using silicon etch back techniques

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CPC
H01L21/76256

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76256using silicon etch back techniques

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,923,237
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device over photodetector pixel sensor
- Patent number 11,901,388
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power rails for stacked semiconductor device
- Patent number 11,854,910
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chansyun David Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching process for SiGe and doped epitaxial silicon
- Patent number 11,854,865
- Issue date Dec 26, 2023
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 11,830,764
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction for semiconductor devices based on wafer bonding
- Patent number 11,798,838
- Issue date Oct 24, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming SOI substrates
- Patent number 11,764,054
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator wafer having a composite insulator layer
- Patent number 11,676,969
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with low defect count and method for manufactur...
- Patent number 11,610,808
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,605,648
- Issue date Mar 14, 2023
- UNITED MICROELECTRONICS CORP.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrate, semiconductor device, and display device
- Patent number 11,554,983
- Issue date Jan 17, 2023
- AGC Inc.
- Shuhei Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for transferring a layer
- Patent number 11,501,997
- Issue date Nov 15, 2022
- Soitec
- Djamel Belhachemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 11,495,489
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator wafer and low temperature method to make thereof
- Patent number 11,456,204
- Issue date Sep 27, 2022
- Alexander Yuri Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power rails for stacked semiconductor device
- Patent number 11,335,606
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chansyun David Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cointegration of gallium nitride and silicon
- Patent number 11,322,390
- Issue date May 3, 2022
- Imec VZW
- Amey Mahadev Walke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing semiconductor device
- Patent number 11,270,907
- Issue date Mar 8, 2022
- Sumitomo Electric Industries, Ltd.
- Takehiko Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor diodes employing back-side semiconductor or metal
- Patent number 11,264,405
- Issue date Mar 1, 2022
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator (SOI) substrate having dielectric struct...
- Patent number 11,232,975
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing transistors implemented at low temperature
- Patent number 11,227,800
- Issue date Jan 18, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for a transducer in an EWLB package
- Patent number 11,211,298
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Stephan Pindl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate
- Patent number 11,158,534
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resistivity silicon-on-insulator structure and method of manuf...
- Patent number 11,145,538
- Issue date Oct 12, 2021
- GlobalWafers Co., Ltd.
- Jeffery L. Libbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing composite wafer
- Patent number 11,128,277
- Issue date Sep 21, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shoji Akiyama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device structure having carrier-trapping layers with...
- Patent number 11,063,117
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device over photodetector pixel sensor
- Patent number 11,063,081
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity formation within and under semiconductor devices
- Patent number 11,056,382
- Issue date Jul 6, 2021
- GLOBALFOUNDRIES U.S. INC.
- Siva P. Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor structure comprising a sem...
- Patent number 11,049,797
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator wafer having a composite insulator layer
- Patent number 10,950,631
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and methods for the transfer of chips from a source substrat...
- Patent number 10,923,460
- Issue date Feb 16, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Stéphane Caplet
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE ETCHING PROCESS FOR SiGe AND DOPED EPITAXIAL SILICON
- Publication number 20240038582
- Publication date Feb 1, 2024
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Rails For Stacked Semiconductor Device
- Publication number 20230395437
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chansyun David YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230377946
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
- Publication number 20230377948
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SOI SUBSTRATES
- Publication number 20230369038
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR WAFER HAVING A COMPOSITE INSULATOR LAYER
- Publication number 20230275097
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230207380
- Publication date Jun 29, 2023
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230154926
- Publication date May 18, 2023
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF SURFACE TREATMENT OF SOI WAFER
- Publication number 20230133916
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230126794
- Publication date Apr 27, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chih-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Silicon Epitaxy of a FDSOI Device
- Publication number 20230130629
- Publication date Apr 27, 2023
- Shanghai Huali Integrated Circuit Corporation
- Lian Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE
- Publication number 20230079562
- Publication date Mar 16, 2023
- AGC Inc.
- Shuhei NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230065473
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SOI OR SIGEOI TYPE SEMICONDUCTOR-ON-INSU...
- Publication number 20230025306
- Publication date Jan 26, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Shay Reboh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220415926
- Publication date Dec 29, 2022
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
- Publication number 20220359273
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR WAFER AND LOW TEMPERATURE METHOD TO MAKE THEREOF
- Publication number 20220319911
- Publication date Oct 6, 2022
- Alexander Yuri Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SILICON ON INSULATOR WAFER
- Publication number 20220319912
- Publication date Oct 6, 2022
- Alexander Yuri Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING PROCESS FOR SiGe AND DOPED EPITAXIAL SILICON
- Publication number 20220285205
- Publication date Sep 8, 2022
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RAILS FOR STACKED SEMICONDUCTOR DEVICE
- Publication number 20220270935
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chansyun David YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RAILS FOR STACKED SEMICONDUCTOR DEVICE
- Publication number 20220059414
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chansyun David YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE OVER PHOTODETECTOR PIXEL SENSOR
- Publication number 20210320139
- Publication date Oct 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210305131
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR WAFER HAVING A COMPOSITE INSULATOR LAYER
- Publication number 20210193684
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER TRANSFER METHOD
- Publication number 20210166968
- Publication date Jun 3, 2021
- SOITEC
- Djamel Belhachemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR WAFER HAVING A COMPOSITE INSULATOR LAYER
- Publication number 20210091118
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SOI SUBSTRATES
- Publication number 20210090876
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20210066117
- Publication date Mar 4, 2021
- Sumitomo Electric Industries, Ltd.
- Takehiko KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20210057270
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING TRANSISTORS IMPLEMENTED AT LOW TEMPERATURE
- Publication number 20200395249
- Publication date Dec 17, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean-Pierre COLINGE
- H01 - BASIC ELECTRIC ELEMENTS

using silicon etch back techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor device

Device over photodetector pixel sensor

Power rails for stacked semiconductor device

Selective etching process for SiGe and doped epitaxial silicon

Method for forming a semiconductor-on-insulator (SOI) substrate

Capacitance reduction for semiconductor devices based on wafer bonding

Methods of forming SOI substrates

Semiconductor-on-insulator wafer having a composite insulator layer

Semiconductor wafer with low defect count and method for manufactur...

Semiconductor structure and manufacturing method thereof

Glass substrate, semiconductor device, and display device

Process for transferring a layer

Method for forming a semiconductor-on-insulator (SOI) substrate

Silicon-on-insulator wafer and low temperature method to make thereof

Power rails for stacked semiconductor device

Cointegration of gallium nitride and silicon

Semiconductor device and method for producing semiconductor device

Semiconductor diodes employing back-side semiconductor or metal

Semiconductor-on-insulator (SOI) substrate having dielectric struct...

Method for producing transistors implemented at low temperature

System and method for a transducer in an EWLB package

SOI substrate

High resistivity silicon-on-insulator structure and method of manuf...

Method for producing composite wafer

Semiconductor device structure having carrier-trapping layers with...

Device over photodetector pixel sensor

Cavity formation within and under semiconductor devices

Method for manufacturing a semiconductor structure comprising a sem...

Semiconductor-on-insulator wafer having a composite insulator layer

Device and methods for the transfer of chips from a source substrat...

Patents Applicationslast 30 patents

SELECTIVE ETCHING PROCESS FOR SiGe AND DOPED EPITAXIAL SILICON

Power Rails For Stacked Semiconductor Device

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE

METHODS OF FORMING SOI SUBSTRATES

SEMICONDUCTOR-ON-INSULATOR WAFER HAVING A COMPOSITE INSULATOR LAYER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

PROCESS OF SURFACE TREATMENT OF SOI WAFER

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

Method for Making Silicon Epitaxy of a FDSOI Device

GLASS SUBSTRATE, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A SOI OR SIGEOI TYPE SEMICONDUCTOR-ON-INSU...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE

SILICON-ON-INSULATOR WAFER AND LOW TEMPERATURE METHOD TO MAKE THEREOF

METHOD OF MAKING A SILICON ON INSULATOR WAFER

SELECTIVE ETCHING PROCESS FOR SiGe AND DOPED EPITAXIAL SILICON

POWER RAILS FOR STACKED SEMICONDUCTOR DEVICE

POWER RAILS FOR STACKED SEMICONDUCTOR DEVICE

DEVICE OVER PHOTODETECTOR PIXEL SENSOR

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR-ON-INSULATOR WAFER HAVING A COMPOSITE INSULATOR LAYER

LAYER TRANSFER METHOD

SEMICONDUCTOR-ON-INSULATOR WAFER HAVING A COMPOSITE INSULATOR LAYER

METHODS OF FORMING SOI SUBSTRATES

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING THEREOF

METHOD FOR PRODUCING TRANSISTORS IMPLEMENTED AT LOW TEMPERATURE