using the surface tension of fluid solder to align the elements

Industry

CPC
G02B6/4232

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4232using the surface tension of fluid solder to align the elements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber optic connector
- Patent number 12,117,660
- Issue date Oct 15, 2024
- Knowledge Development for POF, S.L.
- David Ortiz Rojo
- G02 - OPTICS
Information Patent Grant
Optoelectronic ball grid array package with fiber
- Patent number 11,892,690
- Issue date Feb 6, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical and thermal interface for photonic integrated circuits
- Patent number 11,789,219
- Issue date Oct 17, 2023
- OpenLight Photonics, Inc.
- Gregory Alan Fish
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Photonic die alignment
- Patent number 11,693,196
- Issue date Jul 4, 2023
- Analog Photonics LLC
- Diedrik Vermeulen
- G02 - OPTICS
Information Patent Grant
Techniques for laser alignment in photonic integrated circuits
- Patent number 11,658,459
- Issue date May 23, 2023
- MACOM Technology Solutions Holdings, Inc.
- Roe Hemenway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,435,523
- Issue date Sep 6, 2022
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic ball grid array package with fiber
- Patent number 11,360,278
- Issue date Jun 14, 2022
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integration for photonic integrated circuits
- Patent number 11,340,400
- Issue date May 24, 2022
- Massachusetts Institute of Technology
- Boris Kharas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor optical device
- Patent number 11,336,072
- Issue date May 17, 2022
- Lumentum Japan, Inc.
- Koichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-aligned optical socket with interposer reference and methods...
- Patent number 11,275,222
- Issue date Mar 15, 2022
- Hewlett Packard Enterprise Development LP
- Paul Kessler Rosenberg
- G02 - OPTICS
Information Patent Grant
Photonic interface for electronic circuit
- Patent number 11,256,046
- Issue date Feb 22, 2022
- Nokia Solutions and Networks Oy
- Michael J. Hochberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic die alignment
- Patent number 11,237,344
- Issue date Feb 1, 2022
- Analog Photonics LLC
- Diedrik Vermeulen
- G02 - OPTICS
Information Patent Grant
Glass-as-a-platform (GaaP)-based photonic assemblies comprising sha...
- Patent number 11,199,671
- Issue date Dec 14, 2021
- Hewlett Packard Enterprise Development LP
- Kevin B. Leigh
- G02 - OPTICS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,181,704
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-pinning metal pads for electronic components
- Patent number 11,166,381
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Yves Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical and thermal interface for photonic integrated circuits
- Patent number 11,150,423
- Issue date Oct 19, 2021
- Aurrion, Inc.
- Gregory Alan Fish
- G02 - OPTICS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,112,570
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wavelength division multiplexing optical module
- Patent number 11,002,926
- Issue date May 11, 2021
- Hewlett Packard Enterprise Development LP
- Sagi Varghese Mathai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device and manufacturing method of optical device
- Patent number 10,976,509
- Issue date Apr 13, 2021
- Fujitsu Optical Components Limited
- Kohei Shibata
- G02 - OPTICS
Information Patent Grant
Silicon photonic package structure
- Patent number 10,976,488
- Issue date Apr 13, 2021
- Industrial Technology Research Institute
- Wei-Yen Chen
- G02 - OPTICS
Information Patent Grant
Optical-electrical interposers
- Patent number 10,859,776
- Issue date Dec 8, 2020
- The Regents of the University of California
- Sung-Joo Ben Yoo
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 10,840,231
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Hsieh Lai
- G02 - OPTICS
Information Patent Grant
Optoelectronic circuit having one or more double-sided substrates
- Patent number 10,830,949
- Issue date Nov 10, 2020
- Nokia of America Corporation
- Yee L. Low
- G02 - OPTICS
Information Patent Grant
Optical switch controllable by vertical motion MEMS structure
- Patent number 10,823,913
- Issue date Nov 3, 2020
- The Charles Stark Draper Laboratory, Inc.
- Michael G. Moebius
- G02 - OPTICS
Information Patent Grant
Integrated circuit packages including an optical redistribution layer
- Patent number 10,816,742
- Issue date Oct 27, 2020
- Intel IP Corporation
- Georg Seidemann
- G02 - OPTICS
Information Patent Grant
Optically aligned hybrid semiconductor device and method
- Patent number 10,678,005
- Issue date Jun 9, 2020
- Elenion Technologies, LLC
- David Henry Kinghorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical interfaces with solder that passively aligns optical socket
- Patent number 10,678,006
- Issue date Jun 9, 2020
- Hewlett Packard Enterprise Development LP
- Paul Kessler Rosenberg
- G02 - OPTICS
Information Patent Grant
Optical and thermal interface for photonic integrated circuits
- Patent number 10,620,390
- Issue date Apr 14, 2020
- Aurrion, Inc.
- Gregory Alan Fish
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20240280772
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
TECHNIQUES FOR LASER ALIGNMENT IN PHOTONIC INTEGRATED CIRCUITS
- Publication number 20230261432
- Publication date Aug 17, 2023
- MACOM Technology Solutions Holdings, Inc.
- Roe HEMENWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20230251441
- Publication date Aug 10, 2023
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CIRCUIT WITH OPTICAL PORT IN SIDEWALL
- Publication number 20230092060
- Publication date Mar 23, 2023
- Intel Corporation
- Eric J.M. Moret
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230089494
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230092821
- Publication date Mar 23, 2023
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Application
FIBER OPTIC CONNECTOR
- Publication number 20230023827
- Publication date Jan 26, 2023
- KNOWLEDGE DEVELOPMENT FOR POF, S.L.
- David ORTIZ ROJO
- G02 - OPTICS
Information Patent Application
WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER
- Publication number 20220381974
- Publication date Dec 1, 2022
- The Research Foundation for the State University of New York
- Douglas COOLBAUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND METHOD FOR MANUFACTURING A BONDED STRUCTURE
- Publication number 20220317391
- Publication date Oct 6, 2022
- ams AG
- Jochen Kraft
- G02 - OPTICS
Information Patent Application
Photonic Die Alignment
- Publication number 20220107474
- Publication date Apr 7, 2022
- Analog Photonics LLC
- Diedrik Vermeulen
- G02 - OPTICS
Information Patent Application
OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS
- Publication number 20220003945
- Publication date Jan 6, 2022
- Aurrion, Inc.
- Gregory Alan Fish
- G02 - OPTICS
Information Patent Application
SOLDER-ALIGNED OPTICAL SOCKET WITH INTERPOSER REFERENCE AND METHODS...
- Publication number 20210341690
- Publication date Nov 4, 2021
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Paul Kessler Rosenberg
- G02 - OPTICS
Information Patent Application
GLASS-as-a-PLATFORM (GaaP)-BASED PHOTONIC ASSEMBLIES COMPRISING SHA...
- Publication number 20210325618
- Publication date Oct 21, 2021
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- KEVIN B. LEIGH
- G02 - OPTICS
Information Patent Application
WAVELENGTH DIVISION MULTIPLEXING OPTICAL MODULE
- Publication number 20210141171
- Publication date May 13, 2021
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Sagi Varghese Mathai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER
- Publication number 20200319403
- Publication date Oct 8, 2020
- The Research Foundation for the State University of New York
- Douglas COOLBAUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Die Alignment
- Publication number 20200292766
- Publication date Sep 17, 2020
- Analog Photonics LLC
- Diedrik Vermeulen
- G02 - OPTICS
Information Patent Application
HYBRID INTEGRATION FOR PHOTONIC INTEGRATED CIRCUITS
- Publication number 20200284978
- Publication date Sep 10, 2020
- Boris KHARAS
- G02 - OPTICS
Information Patent Application
OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS
- Publication number 20200209496
- Publication date Jul 2, 2020
- Aurrion, Inc.
- Gregory Alan Fish
- G02 - OPTICS
Information Patent Application
PHOTONIC INTERFACE FOR ELECTRONIC CIRCUIT
- Publication number 20200183103
- Publication date Jun 11, 2020
- Elenion Technologies, LLC
- Michael J. Hochberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20200150361
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20200150362
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder-Pinning Metal Pads for Electronic Components
- Publication number 20200100369
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Yves Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20200083208
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Hsieh Lai
- G02 - OPTICS
Information Patent Application
SILICON PHOTONIC SOLDER REFLOWABLE ASSEMBLY
- Publication number 20200049909
- Publication date Feb 13, 2020
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Sagi Mathai
- G02 - OPTICS
Information Patent Application
Method and System to Passively Align and Attach Fiber Array to Lase...
- Publication number 20200003955
- Publication date Jan 2, 2020
- Indiana Integrated Circuits, LLC
- Jason M. KULICK
- G02 - OPTICS
Information Patent Application
LASER ASSEMBLY PACKAGING FOR SILICON PHOTONIC INTERCONNECTS
- Publication number 20200003971
- Publication date Jan 2, 2020
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Ashkan Seyedi
- G02 - OPTICS
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20200003976
- Publication date Jan 2, 2020
- SAMTEC, INC.
- Eric J. ZBINDEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED OPTOELECTRONIC MODULE
- Publication number 20190384022
- Publication date Dec 19, 2019
- Artilux Inc.
- Shu-Lu CHEN
- G02 - OPTICS
Information Patent Application
PHOTONIC ENGINE PLATFORM UTILIZING EMBEDDED WAFER LEVEL PACKAGING I...
- Publication number 20190324223
- Publication date Oct 24, 2019
- Intel Corporation
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL-ELECTRICAL INTERPOSERS
- Publication number 20190310433
- Publication date Oct 10, 2019
- The Regents of the University of California
- Sung-Joo Ben Yoo
- G02 - OPTICS

using the surface tension of fluid solder to align the elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transceiver and interface for IC package

Fiber optic connector

Optoelectronic ball grid array package with fiber

Wafer scale bonded active photonics interposer

Optical and thermal interface for photonic integrated circuits

Photonic die alignment

Techniques for laser alignment in photonic integrated circuits

Wafer scale bonded active photonics interposer

Optoelectronic ball grid array package with fiber

Hybrid integration for photonic integrated circuits

Semiconductor optical device

Solder-aligned optical socket with interposer reference and methods...

Photonic interface for electronic circuit

Photonic die alignment

Glass-as-a-platform (GaaP)-based photonic assemblies comprising sha...

Fabrication method of high aspect ratio solder bumping with stud bu...

Solder-pinning metal pads for electronic components

Optical and thermal interface for photonic integrated circuits

Fabrication method of high aspect ratio solder bumping with stud bu...

Wavelength division multiplexing optical module

Optical device and manufacturing method of optical device

Silicon photonic package structure

Optical-electrical interposers

Semiconductor device and method of manufacturing

Optoelectronic circuit having one or more double-sided substrates

Optical switch controllable by vertical motion MEMS structure

Integrated circuit packages including an optical redistribution layer

Optically aligned hybrid semiconductor device and method

Optical interfaces with solder that passively aligns optical socket

Optical and thermal interface for photonic integrated circuits

Patents Applicationslast 30 patents

Photonic Semiconductor Device and Method of Manufacture

TECHNIQUES FOR LASER ALIGNMENT IN PHOTONIC INTEGRATED CIRCUITS

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

OPTICAL CIRCUIT WITH OPTICAL PORT IN SIDEWALL

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

FIBER OPTIC CONNECTOR

WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER

BONDED STRUCTURE AND METHOD FOR MANUFACTURING A BONDED STRUCTURE

Photonic Die Alignment

OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS

SOLDER-ALIGNED OPTICAL SOCKET WITH INTERPOSER REFERENCE AND METHODS...

GLASS-as-a-PLATFORM (GaaP)-BASED PHOTONIC ASSEMBLIES COMPRISING SHA...

WAVELENGTH DIVISION MULTIPLEXING OPTICAL MODULE

WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER

Photonic Die Alignment

HYBRID INTEGRATION FOR PHOTONIC INTEGRATED CIRCUITS

OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS

PHOTONIC INTERFACE FOR ELECTRONIC CIRCUIT

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

Solder-Pinning Metal Pads for Electronic Components

Semiconductor Device and Method of Manufacturing

SILICON PHOTONIC SOLDER REFLOWABLE ASSEMBLY

Method and System to Passively Align and Attach Fiber Array to Lase...

LASER ASSEMBLY PACKAGING FOR SILICON PHOTONIC INTERCONNECTS

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

INTEGRATED OPTOELECTRONIC MODULE

PHOTONIC ENGINE PLATFORM UTILIZING EMBEDDED WAFER LEVEL PACKAGING I...

OPTICAL-ELECTRICAL INTERPOSERS