using resilient parts in the bump connector or in the bonding area

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H01L2224/81899

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81899using resilient parts in the bump connector or in the bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connecting elements for producing hybrid electronic circuits
- Patent number 9,166,338
- Issue date Oct 20, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,959,764
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection and assembly of three-dimensional chip packages
- Patent number 8,772,920
- Issue date Jul 8, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallurgical clamshell methods for micro land grid array fabrication
- Patent number 8,651,877
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,293,577
- Issue date Oct 23, 2012
- Fujitsu Limited
- Yuji Awano
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interconnect structure of an integrated circuit and manufacturing m...
- Patent number 8,026,603
- Issue date Sep 27, 2011
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming multi-chip semiconductor substrates
- Patent number 7,871,857
- Issue date Jan 18, 2011
- Integrated Device Technology, Inc.
- Kuolung Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 7,830,009
- Issue date Nov 9, 2010
- Fujitsu Limited
- Yuji Awano
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Flexible joint methodology to attach a die on an organic substrate
- Patent number 7,554,198
- Issue date Jun 30, 2009
- Intel Corporation
- Kazuo Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holder for electronic component, holding sheet for electronic compo...
- Patent number 7,380,337
- Issue date Jun 3, 2008
- Alps Electric Co., Ltd.
- Kaoru Soeta
- G01 - MEASURING TESTING
Information Patent Grant
Resin substrate
- Patent number 7,291,791
- Issue date Nov 6, 2007
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for testing semiconductor components having interconnect wit...
- Patent number 7,259,578
- Issue date Aug 21, 2007
- Micron Technology, Inc.
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Grant
Substrate for mounting semiconductor chip, mounting structure of se...
- Patent number 7,221,058
- Issue date May 22, 2007
- Denso Corporation
- Atsushi Kashiwazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor test interconnect with variable flexure contacts havi...
- Patent number 7,129,725
- Issue date Oct 31, 2006
- Micron Technology, Inc.
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Grant
Stud bump socket
- Patent number 7,118,389
- Issue date Oct 10, 2006
- Palo Alto Research Center Incorporated
- David K. Fork
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor test interconnect with variable flexure contacts
- Patent number 6,982,564
- Issue date Jan 3, 2006
- Micron Technology, Inc.
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Grant
Method of making an electronic contact
- Patent number 6,938,338
- Issue date Sep 6, 2005
- Tessera, Inc.
- Joseph Fjelstad
- G01 - MEASURING TESTING
Information Patent Grant
Self-adhering chip
- Patent number 6,756,540
- Issue date Jun 29, 2004
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic configuration with flexible bonding pads
- Patent number 6,555,415
- Issue date Apr 29, 2003
- Infineon Technologies AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate
- Patent number 6,518,518
- Issue date Feb 11, 2003
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test method using semiconductor test apparatus
- Patent number 6,518,784
- Issue date Feb 11, 2003
- Fujitsu Limited
- Norio Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor test interconnect with variable flexure contacts
- Patent number 6,498,503
- Issue date Dec 24, 2002
- Micron Technology, Inc.
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor test apparatus and test method using the same
- Patent number 6,333,638
- Issue date Dec 25, 2001
- Fujitsu Limited
- Norio Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor test interconnect with variable flexure contacts
- Patent number 6,310,484
- Issue date Oct 30, 2001
- Micron Technology, Inc.
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Grant
Method of making an electronic contact
- Patent number 6,205,660
- Issue date Mar 27, 2001
- Tessera, Inc.
- Joseph Fjelstad
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 6,198,161
- Issue date Mar 6, 2001
- Kabushiki Kaisha Toshiba
- Yasuhiro Koshio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing boards that can accept a pluggable tab mo...
- Patent number 6,070,785
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Joseph George Ameen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering with resilient contacts
- Patent number 5,980,270
- Issue date Nov 9, 1999
- Tessera, Inc.
- Joseph Fjelstad
- G01 - MEASURING TESTING
Information Patent Grant
Microconnectors
- Patent number 5,956,575
- Issue date Sep 21, 1999
- International Business Machines Corporation
- Claude Louis Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic contacts with asperities and methods of making same
- Patent number 5,934,914
- Issue date Aug 10, 1999
- Tessera, Inc.
- Joseph Fjelstad
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20150133001
- Publication date May 14, 2015
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING ELEMENTS FOR PRODUCING HYBRID ELECTRONIC CIRCUITS
- Publication number 20130267113
- Publication date Oct 10, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Francois MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20130072073
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES
- Publication number 20130015578
- Publication date Jan 17, 2013
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHO...
- Publication number 20120127681
- Publication date May 24, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ji Man RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20110111647
- Publication date May 12, 2011
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20110021016
- Publication date Jan 27, 2011
- FUJITSU LIMITED
- Yuji Awano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20080169563
- Publication date Jul 17, 2008
- FUJITSU LIMITED
- Yuji Awano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible joint methodology to attach a die on an organic substrate
- Publication number 20080001270
- Publication date Jan 3, 2008
- Kazuo Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structure of an integrated circuit and manufacturing m...
- Publication number 20070128845
- Publication date Jun 7, 2007
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic function part mounted body and method of manufacturing t...
- Publication number 20060210237
- Publication date Sep 21, 2006
- Kaoru Soeta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Holder for electronic component, holding sheet for electronic compo...
- Publication number 20060207789
- Publication date Sep 21, 2006
- Alps Electric Co., Ltd.
- Kaoru Soeta
- G01 - MEASURING TESTING
Information Patent Application
System for testing semiconductor components having interconnect wit...
- Publication number 20060181294
- Publication date Aug 17, 2006
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor test interconnect with variable flexure contacts havi...
- Publication number 20060001439
- Publication date Jan 5, 2006
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Application
Stud bump socket
- Publication number 20050282411
- Publication date Dec 22, 2005
- Palto Alto Research Center Incorporated
- David K. Fork
- G01 - MEASURING TESTING
Information Patent Application
Resin substrate
- Publication number 20050186812
- Publication date Aug 25, 2005
- NGK SPARK PLUG CO., LTD.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate for mounting semiconductor chip, mounting structure of se...
- Publication number 20050116354
- Publication date Jun 2, 2005
- DENSO Corporation
- Atsushi Kashiwazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making an electronic contact
- Publication number 20030192181
- Publication date Oct 16, 2003
- Joseph Fjelstad
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Resin substrate
- Publication number 20030089524
- Publication date May 15, 2003
- NGK SPARK PLUG CO., LTD.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor test interconnect with variable flexure contacts
- Publication number 20030090282
- Publication date May 15, 2003
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Application
Self-adhering chip
- Publication number 20030035276
- Publication date Feb 20, 2003
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic configuration with flexible bonding pads
- Publication number 20020094707
- Publication date Jul 18, 2002
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor test apparatus and test method using the same
- Publication number 20020036509
- Publication date Mar 28, 2002
- FUJITSU LIMITED
- Norio Fukasawa
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor test interconnect with variable flexure contacts
- Publication number 20020027441
- Publication date Mar 7, 2002
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Application
Microelectronic contacts with asperities and methods of making same
- Publication number 20020008966
- Publication date Jan 24, 2002
- Joseph Fjelstad
- G01 - MEASURING TESTING

using resilient parts in the bump connector or in the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connecting elements for producing hybrid electronic circuits

Metallurgical clamshell methods for micro land grid array fabrication

Interconnection and assembly of three-dimensional chip packages

Metallurgical clamshell methods for micro land grid array fabrication

Semiconductor package and method of manufacturing the same

Interconnect structure of an integrated circuit and manufacturing m...

Methods of forming multi-chip semiconductor substrates

Semiconductor package and method of manufacturing the same

Flexible joint methodology to attach a die on an organic substrate

Holder for electronic component, holding sheet for electronic compo...

Resin substrate

System for testing semiconductor components having interconnect wit...

Substrate for mounting semiconductor chip, mounting structure of se...

Semiconductor test interconnect with variable flexure contacts havi...

Stud bump socket

Semiconductor test interconnect with variable flexure contacts

Method of making an electronic contact

Self-adhering chip

Electronic configuration with flexible bonding pads

Resin substrate

Test method using semiconductor test apparatus

Semiconductor test interconnect with variable flexure contacts

Semiconductor test apparatus and test method using the same

Semiconductor test interconnect with variable flexure contacts

Method of making an electronic contact

Semiconductor device

Process for manufacturing boards that can accept a pluggable tab mo...

Soldering with resilient contacts

Microconnectors

Microelectronic contacts with asperities and methods of making same

Patents Applicationslast 30 patents

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

CONNECTING ELEMENTS FOR PRODUCING HYBRID ELECTRONIC CIRCUITS

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES

SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHO...

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Flexible joint methodology to attach a die on an organic substrate

Interconnect structure of an integrated circuit and manufacturing m...

Electronic function part mounted body and method of manufacturing t...

Holder for electronic component, holding sheet for electronic compo...

System for testing semiconductor components having interconnect wit...

Semiconductor test interconnect with variable flexure contacts havi...

Stud bump socket

Resin substrate

Substrate for mounting semiconductor chip, mounting structure of se...

Method of making an electronic contact

Resin substrate

Semiconductor test interconnect with variable flexure contacts

Self-adhering chip

Electronic configuration with flexible bonding pads

Semiconductor test apparatus and test method using the same

Semiconductor test interconnect with variable flexure contacts

Microelectronic contacts with asperities and methods of making same