using self-supporting metal foil pattern

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CPC
H05K3/202

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/202using self-supporting metal foil pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tube lamp with leadframe
- Patent number 11,757,081
- Issue date Sep 12, 2023
- LEDVANCE GmbH
- Bernhard Rieder
- F21 - LIGHTING
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal base circuit board and method of manufacturing the metal base...
- Patent number 11,490,513
- Issue date Nov 1, 2022
- NHK Spring Co., Ltd.
- Katsumi Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,419,217
- Issue date Aug 16, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated metal substrate
- Patent number 11,388,823
- Issue date Jul 12, 2022
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer method for manufacturing conductor structures by means of...
- Patent number 11,278,959
- Issue date Mar 22, 2022
- GIESECKE+DEVRIENT MOBILE SECURITY GMBH
- Ando Welling
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Transfer method for manufacturing conductor structures by means of...
- Patent number 11,278,958
- Issue date Mar 22, 2022
- GIESECKE+DEVRIENT MOBILE SECURITY GMBH
- Ando Welling
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,277,925
- Issue date Mar 15, 2022
- Ibiden Co., Ltd.
- Toshihide Makino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tube lamp with leadframe
- Patent number 11,251,349
- Issue date Feb 15, 2022
- LEDVANCE GmbH
- Bernhard Rieder
- F21 - LIGHTING
Information Patent Grant
Insulated metal substrate and manufacturing method thereof
- Patent number 11,083,087
- Issue date Aug 3, 2021
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro power distribution boxes and methods of manufacturing same us...
- Patent number 11,083,088
- Issue date Aug 3, 2021
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multl-phase layered busbar for conducting electric energy wherein t...
- Patent number 11,070,036
- Issue date Jul 20, 2021
- ABB Schweiz AG
- Rudi Velthuis
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board interposer
- Patent number 11,006,524
- Issue date May 11, 2021
- Apple Inc.
- Scott A. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric module, electrical system comprising such an electric modu...
- Patent number 10,912,223
- Issue date Feb 2, 2021
- Valeo Siemens eAutomotive France SAS
- Valery Govindassamy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,905,014
- Issue date Jan 26, 2021
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and semiconductor module
- Patent number 10,818,565
- Issue date Oct 27, 2020
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 10,813,232
- Issue date Oct 20, 2020
- Ibiden Co., Ltd.
- Toshihide Makino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-phase busbar for conducting electric energy and method of man...
- Patent number 10,790,643
- Issue date Sep 29, 2020
- ABB Schweiz AG
- Rudi Velthuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor path structure having a component received in a vibration...
- Patent number 10,779,399
- Issue date Sep 15, 2020
- POSSEHL ELECTRONICS DEUTSCHLAND GMBH
- Dietmar Kurzeja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Circuit board, circuit assembly, and circuit board manufacturing me...
- Patent number 10,772,194
- Issue date Sep 8, 2020
- Autonetworks Technologies, Ltd.
- Tou Chin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having a molded part and method for the produ...
- Patent number 10,736,214
- Issue date Aug 4, 2020
- JUMATECH GMBH
- Markus Wölfel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controller for an electric heating device and method for producing...
- Patent number 10,723,200
- Issue date Jul 28, 2020
- Eberspacher catem GmbH & Co. KG
- Andreas Bilhöfer
- B60 - VEHICLES IN GENERAL
Information Patent Grant
LED module with a stabilized leadframe
- Patent number 10,700,251
- Issue date Jun 30, 2020
- LEDVANCE GmbH
- Heinz Lang
- F21 - LIGHTING
Information Patent Grant
Method for electronics manufacturing using direct write with fabric...
- Patent number 10,681,813
- Issue date Jun 9, 2020
- Raytheon Technologies Corporation
- Wayde R. Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elongated lead frame and a method of manufacturing an elongated lea...
- Patent number 10,665,766
- Issue date May 26, 2020
- SIGNIFY HOLDING B.V.
- Gerard Kums
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,667,407
- Issue date May 26, 2020
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a circuit board by punching
- Patent number 10,651,320
- Issue date May 12, 2020
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230276577
- Publication date Aug 31, 2023
- IBIDEN CO., LTD.
- Yasushi USAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD TH...
- Publication number 20230203691
- Publication date Jun 29, 2023
- Circuit Foil Luxembourg
- Honggi MOON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CERAMIC SUBSTRATE MANUFACTURING METHOD
- Publication number 20220240389
- Publication date Jul 28, 2022
- AMOSENSE CO.,LTD
- Kyung Whan WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20210144861
- Publication date May 13, 2021
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20200352032
- Publication date Nov 5, 2020
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200296841
- Publication date Sep 17, 2020
- IBIDEN CO., LTD.
- Toshihide MAKINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME US...
- Publication number 20200196451
- Publication date Jun 18, 2020
- Molex, LLC
- Victor ZADEREJ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...
- Publication number 20200170105
- Publication date May 28, 2020
- Possehl Electronics Deutschland GmbH
- Dietmar Kurzeja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20200022265
- Publication date Jan 16, 2020
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PHASE BUSBAR FOR CONDUCTING ELECTRIC ENERGY AND METHOD OF MAN...
- Publication number 20190305447
- Publication date Oct 3, 2019
- ABB Schweiz AG
- Rudi Velthuis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING
- Publication number 20190288127
- Publication date Sep 19, 2019
- DSM IP Assets, B.V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, CIRCUIT ASSEMBLY, AND CIRCUIT BOARD MANUFACTURING ME...
- Publication number 20190289711
- Publication date Sep 19, 2019
- AUTONETWORKS TECHNOLOGIES, LTD.
- Tou CHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC COMPONENT CARRIER FOR AUTOMOBILE A...
- Publication number 20190182963
- Publication date Jun 13, 2019
- Kiekert AG
- Andreas Schmitz
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR MODULE
- Publication number 20190172765
- Publication date Jun 6, 2019
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180332720
- Publication date Nov 15, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR ELECTRONICS MANUFACTURING USING D...
- Publication number 20180317322
- Publication date Nov 1, 2018
- United Technologies Corporation
- Wayde R. Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...
- Publication number 20180263112
- Publication date Sep 13, 2018
- Possehl Electronics Deutschland GmbH
- Dietmar Kurzeja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CIRCUIT SUPPORT FOR AN ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTUR...
- Publication number 20180199431
- Publication date Jul 12, 2018
- OSRAM GMBH
- Michael Schoewel
- F21 - LIGHTING
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180042124
- Publication date Feb 8, 2018
- IBIDEN CO., LTD.
- Toshihide MAKINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Foil, Copper-Clad Laminate Board, Method For Producing Print...
- Publication number 20170208680
- Publication date Jul 20, 2017
- JX NIPPON MINING & METALS CORPORATION
- Ryo Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL WITH RELEASABLE CORE
- Publication number 20170202080
- Publication date Jul 13, 2017
- Intel Corporation
- Ching-Ping Janet Shen
- B32 - LAYERED PRODUCTS
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Method For Producing Printe...
- Publication number 20170042025
- Publication date Feb 9, 2017
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING
- Publication number 20170018660
- Publication date Jan 19, 2017
- DSM IP Assets B. V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Laminate Producing Method,...
- Publication number 20170019991
- Publication date Jan 19, 2017
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASTIC MOLDING COMPOUND AND USE THEREOF
- Publication number 20160295705
- Publication date Oct 6, 2016
- EMS-Patent AG
- Georg STOEPPELMANN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing Portable Data Carriers
- Publication number 20160120036
- Publication date Apr 28, 2016
- Giesecke & Devrient GmbH
- Thomas TARANTINO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LED 3D CURVED LEAD FRAME OF ILLUMINATION DEVICE
- Publication number 20160069544
- Publication date Mar 10, 2016
- LONGWIDE TECHNOLOGY INC.
- Huan-Jan CHIEN
- F21 - LIGHTING
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160044780
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER METHOD FOR MANUFACTURING CONDUCTOR STRUCTURES BY MEANS OF...
- Publication number 20150245496
- Publication date Aug 27, 2015
- Giesecke & Devrient GmbH
- Ando WELLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Embedding at Least One Component in a Printed Circuit Board
- Publication number 20150189763
- Publication date Jul 2, 2015
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wolfgang Schrittwieser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using self-supporting metal foil pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic substrate manufacturing method

Manufacturing method of insulated metal substrate

Tube lamp with leadframe

Application specific electronics packaging systems, methods and dev...

Metal base circuit board and method of manufacturing the metal base...

Substrate structures and methods of manufacture

Insulated metal substrate

Transfer method for manufacturing conductor structures by means of...

Transfer method for manufacturing conductor structures by means of...

Wiring board and method for manufacturing the same

Tube lamp with leadframe

Insulated metal substrate and manufacturing method thereof

Micro power distribution boxes and methods of manufacturing same us...

Multl-phase layered busbar for conducting electric energy wherein t...

Circuit board interposer

High-speed interconnects for printed circuit boards

Electric module, electrical system comprising such an electric modu...

Application specific electronics packaging systems, methods and dev...

Circuit board and semiconductor module

Wiring board and method for manufacturing the same

Multi-phase busbar for conducting electric energy and method of man...

Conductor path structure having a component received in a vibration...

Circuit board, circuit assembly, and circuit board manufacturing me...

Printed circuit board having a molded part and method for the produ...

Controller for an electric heating device and method for producing...

LED module with a stabilized leadframe

Method for electronics manufacturing using direct write with fabric...

Elongated lead frame and a method of manufacturing an elongated lea...

Application specific electronics packaging systems, methods and dev...

Method of manufacturing a circuit board by punching

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING WIRING SUBSTRATE

DOUBLE LAYERED ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD TH...

CERAMIC SUBSTRATE MANUFACTURING METHOD

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME US...

CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

MULTI-PHASE BUSBAR FOR CONDUCTING ELECTRIC ENERGY AND METHOD OF MAN...

METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING

CIRCUIT BOARD, CIRCUIT ASSEMBLY, AND CIRCUIT BOARD MANUFACTURING ME...

METHOD FOR PRODUCING AN ELECTRIC COMPONENT CARRIER FOR AUTOMOBILE A...

CIRCUIT BOARD AND SEMICONDUCTOR MODULE

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

APPARATUS, SYSTEM, AND METHOD FOR ELECTRONICS MANUFACTURING USING D...

CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...

CIRCUIT SUPPORT FOR AN ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTUR...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Copper Foil, Copper-Clad Laminate Board, Method For Producing Print...

PANEL WITH RELEASABLE CORE

Carrier-Attached Copper Foil, Laminate, Method For Producing Printe...

METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING

Carrier-Attached Copper Foil, Laminate, Laminate Producing Method,...

PLASTIC MOLDING COMPOUND AND USE THEREOF

Method for Producing Portable Data Carriers

LED 3D CURVED LEAD FRAME OF ILLUMINATION DEVICE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

TRANSFER METHOD FOR MANUFACTURING CONDUCTOR STRUCTURES BY MEANS OF...

Method for Embedding at Least One Component in a Printed Circuit Board