using temporarily an auxiliary support

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CPC
H01L21/6835

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6835using temporarily an auxiliary support

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device, transfer system, and end effector
- Patent number 12,191,188
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Norihiko Amikura
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor device with tiered pillar and manufacturing method th...
- Patent number 12,183,594
- Issue date Dec 31, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,690
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, method for manufacturing semiconductor sub...
- Patent number 12,183,636
- Issue date Dec 31, 2024
- FILNEX INC.
- Mitsuhiko Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna
- Patent number 12,183,694
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,176,256
- Issue date Dec 24, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,176,258
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 12,176,283
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly board for use in a display manufacturing method
- Patent number 12,176,225
- Issue date Dec 24, 2024
- LG Electronics Inc.
- Changhyun Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure and clamp...
- Patent number 12,176,240
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Yun Di Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,176,301
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 12,176,384
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method using tape attachment
- Patent number 12,176,335
- Issue date Dec 24, 2024
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 12,176,261
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer
- Patent number 12,170,249
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
- Patent number 12,170,263
- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,170,251
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,166,025
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 12,165,900
- Issue date Dec 10, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,167,665
- Issue date Dec 10, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method
- Patent number 12,165,985
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resistor layer, and method of manufacturing sem...
- Patent number 12,164,232
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES
- Publication number 20250015045
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER DEVICE AND TRANSFER METHOD
- Publication number 20250014936
- Publication date Jan 9, 2025
- TORAY ENGINEERING CO., LTD.
- Koichi KAZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20250015003
- Publication date Jan 9, 2025
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...
- Publication number 20250015053
- Publication date Jan 9, 2025
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING APPARATUS, SEPARATING SYSTEM AND SEPARATING METHOD
- Publication number 20250014917
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Naoto Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND M...
- Publication number 20250015096
- Publication date Jan 9, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jangyeol YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR BONDING DIES
- Publication number 20250006689
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250006525
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Takeshi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WET TRANSFER METHOD AND EQUIPMENT USING MAGNETIC FORCE
- Publication number 20250006542
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Youngtek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY
- Publication number 20250006543
- Publication date Jan 2, 2025
- ams-OSRAM International GmbH
- Daniel Leisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006686
- Publication date Jan 2, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Hun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD
- Publication number 20240429073
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240420988
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT METHOD, PEELING METHOD, AND PEELING STRENGTH MEASURING...
- Publication number 20240421006
- Publication date Dec 19, 2024
- Yamaha Robotics Holdings Co., Ltd.
- HIROSHI KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for the Pulsed Laser Ejection of Multiple Epitaxial Structu...
- Publication number 20240421001
- Publication date Dec 19, 2024
- Benjamin Reeves
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Donor and Transfer Method of Light Emitting Diode Using the Same
- Publication number 20240420987
- Publication date Dec 19, 2024
- LG Display Co., Ltd.
- Suhun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413121
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHIH-TING LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...
- Publication number 20240413129
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Wonsik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240412982
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240413028
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BODY AND PREPARATION METHOD THEREFOR
- Publication number 20240404938
- Publication date Dec 5, 2024
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...
- Publication number 20240404859
- Publication date Dec 5, 2024
- Nikon Corporation
- Mikio USHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTOR SUBSTRATE, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TR...
- Publication number 20240404865
- Publication date Dec 5, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi Yamaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...
- Publication number 20240404898
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20240404965
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hsuan YEN
- H01 - BASIC ELECTRIC ELEMENTS

using temporarily an auxiliary support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure

Transfer device, transfer system, and end effector

Semiconductor device with tiered pillar and manufacturing method th...

Semiconductor package

Semiconductor substrate, method for manufacturing semiconductor sub...

Semiconductor package including antenna

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor package and method manufacturing the same

Die package and method of forming a die package

Assembly board for use in a display manufacturing method

Method for manufacturing semiconductor package structure and clamp...

Package structure and method for forming the same

Methods of parallel transfer of micro-devices using treatment

Semiconductor device and method using tape attachment

Method of fabricating package structure

Semiconductor package including interposer

Fabricating active-bridge-coupled GPU chiplets

Semiconductor packages and methods of forming same

Semiconductor package

Integrated circuit packages and methods of forming the same

Package structure and method of manufacturing the same

Semiconductor devices and methods of manufacturing

Method of mechanical separation for a double layer transfer

Manufacturing method of package

Methods and systems of forming metal interconnect layers using engi...

Display device and method for manufacturing display device

Semiconductor device and method

Single-shot encapsulation

Method for removing resistor layer, and method of manufacturing sem...

Semiconductor package with front side and back side redistribution...

Patents Applicationslast 30 patents

METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

TRANSFER DEVICE AND TRANSFER METHOD

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...

SEPARATING APPARATUS, SEPARATING SYSTEM AND SEPARATING METHOD

ELECTRONIC DEVICE, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND M...

STRUCTURES AND METHODS FOR BONDING DIES

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

CHIP WET TRANSFER METHOD AND EQUIPMENT USING MAGNETIC FORCE

METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME

MEASUREMENT METHOD, PEELING METHOD, AND PEELING STRENGTH MEASURING...

Process for the Pulsed Laser Ejection of Multiple Epitaxial Structu...

OPTOELECTRONIC SYSTEM

Donor and Transfer Method of Light Emitting Diode Using the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

DIE STRUCTURES AND METHODS OF FORMING THE SAME

PACKAGE BODY AND PREPARATION METHOD THEREFOR

SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...

RECEPTOR SUBSTRATE, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TR...

MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...

SEMICONDUCTOR DEVICE AND METHOD OF MAKING