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CPC
H01L2224/78102
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/78102
Vacuum chamber
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Patents Grants
last 30 patents
Information
Patent Grant
Method for manufacturing perovskite solar cell module and perovskit...
Patent number
11,114,252
Issue date
Sep 7, 2021
CPC CORPORATION, TAIWAN
Kuan-Chieh Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a functional inlay
Patent number
9,780,062
Issue date
Oct 3, 2017
Assa Abloy AB
Stephane Ayala
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
Arrangements and Method for Providing a Bond Connection
Publication number
20190312008
Publication date
Oct 10, 2019
INFINEON TECHNOLOGIES AG
Florian Eacock
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A FUNCTIONAL INLAY
Publication number
20170005066
Publication date
Jan 5, 2017
ASSA ABLOY AB
Stephane AYALA
G06 - COMPUTING CALCULATING COUNTING