Vanadium [V] as principal constituent

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H01L2224/29372

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29372Vanadium [V] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...
- Publication number 20190371759
- Publication date Dec 5, 2019
- Hitachi Automotive Systems, Ltd.
- Takuya AOYAGI
- G01 - MEASURING TESTING
Information Patent Application
Nano-metal composite made by deposition from colloidal suspensions
- Publication number 20050127134
- Publication date Jun 16, 2005
- Guo-Quan Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR