...

WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES

PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...

LEADS FOR LEADFRAME AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

METHODS OF FORMING LEADLESS SEMICONDUCTOR PACKAGES WITH PLATED LEAD...

METHODS OF FORMING LEADLESS SEMICONDUCTOR PACKAGES WITH PLATED LEAD...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Us...

FAN-OUT BACK-TO-BACK CHIP STACKED PACKAGES AND THE METHOD FOR MANUF...

Method for Producing a Power Semiconductor Module

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTRONIC MODULE HAVING AN OXIDE SURFACE FINISH AS A SOLDER MASK,...

ELECTRONIC PACKAGE, PACKAGE CARRIER, AND METHODS OF MANUFACTURING E...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE