Vanadium (V) as principal constituent

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H01L2224/45672

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45672Vanadium (V) as principal constituent

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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Power semiconductor device, method of manufacturing the device and...
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- Issue date Jun 16, 2015
- NIPPON MICROMETAL CORPORATION
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Information Patent Application
AI WIRING MATERIAL
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CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
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