using tape automated bonding [TAB]

Industry

CPC
H01L24/86

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/86using tape automated bonding [TAB]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 11,901,309
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask-integrated surface protective tape with release liner
- Patent number 11,282,736
- Issue date Mar 22, 2022
- Furukawa Electric Co., Ltd.
- Yukihiro Matsubara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Apparatus and method for transferring semiconductor devices from a...
- Patent number 11,183,478
- Issue date Nov 23, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup apparatus, endoscope, and method for manufacturing ima...
- Patent number 11,134,829
- Issue date Oct 5, 2021
- Olympus Corporation
- Takuro Suyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-like adhesive and method for producing semiconductor package u...
- Patent number 11,139,261
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed, high-resolution electrophysiology in-vivo using conform...
- Patent number 10,918,298
- Issue date Feb 16, 2021
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Multi-stacked die package with flexible interconnect
- Patent number 10,892,248
- Issue date Jan 12, 2021
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
- Patent number 10,643,942
- Issue date May 5, 2020
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystal panel, method for fabricating thereof and display ap...
- Patent number 10,606,135
- Issue date Mar 31, 2020
- HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yung-jui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for transfering semiconductor devices from a s...
- Patent number 10,529,685
- Issue date Jan 7, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of ultrathin functional block by solid ph...
- Patent number 10,522,510
- Issue date Dec 31, 2019
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 10,483,209
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
- Patent number 10,468,342
- Issue date Nov 5, 2019
- Compass Technology Company, Ltd.
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Display device comprising remaining portion of inspection line with...
- Patent number 10,455,693
- Issue date Oct 22, 2019
- Samsung Display Co., Ltd.
- Myong soo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked ultrasound vibration device and ultrasound medical apparatus
- Patent number 10,322,437
- Issue date Jun 18, 2019
- Olympus Corporation
- Hiroshi Ito
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Discrete flexible interconnects for modules of integrated circuits
- Patent number 10,297,572
- Issue date May 21, 2019
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency (RF) devices
- Patent number 10,147,698
- Issue date Dec 4, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape for electronic devices with reinforced lead crack
- Patent number 10,020,248
- Issue date Jul 10, 2018
- LG Innotek Co., Ltd
- Dae Sung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a switching device with a moisture-tight and e...
- Patent number 9,883,596
- Issue date Jan 30, 2018
- Semikron Elektronik GmbH & Co., KG
- Christian Göbl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,842,832
- Issue date Dec 12, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with chip for the high-frequency range
- Patent number 9,669,480
- Issue date Jun 6, 2017
- Rohde & Schwarz GmbH & Co. KG
- Daniel Hageneder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided chip on film packaging structure and manufacturing met...
- Patent number 9,589,883
- Issue date Mar 7, 2017
- Raydium Semiconductor Corporation
- Ching-Yung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for transferring a chip to a contact substrate
- Patent number 9,401,298
- Issue date Jul 26, 2016
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,397,071
- Issue date Jul 19, 2016
- Intel Corporation
- Omkar G. Karhade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTAC...
- Publication number 20240250042
- Publication date Jul 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230133340
- Publication date May 4, 2023
- SAMSUNG DISPLAY CO., LTD.
- Myong Soo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MAN...
- Publication number 20220319963
- Publication date Oct 6, 2022
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE
- Publication number 20210143107
- Publication date May 13, 2021
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING DEVICE
- Publication number 20200411466
- Publication date Dec 31, 2020
- Sakai Display Products Corporation
- YOHICHIROH SAKAKI
- G02 - OPTICS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20200144221
- Publication date May 7, 2020
- SAMSUNG DISPLAY CO., LTD.
- Myong Soo OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20200135688
- Publication date Apr 30, 2020
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK-INTEGRATED SURFACE PROTECTIVE TAPE WITH RELEASE LINER
- Publication number 20200017728
- Publication date Jan 16, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Yukihiro MATSUBARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Formation of Fine Pitch Traces Using Ultra-Thin PAA Modified Fully...
- Publication number 20200013700
- Publication date Jan 9, 2020
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Formation of Fine Pitch Traces Using Ultra-Thin PAA Modified Fully...
- Publication number 20190244882
- Publication date Aug 8, 2019
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMAGE PICKUP APPARATUS, ENDOSCOPE, AND METHOD FOR MANUFACTURING IMA...
- Publication number 20180368661
- Publication date Dec 27, 2018
- OLYMPUS CORPORATION
- Takuro SUYAMA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20180226376
- Publication date Aug 9, 2018
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20180151536
- Publication date May 31, 2018
- LG Display Co., Ltd.
- Jihun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PH...
- Publication number 20180151541
- Publication date May 31, 2018
- Intel Corporation
- Kimin JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20160300824
- Publication date Oct 13, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING MAGNETIC SHIEL...
- Publication number 20150243607
- Publication date Aug 27, 2015
- Jae-Gwon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
- Publication number 20150187731
- Publication date Jul 2, 2015
- QUALCOMM Incorporated
- Dong Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with chip for the high-frequency range
- Publication number 20150181712
- Publication date Jun 25, 2015
- ROHDE & SCHWARZ GMBH & CO. KG
- Daniel Hageneder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM TRANSFERABLE LOGIC CIRCUIT, AND METHODS FOR PROVIDING FILM TRA...
- Publication number 20140264462
- Publication date Sep 18, 2014
- Illinois Tool Works, Inc.
- JOHN H. SCHNEIDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME
- Publication number 20140138820
- Publication date May 22, 2014
- Hiroshi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING NO CHIP PAD
- Publication number 20130316496
- Publication date Nov 28, 2013
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Jong Myoung Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
- Publication number 20130187259
- Publication date Jul 25, 2013
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP CONTROLLER AT BOTTOM OF D...
- Publication number 20130157413
- Publication date Jun 20, 2013
- SANDISK TECHNOLOGIES INC.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE IN DIE BGA PACKAGE
- Publication number 20130154117
- Publication date Jun 20, 2013
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS WITH DIFFERENT T...
- Publication number 20120302007
- Publication date Nov 29, 2012
- Elpida Memory, Inc.
- Mitsuaki KATAGIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD LAYOUT STRUCTURE OF SEMICONDUCTOR CHIP
- Publication number 20120292776
- Publication date Nov 22, 2012
- SILICON WORKS CO., LTD.
- Dae-Keun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES
- Publication number 20120264257
- Publication date Oct 18, 2012
- Kuo-Yuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER
- Publication number 20120241959
- Publication date Sep 27, 2012
- Huawei Technologies Co., Ltd
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS

using tape automated bonding [TAB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor device package assemblies with direct leadframe attac...

Chip packaging device, chip packaging method, and package chip

Impedance controlled electrical interconnection employing meta-mate...

Mask-integrated surface protective tape with release liner

Apparatus and method for transferring semiconductor devices from a...

Image pickup apparatus, endoscope, and method for manufacturing ima...

Film-like adhesive and method for producing semiconductor package u...

High-speed, high-resolution electrophysiology in-vivo using conform...

Multi-stacked die package with flexible interconnect

Power electronics assembly having an adhesion layer, and method for...

Formation of fine pitch traces using ultra-thin PAA modified fully...

Apparatus for the material-bonded connection of connection partners...

Liquid crystal panel, method for fabricating thereof and display ap...

Apparatus and method for transfering semiconductor devices from a s...

Heterogeneous integration of ultrathin functional block by solid ph...

Impedance controlled electrical interconnection employing meta-mate...

Formation of fine pitch traces using ultra-thin PAA modified fully...

Display device comprising remaining portion of inspection line with...

Stacked ultrasound vibration device and ultrasound medical apparatus

Discrete flexible interconnects for modules of integrated circuits

Radio frequency (RF) devices

Semiconductor arrangement, semiconductor system and method of formi...

Tape for electronic devices with reinforced lead crack

Method for producing a switching device with a moisture-tight and e...

High density interconnection of microelectronic devices

Semiconductor component with chip for the high-frequency range

Double-sided chip on film packaging structure and manufacturing met...

Method and device for transferring a chip to a contact substrate

High density interconnection of microelectronic devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTAC...

BONDING APPARATUS AND BONDING METHOD

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MAN...

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE

THERMOCOMPRESSION BONDING DEVICE

BONDING APPARATUS AND BONDING METHOD

APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

MASK-INTEGRATED SURFACE PROTECTIVE TAPE WITH RELEASE LINER

Formation of Fine Pitch Traces Using Ultra-Thin PAA Modified Fully...

Formation of Fine Pitch Traces Using Ultra-Thin PAA Modified Fully...

IMAGE PICKUP APPARATUS, ENDOSCOPE, AND METHOD FOR MANUFACTURING IMA...

APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES

CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME

HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PH...

HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING MAGNETIC SHIEL...

LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY

Semiconductor component with chip for the high-frequency range

FILM TRANSFERABLE LOGIC CIRCUIT, AND METHODS FOR PROVIDING FILM TRA...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING NO CHIP PAD

Electronic Device and a Method for Fabricating an Electronic Device

SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP CONTROLLER AT BOTTOM OF D...

STACKED DIE IN DIE BGA PACKAGE

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS WITH DIFFERENT T...

PAD LAYOUT STRUCTURE OF SEMICONDUCTOR CHIP

MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES

MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER