using preformed layer

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H01L2224/27334

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/27334using preformed layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 11,837,550
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,735,556
- Issue date Aug 22, 2023
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 11,195,813
- Issue date Dec 7, 2021
- Dexerials Corporation
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,133,279
- Issue date Sep 28, 2021
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 10,964,641
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 10,804,235
- Issue date Oct 13, 2020
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240266311
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
- Publication number 20230378075
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
- Publication number 20230307407
- Publication date Sep 28, 2023
- Tohru YASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20230137299
- Publication date May 4, 2023
- Showa Denko Materials Co., Ltd.
- Takashi TATSUZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220254745
- Publication date Aug 11, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220130783
- Publication date Apr 28, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20210398931
- Publication date Dec 23, 2021
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327739
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327740
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
- Publication number 20210233854
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20200350281
- Publication date Nov 5, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200343211
- Publication date Oct 29, 2020
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20200328182
- Publication date Oct 15, 2020
- Intel IP Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20200144214
- Publication date May 7, 2020
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200098718
- Publication date Mar 26, 2020
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
- Publication number 20190311988
- Publication date Oct 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
- Publication number 20190237424
- Publication date Aug 1, 2019
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...
- Publication number 20180286831
- Publication date Oct 4, 2018
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20180277512
- Publication date Sep 27, 2018
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS

using preformed layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming semiconductor packages having through package vias

Selective transfer of micro devices

Method of forming semiconductor packages having through package vias

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Connection structure

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Electroconductive film, roll, connected structure, and process for...

Adhesive bonding composition and method of use

Adhesive for semiconductor device, and high productivity method for...

Semiconductor devices and methods of making the same

Chip assembly

Selective micro device transfer to receiver substrate

Sintering materials and attachment methods using same

Anisotropic conductive film and production method of the same

Connection structure

Alignment method, method for connecting electronic component, metho...

Method of forming semiconductor packages having through package vias

Bump-forming film, semiconductor device and manufacturing method th...

Semiconductor packaging structure and process

Die stack assembly using an edge separation structure for connectiv...

Connection structure

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Die stack assembly using an edge separation structure for connectiv...

Adhesive bonding composition and method of use

Semiconductor devices and methods of making the same

Bond materials with enhanced plasma resistant characteristics and a...

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF MICRO DEVICES

SOLDERABLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

Method of Forming Semiconductor Packages Having Through Package Vias

MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

CONNECTION STRUCTURE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

Method of Forming Semiconductor Packages Having Through Package Vias

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

CONNECTION STRUCTURE

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

ANISOTROPIC CONDUCTIVE FILM

CONNECTION STRUCTURE

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

Method of Forming Semiconductor Packages Having Through Package Vias

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME