Vacuum

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CPC
H01L2224/8509

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8509Vacuum

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor device with tensile stress and method of mak...
- Patent number 10,229,870
- Issue date Mar 12, 2019
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cortical interface for motor signal recording and sensory signal st...
- Patent number 10,137,303
- Issue date Nov 27, 2018
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,032,741
- Issue date Jul 24, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,905,497
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Takeshi Susaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,171,761
- Issue date Oct 27, 2015
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 9,136,174
- Issue date Sep 15, 2015
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged vertical power device comprising compressive stress and me...
- Patent number 9,093,437
- Issue date Jul 28, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the wafer-level integration of shape memory alloy wires
- Patent number 9,054,224
- Issue date Jun 9, 2015
- Senseair AB
- Stefan Braun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip semiconductor packages and assembly thereof
- Patent number 8,836,101
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient temperature ball bond
- Patent number 8,767,351
- Issue date Jul 1, 2014
- Seagate Technology LLC
- Leping Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 8,704,342
- Issue date Apr 22, 2014
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 8,633,102
- Issue date Jan 21, 2014
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of wirebonding that utilizes a gas flow within a capillary f...
- Patent number 8,485,418
- Issue date Jul 16, 2013
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically isolated vertical light emitting diode structure
- Patent number 8,309,979
- Issue date Nov 13, 2012
- PhotonStar LED Limited
- James Stuart McKenzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus with a textured capillary surface enabling h...
- Patent number 8,267,303
- Issue date Sep 18, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an LTCC substrate
- Patent number 8,250,748
- Issue date Aug 28, 2012
- Biotronik CRM Patent AG
- Dieter Schwanke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 8,237,268
- Issue date Aug 7, 2012
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printed circuit board and component package having the same
- Patent number 8,168,890
- Issue date May 1, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Moo-Hong Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for electrically connecting semiconductor circuit arran...
- Patent number 8,030,744
- Issue date Oct 4, 2011
- Infineon Technologies AG
- Thomas Laska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, electronic component including the lead frame, and manu...
- Patent number 7,993,980
- Issue date Aug 9, 2011
- Panasonic Corporation
- Toshiyuki Fukuda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor module and method for producing the same
- Patent number 7,986,034
- Issue date Jul 26, 2011
- Infineon Technologies, AG
- Alfred Kemper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding deflector for a wire bonder
- Patent number 7,918,378
- Issue date Apr 5, 2011
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for electrically connecting semiconductor circuit arran...
- Patent number 7,709,938
- Issue date May 4, 2010
- Infineon Technologies AG
- Thomas Laska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting die bonding film
- Patent number 7,611,926
- Issue date Nov 3, 2009
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing same
- Patent number 7,563,648
- Issue date Jul 21, 2009
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device having bonding pad of the...
- Patent number 7,331,737
- Issue date Feb 19, 2008
- NEC Electronics Corporation
- Mitsuru Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Initial ball forming method for wire bonding wire and wire bonding...
- Patent number 7,299,966
- Issue date Nov 27, 2007
- Kabushiki Kaisha Shinkawa
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317657
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230148306
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Motoki ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORTICAL INTERFACE FOR MOTOR SIGNAL RECORDING AND SENSORY SIGNAL ST...
- Publication number 20180345019
- Publication date Dec 6, 2018
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170323864
- Publication date Nov 9, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20140179063
- Publication date Jun 26, 2014
- Semiconductor Components Industries, LLC
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaged Vertical Power Device Comprising Compressive Stress and Me...
- Publication number 20140151717
- Publication date Jun 5, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device with Tensile Stress and Method of Mak...
- Publication number 20140151866
- Publication date Jun 5, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20140110829
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES
- Publication number 20130292856
- Publication date Nov 7, 2013
- SENSEAIR AB
- Stefan Braun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTER PACKAGES AND DEVICES HAVING IMPROVED WIRE BONDING AND...
- Publication number 20130193455
- Publication date Aug 1, 2013
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cortical Interface for Motor Signal Recording and Sensory Signal St...
- Publication number 20120296444
- Publication date Nov 22, 2012
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20120276693
- Publication date Nov 1, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE-BONDING FILM AND USE THEREOF
- Publication number 20120231583
- Publication date Sep 13, 2012
- Kenji ONISHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BO...
- Publication number 20120126379
- Publication date May 24, 2012
- Daisuke UENDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Multi-chip Semiconductor Packages and Assembly Thereof
- Publication number 20120074546
- Publication date Mar 29, 2012
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING...
- Publication number 20120031955
- Publication date Feb 9, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BON...
- Publication number 20120032354
- Publication date Feb 9, 2012
- National Semiconductor Corporation
- Ken Pham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANU...
- Publication number 20110291253
- Publication date Dec 1, 2011
- PANASONIC CORPORATION
- Toshiyuki FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND ME...
- Publication number 20110120614
- Publication date May 26, 2011
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME
- Publication number 20110062596
- Publication date Mar 17, 2011
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY F...
- Publication number 20110057018
- Publication date Mar 10, 2011
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRANGEMENT FOR ELECTRICALLY CONNECTING SEMICONDUCTOR CIRCUIT ARRAN...
- Publication number 20100213613
- Publication date Aug 26, 2010
- INFINEON TECHNOLOGIES AG
- Thomas Laska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY ISOLATED VERTICAL LIGHT EMITTING DIODE STRUCTURE
- Publication number 20100201280
- Publication date Aug 12, 2010
- PHOTONSTAR LED LIMITED
- James Stuart McKenzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100108359
- Publication date May 6, 2010
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY F...
- Publication number 20100065963
- Publication date Mar 18, 2010
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LTCC SUBSTRATE STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20100059255
- Publication date Mar 11, 2010
- Dieter SCHWANKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20100052125
- Publication date Mar 4, 2010
- SANYO ELECTRIC CO., LTD.
- Takeshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bonding apparatus

Packaged semiconductor device with tensile stress and method of mak...

Cortical interface for motor signal recording and sensory signal st...

Bonding wire for semiconductor device

Resin sealing type semiconductor device and method of manufacturing...

Module comprising a semiconductor chip

Resin sealing type semiconductor device and method of manufacturing...

Resin sealing type semiconductor device and method of manufacturing...

Packaged vertical power device comprising compressive stress and me...

Method for the wafer-level integration of shape memory alloy wires

Multi-chip semiconductor packages and assembly thereof

Ambient temperature ball bond

Resin sealing type semiconductor device and method of manufacturing...

Module comprising a semiconductor chip

Method of wirebonding that utilizes a gas flow within a capillary f...

Connecting wire and method for manufacturing same

Electrically isolated vertical light emitting diode structure

Wire bonding apparatus with a textured capillary surface enabling h...

Method for producing an LTCC substrate

Module comprising a semiconductor chip

Printed circuit board and component package having the same

Arrangement for electrically connecting semiconductor circuit arran...

Lead frame, electronic component including the lead frame, and manu...

Power semiconductor module and method for producing the same

Wire bonding deflector for a wire bonder

Arrangement for electrically connecting semiconductor circuit arran...

Thermosetting die bonding film

Semiconductor device package and method for manufacturing same

Method of forming a semiconductor device having bonding pad of the...

Initial ball forming method for wire bonding wire and wire bonding...

Patents Applicationslast 30 patents

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

BONDING WIRE FOR SEMICONDUCTOR DEVICES

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

CORTICAL INTERFACE FOR MOTOR SIGNAL RECORDING AND SENSORY SIGNAL ST...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

Packaged Vertical Power Device Comprising Compressive Stress and Me...

Packaged Semiconductor Device with Tensile Stress and Method of Mak...

Module Comprising a Semiconductor Chip

METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES

LIGHT EMITTER PACKAGES AND DEVICES HAVING IMPROVED WIRE BONDING AND...

Cortical Interface for Motor Signal Recording and Sensory Signal St...

Module Comprising a Semiconductor Chip

DIE-BONDING FILM AND USE THEREOF

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BO...

Multi-chip Semiconductor Packages and Assembly Thereof

WIRE BONDING METHOD AND CAPILLARY ENABLING HIGH-SPEED WEDGE BONDING...

WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BON...

LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANU...

THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND ME...

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY F...

ARRANGEMENT FOR ELECTRICALLY CONNECTING SEMICONDUCTOR CIRCUIT ARRAN...

ELECTRICALLY ISOLATED VERTICAL LIGHT EMITTING DIODE STRUCTURE

CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY F...

LTCC SUBSTRATE STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF

RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...