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Stacked via structure
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Patent number 11,973,023
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Issue date Apr 30, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 11,973,042
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Issue date Apr 30, 2024
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Samsung Electronics Co., Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
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Package structure
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Patent number 11,955,459
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Issue date Apr 9, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Shu-Hang Liao
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H01 - BASIC ELECTRIC ELEMENTS
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-
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Package-on-package device
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Patent number 11,955,433
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Issue date Apr 9, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Ming-Fa Chen
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H01 - BASIC ELECTRIC ELEMENTS
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Package structure
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Patent number 11,948,896
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Issue date Apr 2, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Tsung-Fu Tsai
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package and method
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Patent number 11,948,890
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Issue date Apr 2, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Shih-Hao Tseng
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H01 - BASIC ELECTRIC ELEMENTS
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Manufacturing method of LED display
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Patent number 11,942,352
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Issue date Mar 26, 2024
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Industry-Academic Cooperation Foundation, Yonsei University
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Dahl Young Khang
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package and method
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Patent number 11,942,464
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Issue date Mar 26, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Hao-Jan Pei
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H01 - BASIC ELECTRIC ELEMENTS
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Resin applying machine
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Patent number 11,942,346
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Issue date Mar 26, 2024
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Disco Corporation
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Yoshikuni Migiyama
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H01 - BASIC ELECTRIC ELEMENTS
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