using test structures on, or modifications of, the card under test, made for the purpose of testing

Industry

CPC
G01R31/2818

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Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Current Industry

G01R31/2818using test structures on, or modifications of, the card under test, made for the purpose of testing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Module type sensor for detecting voltage and current of radio frequ...
- Patent number 12,228,605
- Issue date Feb 18, 2025
- NEWPOWERPLASMA CO., LTD.
- Jinjoong Kim
- G01 - MEASURING TESTING
Information Patent Grant
Flexible sideband support systems and methods
- Patent number 12,203,978
- Issue date Jan 21, 2025
- Advantest Corporation
- Srdjan Malisic
- G01 - MEASURING TESTING
Information Patent Grant
System of performing boundary scan test on pin through test point a...
- Patent number 12,025,660
- Issue date Jul 2, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Qiu-Yue Duan
- G01 - MEASURING TESTING
Information Patent Grant
Contact terminal, inspection jig, and inspection device
- Patent number 12,013,416
- Issue date Jun 18, 2024
- Nidec-Read Corporation
- Michio Kaida
- G01 - MEASURING TESTING
Information Patent Grant
Systems, methods and devices for high-speed input/output margin tes...
- Patent number 11,940,483
- Issue date Mar 26, 2024
- Tektronix, Inc.
- Sam J. Strickling
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board and method and device related to the same
- Patent number 11,899,055
- Issue date Feb 13, 2024
- Shanghai AVIC OPTO Electronics Co., Ltd.
- Pengfei Qiu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip-stacked semiconductor package and method of manufacturing same
- Patent number 11,869,818
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit mother board and detection method thereof
- Patent number 11,871,511
- Issue date Jan 9, 2024
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible sideband support systems and methods
- Patent number 11,733,290
- Issue date Aug 22, 2023
- Advantest Corporation
- Srdjan Malisic
- G01 - MEASURING TESTING
Information Patent Grant
Apparatuses for characterizing system channels and associated metho...
- Patent number 11,728,001
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Markus H. Geiger
- G11 - INFORMATION STORAGE
Information Patent Grant
Indicating a probing target for a fabricated electronic circuit
- Patent number 11,714,121
- Issue date Aug 1, 2023
- Tektronix, Inc.
- David Everett Burgess
- G01 - MEASURING TESTING
Information Patent Grant
Buried electrical debug access port
- Patent number 11,700,696
- Issue date Jul 11, 2023
- Intel Corporation
- Florence R. Neumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for identifying PCB core-layer properties
- Patent number 11,644,501
- Issue date May 9, 2023
- International Business Machines Corporation
- Tao Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-situ solder joint crack detection
- Patent number 11,513,150
- Issue date Nov 29, 2022
- Dell Products L.P.
- Bhyrav Mutnury
- G01 - MEASURING TESTING
Information Patent Grant
Scalable infield scan coverage for multi-chip module for functional...
- Patent number 11,506,702
- Issue date Nov 22, 2022
- Intel Corporation
- Asad Azam
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for estimating degradation of a wire-bonded power semi-condu...
- Patent number 11,474,146
- Issue date Oct 18, 2022
- Mitsubishi Electric Corporation
- Nicolas Degrenne
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for detecting an electrical fault in a printed...
- Patent number 11,448,687
- Issue date Sep 20, 2022
- GE Aviation Systems Limited
- David Alan Elliott
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Chip-stacked semiconductor package and method of manufacturing same
- Patent number 11,328,966
- Issue date May 10, 2022
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for on-board detection of potential faults in a s...
- Patent number 11,300,606
- Issue date Apr 12, 2022
- STMicroelectronics (Rousset) SAS
- Nicolas Cordier
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board performance evaluation techniques
- Patent number 11,300,605
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Layne A. Berge
- G01 - MEASURING TESTING
Information Patent Grant
Method for faster testing of manufactured PCB, apparatus, system, a...
- Patent number 11,215,659
- Issue date Jan 4, 2022
- HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
- Meng-Chu Chang
- G01 - MEASURING TESTING
Information Patent Grant
Electrical connection device with a short-circuit wiring pattern th...
- Patent number 11,209,460
- Issue date Dec 28, 2021
- Kabushiki Kaisha Nihon Micronics
- Tatsuya Ito
- G01 - MEASURING TESTING
Information Patent Grant
Display device and inspecting method therefor
- Patent number 11,195,440
- Issue date Dec 7, 2021
- Samsung Display Co., Ltd.
- Kwang Sae Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Printed circuit board signal layer testing
- Patent number 11,191,152
- Issue date Nov 30, 2021
- Hewlett Packard Enterprise Development LP
- Elene Chobanyan
- G01 - MEASURING TESTING
Information Patent Grant
Stiffener and probe card including the same
- Patent number 11,137,442
- Issue date Oct 5, 2021
- Samsung Electronics Co., Ltd.
- Sang-Ik Lee
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer wiring base plate and probe card using the same
- Patent number 11,099,227
- Issue date Aug 24, 2021
- Kabushiki Kaisha Nihon Micronics
- Noboru Otabe
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board with a bent connecting section and method for...
- Patent number 11,067,622
- Issue date Jul 20, 2021
- Vitesco Technologies GmbH
- Detlev Bagung
- G01 - MEASURING TESTING
Information Patent Grant
Buried electrical debug access port
- Patent number 11,064,612
- Issue date Jul 13, 2021
- Intel Corporation
- Florence R. Pon
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board with contacting arrangement
- Patent number 11,002,785
- Issue date May 11, 2021
- Endress + Hauser Flowtec AG
- Thomas Böhler
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for in-silicon measurement of printed circuit b...
- Patent number 10,999,922
- Issue date May 4, 2021
- Dell Products L.P.
- Charles Ziegler
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTOR MOUNTED TO BRITTLE SUBSTRATE
- Publication number 20250044344
- Publication date Feb 6, 2025
- Tektronix, Inc.
- Forest E. Kernan
- G01 - MEASURING TESTING
Information Patent Application
CHANNEL IMPEDANCE MEASUREMENT INSTRUMENT
- Publication number 20250004038
- Publication date Jan 2, 2025
- Dell Products L.P.
- Sandor Farkas
- G01 - MEASURING TESTING
Information Patent Application
Flexible Sideband Support Systems and Methods
- Publication number 20230400505
- Publication date Dec 14, 2023
- Srdjan Malisic
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR, CIRCUIT DEVICE AND PR...
- Publication number 20230271424
- Publication date Aug 31, 2023
- Hangzhou Chipjet Technology Co., LTD.
- Shan Luo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SOLDERLESS HIGH CURRENT, HIGH VOLTAGE, HIGH BANDWIDTH TEST FIXTURE
- Publication number 20230251311
- Publication date Aug 10, 2023
- KEITHLEY INSTRUMENTS, LLC
- Gregory Sobolewski
- G01 - MEASURING TESTING
Information Patent Application
MODULE TYPE SENSOR FOR DETECTING VOLTAGE AND CURRENT OF RADIO FREQU...
- Publication number 20230160946
- Publication date May 25, 2023
- Newpowerplasma Co., Ltd.
- Jinjoong KIM
- G01 - MEASURING TESTING
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20220262689
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD AND DEVICE RELATED TO THE SAME
- Publication number 20220214394
- Publication date Jul 7, 2022
- Shanghai Avic Opto Electronics Co., Ltd.
- Pengfei QIU
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CONTACT TERMINAL, INSPECTION JIG, AND INSPECTION DEVICE
- Publication number 20220155346
- Publication date May 19, 2022
- NIDEC-READ CORPORATION
- Michio KAIDA
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR IDENTIFYING PCB CORE-LAYER PROPERTIES
- Publication number 20220091181
- Publication date Mar 24, 2022
- International Business Machines Corporation
- Tao Song
- G01 - MEASURING TESTING
Information Patent Application
INDICATING A PROBING TARGET FOR A FABRICATED ELECTRONIC CIRCUIT
- Publication number 20220026483
- Publication date Jan 27, 2022
- Tektronix, Inc.
- David Everett Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS AND DEVICES FOR HIGH-SPEED INPUT/OUTPUT MARGIN TES...
- Publication number 20210405108
- Publication date Dec 30, 2021
- Tektronix, Inc.
- Sam J. Strickling
- G01 - MEASURING TESTING
Information Patent Application
Flexible Sideband Support Systems and Methods
- Publication number 20210302491
- Publication date Sep 30, 2021
- Srdjan Malisic
- G01 - MEASURING TESTING
Information Patent Application
BURIED ELECTRICAL DEBUG ACCESS PORT
- Publication number 20210298183
- Publication date Sep 23, 2021
- Intel Corporation
- Florence R. PON
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FASTER TESTING OF MANUFACTURED PCB, APPARATUS, SYSTEM, A...
- Publication number 20210190853
- Publication date Jun 24, 2021
- HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO.,LTD.
- MENG-CHU CHANG
- G01 - MEASURING TESTING
Information Patent Application
TEXTURED TEST PADS FOR PRINTED CIRCUIT BOARD TESTING
- Publication number 20210120667
- Publication date Apr 22, 2021
- SEAGATE TECHNOLOGY LLC
- Michael Richard Fabry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCALABLE INFIELD SCAN COVERAGE FOR MULTI-CHIP MODULE FOR FUCTIONAL...
- Publication number 20210003629
- Publication date Jan 7, 2021
- Intel Corporation
- Asad Azam
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR ESTIMATING DEGRADATION
- Publication number 20200408830
- Publication date Dec 31, 2020
- Mitsubishi Electric Corporation
- Nicolas DEGRENNE
- G01 - MEASURING TESTING
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20200411393
- Publication date Dec 31, 2020
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- G01 - MEASURING TESTING
Information Patent Application
MULTILAYER WIRING BASE PLATE AND PROBE CARD USING THE SAME
- Publication number 20200400739
- Publication date Dec 24, 2020
- Kabushiki Kaisha Nihon Micronics
- Noboru OTABE
- G01 - MEASURING TESTING
Information Patent Application
TEXTURED TEST PADS FOR PRINTED CIRCUIT BOARD TESTING
- Publication number 20200383203
- Publication date Dec 3, 2020
- SEAGATE TECHNOLOGY LLC
- Michael Richard Fabry
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND DEVICE FOR ON-BOARD DETECTION OF POTENTIAL FAULTS IN A S...
- Publication number 20200271716
- Publication date Aug 27, 2020
- STMicroelectronics (Rousset) SAS
- Nicolas CORDIER
- G01 - MEASURING TESTING
Information Patent Application
STIFFENER AND PROBE CARD INCLUDING THE SAME
- Publication number 20200256916
- Publication date Aug 13, 2020
- Samsung Electronics Co., Ltd.
- Sang-lk LEE
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD SIGNAL LAYER TESTING
- Publication number 20200236777
- Publication date Jul 23, 2020
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Elene Chobanyan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACK-DRILLED VIA PROBING TECHNIQUES
- Publication number 20200146194
- Publication date May 7, 2020
- International Business Machines Corporation
- LAYNE A. BERGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION DEVICE
- Publication number 20200124640
- Publication date Apr 23, 2020
- Kabushiki Kaisha Nihon Micronics
- Tatsuya ITO
- G01 - MEASURING TESTING
Information Patent Application
SHAPE CONFORMABLE CAPACITIVE COUPLER
- Publication number 20200064395
- Publication date Feb 27, 2020
- KEYSIGHT TECHNOLOGIES, INC.
- Choon Kait Andrew Tek
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
FAILURE PREDICTION DEVICE AND CIRCUIT BOARD USING THE SAME
- Publication number 20200049758
- Publication date Feb 13, 2020
- Mitsubishi Electric Corporation
- Nobuaki ANDO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD PERFORMANCE EVALUATION TECHNIQUES
- Publication number 20190361069
- Publication date Nov 28, 2019
- International Business Machines Corporation
- LAYNE A. BERGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR ESTIMATING LEVEL OF DAMAGE OR LIFETIME EXPECT...
- Publication number 20190331729
- Publication date Oct 31, 2019
- Mitsubishi Electric Corporation
- Nicolas DEGRENNE
- G01 - MEASURING TESTING

using test structures on, or modifications of, the card under test, made for the purpose of testing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Module type sensor for detecting voltage and current of radio frequ...

Flexible sideband support systems and methods

System of performing boundary scan test on pin through test point a...

Contact terminal, inspection jig, and inspection device

Systems, methods and devices for high-speed input/output margin tes...

Circuit board and method and device related to the same

Chip-stacked semiconductor package and method of manufacturing same

Flexible circuit mother board and detection method thereof

Flexible sideband support systems and methods

Apparatuses for characterizing system channels and associated metho...

Indicating a probing target for a fabricated electronic circuit

Buried electrical debug access port

Method for identifying PCB core-layer properties

In-situ solder joint crack detection

Scalable infield scan coverage for multi-chip module for functional...

Method for estimating degradation of a wire-bonded power semi-condu...

Method and apparatus for detecting an electrical fault in a printed...

Chip-stacked semiconductor package and method of manufacturing same

Method and device for on-board detection of potential faults in a s...

Printed circuit board performance evaluation techniques

Method for faster testing of manufactured PCB, apparatus, system, a...

Electrical connection device with a short-circuit wiring pattern th...

Display device and inspecting method therefor

Printed circuit board signal layer testing

Stiffener and probe card including the same

Multilayer wiring base plate and probe card using the same

Printed circuit board with a bent connecting section and method for...

Buried electrical debug access port

Printed circuit board with contacting arrangement

Systems and methods for in-silicon measurement of printed circuit b...

Patents Applicationslast 30 patents

ELECTRICAL CONNECTOR MOUNTED TO BRITTLE SUBSTRATE

CHANNEL IMPEDANCE MEASUREMENT INSTRUMENT

Flexible Sideband Support Systems and Methods

CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR, CIRCUIT DEVICE AND PR...

SOLDERLESS HIGH CURRENT, HIGH VOLTAGE, HIGH BANDWIDTH TEST FIXTURE

MODULE TYPE SENSOR FOR DETECTING VOLTAGE AND CURRENT OF RADIO FREQU...

CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

CIRCUIT BOARD AND METHOD AND DEVICE RELATED TO THE SAME

CONTACT TERMINAL, INSPECTION JIG, AND INSPECTION DEVICE

METHOD FOR IDENTIFYING PCB CORE-LAYER PROPERTIES

INDICATING A PROBING TARGET FOR A FABRICATED ELECTRONIC CIRCUIT

SYSTEMS, METHODS AND DEVICES FOR HIGH-SPEED INPUT/OUTPUT MARGIN TES...

Flexible Sideband Support Systems and Methods

BURIED ELECTRICAL DEBUG ACCESS PORT

METHOD FOR FASTER TESTING OF MANUFACTURED PCB, APPARATUS, SYSTEM, A...

TEXTURED TEST PADS FOR PRINTED CIRCUIT BOARD TESTING

SCALABLE INFIELD SCAN COVERAGE FOR MULTI-CHIP MODULE FOR FUCTIONAL...

METHOD FOR ESTIMATING DEGRADATION

CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

MULTILAYER WIRING BASE PLATE AND PROBE CARD USING THE SAME

TEXTURED TEST PADS FOR PRINTED CIRCUIT BOARD TESTING

METHOD AND DEVICE FOR ON-BOARD DETECTION OF POTENTIAL FAULTS IN A S...

STIFFENER AND PROBE CARD INCLUDING THE SAME

PRINTED CIRCUIT BOARD SIGNAL LAYER TESTING

BACK-DRILLED VIA PROBING TECHNIQUES

ELECTRICAL CONNECTION DEVICE

SHAPE CONFORMABLE CAPACITIVE COUPLER

FAILURE PREDICTION DEVICE AND CIRCUIT BOARD USING THE SAME

PRINTED CIRCUIT BOARD PERFORMANCE EVALUATION TECHNIQUES

METHOD AND DEVICE FOR ESTIMATING LEVEL OF DAMAGE OR LIFETIME EXPECT...