using preformed bumps

Industry

CPC
H01L2224/11334

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11334using preformed bumps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chip package
- Patent number 12,062,618
- Issue date Aug 13, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale package
- Patent number 12,057,417
- Issue date Aug 6, 2024
- Texas Instruments Incorporated
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical inductor for WLCSP
- Patent number 11,984,246
- Issue date May 14, 2024
- Intel Corporation
- Andreas Wolter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless gang die bonding arrangement
- Patent number 11,972,968
- Issue date Apr 30, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,894,306
- Issue date Feb 6, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,862,589
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,810,878
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,798,860
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,742,305
- Issue date Aug 29, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,676,825
- Issue date Jun 13, 2023
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device including patternin...
- Patent number 11,670,609
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 11,652,088
- Issue date May 16, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding interposer and integrated circuit chip, and ultrasound prob...
- Patent number 11,631,798
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Kyung-moo Choi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Semiconductor package with protected sidewall and method of forming...
- Patent number 11,562,937
- Issue date Jan 24, 2023
- STMicroelectronics Pte Ltd
- Yun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,538,763
- Issue date Dec 27, 2022
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MAKING
- Publication number 20240387500
- Publication date Nov 21, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240379566
- Publication date Nov 14, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGE
- Publication number 20240379597
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURING METHOD FOR SEMICON...
- Publication number 20240347484
- Publication date Oct 17, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING COLUMN TYPE DEPOSITS
- Publication number 20240332233
- Publication date Oct 3, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS GANG DIE BONDING ARRANGEMENT
- Publication number 20240304485
- Publication date Sep 12, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...
- Publication number 20240234358
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- JUNHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Polymer Layer to Reduce Stress
- Publication number 20230260939
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230178506
- Publication date Jun 8, 2023
- Mitsubishi Electric Corporation
- Tatsushi MORISADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package and the Methods of Manufacturing
- Publication number 20230114652
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20220262765
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20220028812
- Publication date Jan 27, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluxless gang die bonding arrangement
- Publication number 20220005720
- Publication date Jan 6, 2022
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
- Publication number 20210358874
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hyung Sun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20210335714
- Publication date Oct 28, 2021
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210305116
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...
- Publication number 20210227735
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20210227734
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Tin-Based Contacting Metal
- Publication number 20210227732
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20210227733
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20210219474
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20210219475
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20210193484
- Publication date Jun 24, 2021
- Murata Manufacturing Co., Ltd.
- Kenichi SHIMAMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Pattern Polymer Layer to Reduce Stress
- Publication number 20210175190
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS

using preformed bumps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Single-shot encapsulation

Semiconductor wafer and method of ball drop on thin wafer with edge...

Tools and systems for processing semiconductor devices, and methods...

Integrated fan-out package and the methods of manufacturing

Low pressure sintering powder

Chip package

Integrated fan-out package structures with recesses in molding comp...

Wafer chip scale package

Fingerprint sensor and manufacturing method thereof

Vertical inductor for WLCSP

Fluxless gang die bonding arrangement

Contact pad for semiconductor device

Chip package

Semiconductor device and method of stacking semiconductor die for s...

Wafer-level package including under bump metal layer

Semiconductor device and method of forming a 3D interposer system-i...

Conductive bump of a semiconductor device and fabricating method th...

Connector structure and method of forming same

Wafer-level package including under bump metal layer

Semiconductor structure and manufacturing method thereof

Semiconductor device and manufacturing method of semiconductor device

Interconnect structure and method of forming same

Semiconductor device and method of making wafer level chip scale pa...

Semiconductor chip

Method for manufacturing a semiconductor device including patternin...

System-in-package with double-sided molding

Semiconductor device and method of forming embedded die substrate,...

Bonding interposer and integrated circuit chip, and ultrasound prob...

Semiconductor package with protected sidewall and method of forming...

Chip package

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

MULTI-CHIP PACKAGE AND METHOD OF MAKING

METHOD OF FORMING PACKAGE STRUCTURE

CHIP PACKAGE

WAFER CHIP SCALE PACKAGE

SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURING METHOD FOR SEMICON...

METHOD OF BONDING COLUMN TYPE DEPOSITS

FLUXLESS GANG DIE BONDING ARRANGEMENT

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...

Patterning Polymer Layer to Reduce Stress

POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...

Integrated Fan-Out Package and the Methods of Manufacturing

Tools and Systems for Processing Semiconductor Devices, and Methods...

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

Fluxless gang die bonding arrangement

WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER

CHIP PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

SEMICONDUCTOR CHIP

Pattern Polymer Layer to Reduce Stress