Using specific substances

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CPC
H05K2203/12

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/12Using specific substances

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed wiring board and resin sheet with...
- Patent number 12,120,827
- Issue date Oct 15, 2024
- Ajinomoto Co., Inc.
- Kazuhiko Tsurui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for increasing adhesion strength between a metal and an orga...
- Patent number 11,991,835
- Issue date May 21, 2024
- Atotech Deutschland GmbH
- Felix Tang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for increasing adhesion strength between a surface of copper...
- Patent number 11,963,308
- Issue date Apr 16, 2024
- Atotech Deutschland GmbH & Co. KG
- Norbert Lützow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal drop ejecting three-dimensional (3D) object printer
- Patent number 11,737,216
- Issue date Aug 22, 2023
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Azole silane compound
- Patent number 11,603,378
- Issue date Mar 14, 2023
- Atotech Deutschland GmbH
- Fabian Michalik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabrication of a soft-matter printed circuit board
- Patent number 11,523,514
- Issue date Dec 6, 2022
- Carnegie Mellon University
- Carmel Majidi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal fusion with conductive inks and pastes
- Patent number 11,395,413
- Issue date Jul 19, 2022
- Carnegie Mellon University
- Mahmoud Tavakoli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Silver-organo-complex ink with high conductivity and inkjet stability
- Patent number 11,390,768
- Issue date Jul 19, 2022
- King Abdullah University of Science and Technology
- Mohammad Vaseem
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermally conductive flexible adhesive for aerospace applications
- Patent number 11,292,943
- Issue date Apr 5, 2022
- The Boeing Company
- Peter Babilo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Methods and mechanisms for maintaining an electro-active polymer in...
- Patent number 11,291,121
- Issue date Mar 29, 2022
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
LIFT printing of conductive traces onto a semiconductor substrate
- Patent number 11,271,119
- Issue date Mar 8, 2022
- Orbotech Ltd.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for making wiring board
- Patent number 11,140,783
- Issue date Oct 5, 2021
- Toyota Jidosha Kabushiki Kaisha
- Takeshi Zaigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating metal foil with N-heterocyclic carbene compounds containing...
- Patent number 11,102,892
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Dylan J. Boday
- B32 - LAYERED PRODUCTS
Information Patent Grant
Anisotropic etching using highly branched polymers
- Patent number 11,071,210
- Issue date Jul 20, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jolanta Klocek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct printing and writing using undercooled metallic core-shell p...
- Patent number 11,059,098
- Issue date Jul 13, 2021
- SAFI-Tech, Inc.
- Martin M. Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper or copper alloy article comprising surface-modified polyeste...
- Patent number 11,053,593
- Issue date Jul 6, 2021
- ADVANCED TECHNOLOGIES, INC.
- Kinji Hirai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Articles having silver ion α-oxy carboxylate oxime complexes
- Patent number 11,037,692
- Issue date Jun 15, 2021
- Eastman Kodak Company
- Deepak Shukla
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Manufacturing method for flexible printed circuit board
- Patent number 11,039,539
- Issue date Jun 15, 2021
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Juan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser sintering methods and devices in FPC fabrication
- Patent number 11,026,333
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel flexible printed circuit fabrication methods and devices
- Patent number 11,026,332
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material and process
- Patent number 10,999,933
- Issue date May 4, 2021
- Henkel IP & Holding GmbH
- Bin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for laser welding layers of circuitry pattern in the reel-t...
- Patent number 10,993,334
- Issue date Apr 27, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit boards
- Patent number 10,973,131
- Issue date Apr 6, 2021
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating for the mitigation of metal whiskers
- Patent number 10,913,869
- Issue date Feb 9, 2021
- Raytheon Company
- David R. Smith
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed circuit surface finish, method of use, and assemblies made...
- Patent number 10,902,967
- Issue date Jan 26, 2021
- Kunal Shah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
- Publication number 20240268037
- Publication date Aug 8, 2024
- Takaroa Corporation, Inc.
- Ethan M. Devine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL
- Publication number 20240196540
- Publication date Jun 13, 2024
- SAMTEC, INC.
- Christopher David BOHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20240057255
- Publication date Feb 15, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE TRACES
- Publication number 20240008187
- Publication date Jan 4, 2024
- Hewlett-Packard Development Company, L.P.
- Elizabeth Ann GALATI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) O...
- Publication number 20230309241
- Publication date Sep 28, 2023
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE COPPER COMPONENTS
- Publication number 20230142375
- Publication date May 11, 2023
- Namics Corporation
- Naoki OBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED MINIATURE WELDING PLATE STRUCTURE AND MANUFACTURING PROC...
- Publication number 20220408566
- Publication date Dec 22, 2022
- SCIVITA MEDICAL TECHNOLOGY CO., LTD.
- Yi ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES
- Publication number 20220346238
- Publication date Oct 27, 2022
- Carnegie Mellon University
- Mahmoud TAVAKOLI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD AND SYSTEM FOR OPERATING A METAL DROP EJECTING THREE-DIMENSI...
- Publication number 20220240387
- Publication date Jul 28, 2022
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SU...
- Publication number 20220220272
- Publication date Jul 14, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki KITAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A METAL AND AN ORGA...
- Publication number 20220151080
- Publication date May 12, 2022
- Atotech Deutschland GmbH
- Felix TANG
- B32 - LAYERED PRODUCTS
Information Patent Application
IMPLANTABLE MEDICAL DEVICE WITH RELATIVE MOTION CONTROL
- Publication number 20220047876
- Publication date Feb 17, 2022
- Cardiac Pacemakers, Inc.
- JOEL BECKLUND
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20220033317
- Publication date Feb 3, 2022
- DOWA METALTECH CO, LTD.
- Koji Kobayashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER OR COPPER ALLOY ARTICLE COMPRISING SURFACE-MODIFIED POLYESTE...
- Publication number 20210285108
- Publication date Sep 16, 2021
- ADVANCED TECHNOLOGIES, INC.
- Kinji HIRAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
AZOLE SILANE COMPOUND
- Publication number 20210277034
- Publication date Sep 9, 2021
- Atotech Deutschland GmbH
- Fabian MICHALIK
- C07 - ORGANIC CHEMISTRY
Information Patent Application
A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPP...
- Publication number 20210251085
- Publication date Aug 12, 2021
- Atotech Deutschland GmbH
- Norbert LÜTZOW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING FOR THE MITIGATION OF METAL WHISKERS
- Publication number 20210095139
- Publication date Apr 1, 2021
- Raytheon Company
- David R. Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication
- Publication number 20210092854
- Publication date Mar 25, 2021
- Manaflex, LLC
- Robert Clinton Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND RESIN SHEET WITH...
- Publication number 20210014974
- Publication date Jan 14, 2021
- AJINOMOTO CO., INC.
- Kazuhiko TSURUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES
- Publication number 20200221580
- Publication date Jul 9, 2020
- Carnegie Mellon University
- Mahmoud TAVAKOLI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SILVER-ORGANO-COMPLEX INK WITH HIGH CONDUCTIVITY AND INKJET STABILITY
- Publication number 20200181438
- Publication date Jun 11, 2020
- King Abdullah University of Science and Technology
- Mohammad VASEEM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND MATERIAL TO CREATE PRINTED CIRCUIT BOARDS
- Publication number 20200015362
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Joseph KUCZYNSKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PASSIVATION LAYER ON A SUBSTRATE
- Publication number 20190338414
- Publication date Nov 7, 2019
- SPTS TECHNOLOGIES LIMITED
- MICHAEL GRIMES
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS
- Publication number 20190264073
- Publication date Aug 29, 2019
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ARTICLES HAVING SILVER ION a-OXY CARBOXYLATE OXIME COMPLEXES
- Publication number 20190228873
- Publication date Jul 25, 2019
- Eastman Kodak Company
- Deepak Shukla
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MINIATURIZED CIRCUIT AND METHOD OF MAKING THE SAME
- Publication number 20190174631
- Publication date Jun 6, 2019
- SIWARD Crystal Technology Co., Ltd.
- Yen-Hao TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATION OF DOWNHOLE MICROELECTRONICS
- Publication number 20190132959
- Publication date May 2, 2019
- BAKER HUGHES, A GE COMPANY, LLC
- Aleksey Reiderman
- E21 - EARTH DRILLING MINING
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20190090358
- Publication date Mar 21, 2019
- Semblant Limited
- Gianfranco Aresta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIFT printing of conductive traces onto a semiconductor substrate
- Publication number 20190088804
- Publication date Mar 21, 2019
- ORBOTECH LTD.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Using specific substances

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing printed wiring board and resin sheet with...

Method for increasing adhesion strength between a metal and an orga...

Method for increasing adhesion strength between a surface of copper...

Metal drop ejecting three-dimensional (3D) object printer

Azole silane compound

Method for fabrication of a soft-matter printed circuit board

Reel-to-reel lamination methods and devices in FPC fabrication

Reel-to-reel laser ablation methods and devices in FPC fabrication

Liquid metal fusion with conductive inks and pastes

Silver-organo-complex ink with high conductivity and inkjet stability

Thermally conductive flexible adhesive for aerospace applications

Methods and mechanisms for maintaining an electro-active polymer in...

LIFT printing of conductive traces onto a semiconductor substrate

Modulated inductance module

Method for producing a printed circuit board structure

Apparatus for making wiring board

Coating metal foil with N-heterocyclic carbene compounds containing...

Anisotropic etching using highly branched polymers

Direct printing and writing using undercooled metallic core-shell p...

Copper or copper alloy article comprising surface-modified polyeste...

Method for producing an electric circuit comprising a circuit carri...

Articles having silver ion α-oxy carboxylate oxime complexes

Manufacturing method for flexible printed circuit board

Reel-to-reel laser sintering methods and devices in FPC fabrication

Reel-to-reel flexible printed circuit fabrication methods and devices

Conductive material and process

Methods for laser welding layers of circuitry pattern in the reel-t...

Method of manufacturing printed circuit boards

Coating for the mitigation of metal whiskers

Printed circuit surface finish, method of use, and assemblies made...

Patents Applicationslast 30 patents

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...

HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY

CONDUCTIVE TRACES

METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) O...

COMPOSITE COPPER COMPONENTS

INTEGRATED MINIATURE WELDING PLATE STRUCTURE AND MANUFACTURING PROC...

LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES

METHOD AND SYSTEM FOR OPERATING A METAL DROP EJECTING THREE-DIMENSI...

COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SU...

METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A METAL AND AN ORGA...

IMPLANTABLE MEDICAL DEVICE WITH RELATIVE MOTION CONTROL

ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

COPPER OR COPPER ALLOY ARTICLE COMPRISING SURFACE-MODIFIED POLYESTE...

AZOLE SILANE COMPOUND

A METHOD FOR INCREASING ADHESION STRENGTH BETWEEN A SURFACE OF COPP...

COATING FOR THE MITIGATION OF METAL WHISKERS

Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND RESIN SHEET WITH...

LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES

SILVER-ORGANO-COMPLEX INK WITH HIGH CONDUCTIVITY AND INKJET STABILITY

METHOD AND MATERIAL TO CREATE PRINTED CIRCUIT BOARDS

METHOD FOR PRODUCING AN ELECTRIC CIRCUIT

METHOD OF FORMING A PASSIVATION LAYER ON A SUBSTRATE

THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS

ARTICLES HAVING SILVER ION a-OXY CARBOXYLATE OXIME COMPLEXES

MINIATURIZED CIRCUIT AND METHOD OF MAKING THE SAME

ENCAPSULATION OF DOWNHOLE MICROELECTRONICS

COATED ELECTRICAL ASSEMBLY

LIFT printing of conductive traces onto a semiconductor substrate