using trench refilling with dielectric materials

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CPC
H01L21/76224

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76224using trench refilling with dielectric materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,328,903
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 12,328,963
- Issue date Jun 10, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacture method thereof
- Patent number 12,324,198
- Issue date Jun 3, 2025
- Yangtze Memory Technologies Co., Ltd.
- Teng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating physically unclonable function device
- Patent number 12,322,645
- Issue date Jun 3, 2025
- United Microelectronics Corp.
- Ping-Chia Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including pillars with partially-circular u...
- Patent number 12,324,154
- Issue date Jun 3, 2025
- Lodestar Licensing Group LLC
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating Fin-type field-effect transistor device havin...
- Patent number 12,324,224
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fork sheet device with better electrostatic control
- Patent number 12,324,234
- Issue date Jun 3, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,315,758
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Cheng Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,315,759
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,308,248
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an isolation region having an edge b...
- Patent number 12,308,279
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Te-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structure with cutting depth c...
- Patent number 12,310,096
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded ferroelectric memory in high-k first technology
- Patent number 12,302,584
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a dummy section
- Patent number 12,300,543
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structure with a composite stress layer and reduced fin buck...
- Patent number 12,302,611
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,302,582
- Issue date May 13, 2025
- Kioxia Corporation
- Hidenobu Nagashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling openings by combining non-flowable and flowable processes
- Patent number 12,300,533
- Issue date May 13, 2025
- Intel Corporation
- Ebony L. Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with backside trench for metal gate definition
- Patent number 12,302,630
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming a deep trench isolation structure between ph...
- Patent number 12,293,940
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation having three portions with different materials, an...
- Patent number 12,295,161
- Issue date May 6, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Rong-Ting Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors having increased effective channel width
- Patent number 12,289,924
- Issue date Apr 29, 2025
- OmniVision Technologies, Inc.
- Chiao-Ti Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal wrap-around contacts for semiconductor devices
- Patent number 12,284,820
- Issue date Apr 22, 2025
- Tokyo Electron Limited
- Hiroaki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,284,827
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Gyu-Hwan Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,279,455
- Issue date Apr 15, 2025
- Vanguard International Semiconductor Corporation
- Syed-Sarwar Imam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with isolation structure
- Patent number 12,278,235
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shi-Ning Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a fin with minimal length between two single...
- Patent number 12,278,265
- Issue date Apr 15, 2025
- United Microelectronics Corp.
- Chien-Heng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 12,278,180
- Issue date Apr 15, 2025
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure and semiconductor s...
- Patent number 12,278,137
- Issue date Apr 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhugen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing memory device with first and second isolati...
- Patent number 12,278,138
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with helmet structure between two semiconducto...
- Patent number 12,278,236
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOCAL BACKSIDE CONTACT ISOLATION FOR MERGED BACKSIDE CONTACT PATTER...
- Publication number 20250194152
- Publication date Jun 12, 2025
- International Business Machines Corporation
- GIDEON OYIBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS
- Publication number 20250194210
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE PLACEHOLDER DIELECTRIC FILL
- Publication number 20250194213
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250194227
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STI REGION
- Publication number 20250194085
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Kunihiro Tsubomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PMOS TRANSISTOR AND METHOD OF PREPARING PMOS TRANSISTOR, CMOS CIRCU...
- Publication number 20250194187
- Publication date Jun 12, 2025
- SwaySure Technology Co., Ltd.
- MING-HUNG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOWERING GATE ASPECT RATIO ON STI REGION
- Publication number 20250191966
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON AND SILICON GERMANIUM NANOWIRE STRUCTURES
- Publication number 20250185316
- Publication date Jun 5, 2025
- SONY GROUP CORPORATION
- Kelin J. Kuhn
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250185281
- Publication date Jun 5, 2025
- RENESAS ELECTRONICS CORPORATION
- Makoto KOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING OF TRENCHES IN A SUBSTRATE
- Publication number 20250174489
- Publication date May 29, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Thierry BERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ACTIVE AREAS AND METHOD FOR MANUFACT...
- Publication number 20250174551
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING FOR SEMICONDUCTOR DEVICE
- Publication number 20250176216
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...
- Publication number 20250176240
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Tai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEV...
- Publication number 20250169283
- Publication date May 22, 2025
- Canon Kabushiki Kaisha
- HIROMASA TSUBOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED BACKSIDE CONTACT ISOLATION
- Publication number 20250169172
- Publication date May 22, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOUNDARY DESIGN TO REDUCE MEMORY ARRAY EDGE CMP DISHING EFFECT
- Publication number 20250169076
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250169169
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Chun-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME
- Publication number 20250157915
- Publication date May 15, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- ANTHONY JEREMY VILLALON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Horizontal Hall Device and Preparation Method
- Publication number 20250155525
- Publication date May 15, 2025
- SOUTHEAST UNIVERSITY
- Long ZHANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157852
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyunchul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE ISOLATION FEATURES
- Publication number 20250159918
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING STEPS AND RELATED METHODS
- Publication number 20250157950
- Publication date May 15, 2025
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...
- Publication number 20250159965
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Publication number 20250149407
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20250149294
- Publication date May 8, 2025
- Hitachi High-Tech Corporation
- Juhyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH VERTICAL TRANSISTOR OVER UNDERG...
- Publication number 20250149375
- Publication date May 8, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-PHOTON AVALANCHE DIODES WITH HYBRID TRENCH ISOLATION STRUCTURES
- Publication number 20250142983
- Publication date May 1, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Ping Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED INTERCONNECT TRAVERSING TRENCH ISOLATION
- Publication number 20250140692
- Publication date May 1, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Kiril B. Borisov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250142875
- Publication date May 1, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS

using trench refilling with dielectric materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and methods of manufacturing thereof

Semiconductor device and manufacturing method therefor

Semiconductor device and manufacture method thereof

Method for fabricating physically unclonable function device

Microelectronic devices including pillars with partially-circular u...

Method of fabricating Fin-type field-effect transistor device havin...

Fork sheet device with better electrostatic control

Semiconductor device and method

FinFET device and method of forming same

Semiconductor device and method of manufacture

Semiconductor device including an isolation region having an edge b...

Method for fabricating semiconductor structure with cutting depth c...

Embedded ferroelectric memory in high-k first technology

Method for manufacturing a semiconductor device having a dummy section

FinFET structure with a composite stress layer and reduced fin buck...

Semiconductor memory device

Filling openings by combining non-flowable and flowable processes

Integrated circuit with backside trench for metal gate definition

Techniques for forming a deep trench isolation structure between ph...

Trench isolation having three portions with different materials, an...

Transistors having increased effective channel width

Dual metal wrap-around contacts for semiconductor devices

Semiconductor devices

Semiconductor device and method of fabricating the same

Semiconductor device with isolation structure

Method for fabricating a fin with minimal length between two single...

Memory arrays and methods used in forming a memory array

Manufacturing method of semiconductor structure and semiconductor s...

Method of manufacturing memory device with first and second isolati...

Semiconductor device with helmet structure between two semiconducto...

Patents Applicationslast 30 patents

LOCAL BACKSIDE CONTACT ISOLATION FOR MERGED BACKSIDE CONTACT PATTER...

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS

BACKSIDE PLACEHOLDER DIELECTRIC FILL

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE HAVING STI REGION

PMOS TRANSISTOR AND METHOD OF PREPARING PMOS TRANSISTOR, CMOS CIRCU...

LOWERING GATE ASPECT RATIO ON STI REGION

SILICON AND SILICON GERMANIUM NANOWIRE STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FORMING OF TRENCHES IN A SUBSTRATE

SEMICONDUCTOR STRUCTURE HAVING ACTIVE AREAS AND METHOD FOR MANUFACT...

SEAL RING FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...

LIGHT-EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEV...

MERGED BACKSIDE CONTACT ISOLATION

BOUNDARY DESIGN TO REDUCE MEMORY ARRAY EDGE CMP DISHING EFFECT

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

STRUCTURES INCLUDING TRENCH CAPACITORS AND METHODS OF FORMING THE SAME

Horizontal Hall Device and Preparation Method

SEMICONDUCTOR DEVICE

GATE ISOLATION FEATURES

SEMICONDUCTOR DEVICES COMPRISING STEPS AND RELATED METHODS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...

SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)

PLASMA PROCESSING METHOD

SEMICONDUCTOR DEVICE STRUCTURE WITH VERTICAL TRANSISTOR OVER UNDERG...

SINGLE-PHOTON AVALANCHE DIODES WITH HYBRID TRENCH ISOLATION STRUCTURES

BURIED INTERCONNECT TRAVERSING TRENCH ISOLATION

Assemblies Having Conductive Structures Along Pillars of Semiconduc...